Patents by Inventor Ssutzu Chen

Ssutzu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CHEMICAL MECHANICAL POLISHING CLEANING SYSTEM WITH TEMPERATURE CONTROL FOR DEFECT REDUCTION
    Publication number: 20230326736
    Abstract: A cleaning system includes at least one cleaning module configured to receive a substrate after a chemical mechanical polishing (CMP) process and to remove contaminants on the substrate using a cleaning solution. The cleaning system further includes a cleaning solution supply system configured to supply the cleaning solution to the at least one cleaning module. The cleaning solution supply system includes at least one temperature control system. The at least one temperature control system includes a heating device configured to heat the cleaning solution, a cooling device configured to cool the cleaning solution, a temperature sensor configured to monitor a temperature of the cleaning solution, and a temperature controller configured to control the heating device and the cooling device.
    Type: Application
    Filed: June 13, 2023
    Publication date: October 12, 2023
    Inventors: Ssutzu CHEN, Ying-Tsung CHEN, Ya-Ting TSAI, Gin-Chen HUANG, Kei-Wei CHEN
  • Chemical mechanical polishing cleaning system with temperature control for defect reduction
    Patent number: 11694889
    Abstract: A cleaning system includes at least one cleaning module configured to receive a substrate after a chemical mechanical polishing (CMP) process and to remove contaminants on the substrate using a cleaning solution. The cleaning system further includes a cleaning solution supply system configured to supply the cleaning solution to the at least one cleaning module. The cleaning solution supply system includes at least one temperature control system. The at least one temperature control system includes a heating device configured to heat the cleaning solution, a cooling device configured to cool the cleaning solution, a temperature sensor configured to monitor a temperature of the cleaning solution, and a temperature controller configured to control the heating device and the cooling device.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: July 4, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ssutzu Chen, Gin-Chen Huang, Ya-Ting Tsai, Ying-Tsung Chen, Kei-Wei Chen
  • CHEMICAL MECHANICAL POLISHING CLEANING SYSTEM WITH TEMPERATURE CONTROL FOR DEFECT REDUCTION
    Publication number: 20210272798
    Abstract: A cleaning system includes at least one cleaning module configured to receive a substrate after a chemical mechanical polishing (CMP) process and to remove contaminants on the substrate using a cleaning solution. The cleaning system further includes a cleaning solution supply system configured to supply the cleaning solution to the at least one cleaning module. The cleaning solution supply system includes at least one temperature control system. The at least one temperature control system includes a heating device configured to heat the cleaning solution, a cooling device configured to cool the cleaning solution, a temperature sensor configured to monitor a temperature of the cleaning solution, and a temperature controller configured to control the heating device and the cooling device.
    Type: Application
    Filed: March 2, 2020
    Publication date: September 2, 2021
    Inventors: Ssutzu Chen, Gin-Chen Huang, Ya-Ting Tsai, Ying-Tsung Chen, Kei-Wei Chen