Patents by Inventor Stéphane André Fouquay

Stéphane André Fouquay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9988528
    Abstract: The present invention relates to a hot-melt pressure-sensitive adhesive (HMPSA) composition. The composition includes: a) 25 to 50% of a styrene block copolymer chosen from the group comprising SIS, SIBS, SEBS and SEPS block copolymers; b) 35 to 75% of a compatible tackifying resin having a softening temperature of between 80 and 150° C. and an acid number of less than 20; and c) 0.5 to 20% of one or more carboxylic acids, the hydrocarbon chain of which includes 6 to 22 carbon atoms. The present invention also relates to a multilayer system including an HMPSA layer, a printable support layer, and an adjacent protective layer. Further, the present invention also includes a corresponding self-adhesive label and process for recycling a labeled article which entails debonding of the label by immersing the article in a hot basic aqueous solution.
    Type: Grant
    Filed: June 26, 2008
    Date of Patent: June 5, 2018
    Assignee: BOSTIK, S.A.
    Inventors: Stéphane André Fouquay, David Goubard
  • Patent number: 8715797
    Abstract: Hot-melt pressure-sensitive adhesive (HMPSA) composition is disclosed comprising: a) 25 to 50% of a blend of SBS and SB styrene block copolymers; b) 45 to 75% of compatible tackifying resins having a softening temperature of between 80 to 150° C.; and c) 0.5 to 5.5% of fatty acids, the hydrocarbon chain of which comprises 10 to 22 carbon atoms. Also disclosed are a multilayer system comprising an HMPSA layer, a printable support layer and an adjacent protective layer. A self-adhesive label and process for recycling a labeled article with debonding of said label by immersing the article in a hot basic aqueous solution are also disclosed.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: May 6, 2014
    Assignee: Bostik S.A.
    Inventors: Stéphane André Fouquay, David Goubard
  • Publication number: 20100193127
    Abstract: Hot-melt pressure-sensitive adhesive (HMPSA) composition comprising: a) 25 to 50% of a styrene block copolymer chosen from the group comprising SIS, SIBS, SEBS and SEPS block copolymers; b) 35 to 75% of a compatible tackifying resin having a softening temperature of between 80 and 150° C. and an acid number of less than 20; and c) 0.5 to 20% of one or more carboxylic acids, the hydrocarbon chain of which comprises 6 to 54 carbon atoms. Multilayer system comprising an HMPSA layer, a printable support layer and an adjacent protective layer. Corresponding self-adhesive label and process for recycling a labeled article, with debanding of said label by immersing the article in a hot basic aqueous solution.
    Type: Application
    Filed: June 26, 2008
    Publication date: August 5, 2010
    Applicant: Bostik S.A.
    Inventors: Stéphane André Fouquay, David Goubard
  • Publication number: 20100092703
    Abstract: Hot-melt pressure-sensitive adhesive (HMPSA) composition comprising: a) 25 to 50% of a blend of SBS and SB styrene block copolymers; b) 45 to 75% of compatible tackifying resins having a softening temperature of between 80 and 150° C.; and c) 0.5 to 5.5% of fatty acids, the hydrocarbon chain of which comprises 10 to 22 carbon atoms. Multilayer system comprising an HMPSA layer, a printable support layer and an adjacent protective layer. Corresponding self-adhesive label and process for recycling a labeled article with debonding of said label by immersing the article in a hot basic aqueous solution.
    Type: Application
    Filed: January 31, 2008
    Publication date: April 15, 2010
    Applicant: Bostik S.A.
    Inventors: Stéphane André Fouquay, David Goubard