Abstract: A secure multi-layered structure (14), for example, for a secure document, the secure multi-layered structure comprising a first layer (20) having a first aperture (25) opened in the first layer, a second layer (30) having a second aperture (35) opened in the second layer, and a third layer (40) having a third aperture (45) opened in the third layer, wherein each layer at least partially overlaps with the layer adjacent to it, at least a portion of the third layer being visible through the first aperture.

Abstract: A method of generating a multiplexed image for printing that can be observed in a plurality of modes includes determining a finite shape of a multiplexed palette in a combined color space. The contrast of the multiplexed image in each mode can be optimized by determining a maximum volume hyperrectangle enclosed in the finite shape. Gamut mapping to this maximum volume hyperrectangle allows for generation of a multiplexed image that has a maximum contrast and is free from artifacts caused by an interdependency between the colors in each mode. Performing a dimensionality reduction using PCA allows for reducing the complexity of the optimization problem.

Abstract: A method of generating a reduced palette for use in a printing process is disclosed. In the method, a plurality of images obtainable by varying printing parameters of the printing apparatus are printed, and color values of the same are measured. Based on the color values, a clustering is performed to obtain a plurality of clusters having similar color values. For each cluster, one or more representative images are selected to form the palette. In this manner, images with color values both inside a convex hull and on the convex hull can be included in the palette.

Abstract: A secure multi-layered structure (14), for example, for a secure document, the secure multi-layered structure comprising a first layer (20) having a first aperture (25) opened in the first layer, a second layer (30) having a second aperture (35) opened in the second layer, and a third layer (40) having a third aperture (45) opened in the third layer, wherein each layer at least partially overlaps with the layer adjacent to it, at least a portion of the third layer being visible through the first aperture.

Abstract: A method of manufacturing a chip card, such as a dual interface card, is provided. The method generally includes collocating multiple card support sheets one onto the other, depositing a conductive adhesive onto contact pads on at least one of the sheets, positioning a dual interface module in a recess established in at least one of the sheets, and executing a lamination step.

Abstract: A coupling device is formed by a continuous conductive path having a central section and two extremity sections, the central section forming at least a small spiral for inductive coupling with the transponder device, the extremities sections forming each one large spiral for inductive coupling with the reader device, wherein the small spiral shows a larger pitch than the ones of the large spirals, and wherein the two extremities of the continuous path are loose such that the coupling device forms an open circuit. The pitches of the large spirals are chosen such as that the interturn stray capacitances is important and that the large spirals have mainly a capacitive behavior. And the pitch of the small spiral is chosen such as that the interturn stray capacitances are negligible, and that the small spiral has mainly an inductive behavior.

Abstract: A method for making a contactless chip card of the type having an electronic module, and an antenna connected to the module, includes the following steps: producing, on a first support sheet, the antenna with connection terminals provided at its ends; producing an insulating bridge partly covering the antenna coils except for the connection terminals; depositing a drop of filling material on the insulating bridge; transferring the electronic module, with its connection pads being oriented towards the insulating bridge; and providing an electric connection between the module contact pads and the antenna connection terminals.

Abstract: The invention concerns the production of contactless transmission chip card, and particularly mixed cards operating with or without contact. The method for the reliable and efficient setting of an integrated circuit module (M) and of an inductive transmission antenna (A), consists in producing the module providing connection ranges for the antenna, making an antenna with a flat coiled wire, and soldering the ends of said antenna on the module ranges, then making a plastic wafer (30) provided with an opening, the bottom of this opening being closed by an adhesive film (34). The module and the antenna are set against the wafer, and maintained by the adhesive material at the bottom of the housing. Another wafer (40) is directly mounted on the assembly.