Patents by Inventor Stéphane AZZOPARDI

Stéphane AZZOPARDI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating an electronic power module by additive manufacturing, and associated substrate and module
    Patent number: 11594475
    Abstract: A method of fabricating an electronic power module by additive manufacturing, the electronic module including a substrate having an electrically insulating plate presenting opposite first and second faces, with a first metal layer arranged directly on the first face of the insulating plate, and a second metal layer arranged directly on the second face of the insulating plate. At least one of the metal layers is made by a step of depositing a thin layer of copper and a step of annealing the metal layer, and the method further includes a step of forming at least one thermomechanical transition layer on at least one of the first and second metal layers, the at least one thermomechanical transition layer including a material presenting a coefficient of thermal expansion that is less than that of the metal of the metal layer.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: February 28, 2023
    Assignee: SAFRAN
    Inventors: Rabih Khazaka, Stéphane Azzopardi, Donatien Henri Edouard Martineau
  • METHOD OF FABRICATING AN ELECTRONIC POWER MODULE BY ADDITIVE MANUFACTURING, AND ASSOCIATED SUBSTRATE AND MODULE
    Publication number: 20220000965
    Abstract: A method of fabricating an electronic power module by additive manufacturing, the electronic module including a substrate having an electrically insulating plate presenting opposite first and second faces, with a first metal layer arranged directly on the first face of the insulating plate, and a second metal layer arranged directly on the second face of the insulating plate. At least one of the metal layers is made by a step of depositing a thin layer of copper and a step of annealing the metal layer, and the method further includes a step of forming at least one thermomechanical transition layer on at least one of the first and second metal layers, the at least one thermomechanical transition layer including a material presenting a coefficient of thermal expansion that is less than that of the metal of the metal layer.
    Type: Application
    Filed: September 15, 2021
    Publication date: January 6, 2022
    Inventors: Rabih KHAZAKA, Stéphane AZZOPARDI, Donatien Henri Edouard MARTINEAU
  • Method of fabricating an electronic power module by additive manufacturing, and associated substrate and module
    Patent number: 11147851
    Abstract: A method of fabricating an electronic power module by additive manufacturing, the electronic module including a substrate having an electrically insulating plate presenting opposite first and second faces, with a first metal layer arranged directly on the first face of the insulating plate, and a second metal layer arranged directly on the second face of the insulating plate. At least one of the metal layers is made by a step of depositing a thin layer of copper and a step of annealing the metal layer, and the method further includes a step of forming at least one thermomechanical transition layer on at least one of the first and second metal layers, the at least one thermomechanical transition layer including a material presenting a coefficient of thermal expansion that is less than that of the metal of the metal layer.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: October 19, 2021
    Assignee: SAFRAN
    Inventors: Rabih Khazaka, Stéphane Azzopardi, Donatien Henri Edouard Martineau
  • A METHOD OF FABRICATING AN ELECTRONIC POWER MODULE BY ADDITIVE MANUFACTURING, AND ASSOCIATED SUBSTRATE AND MODULE
    Publication number: 20190358285
    Abstract: A method of fabricating an electronic power module by additive manufacturing, the electronic module including a substrate having an electrically insulating plate presenting opposite first and second faces, with a first metal layer arranged directly on the first face of the insulating plate, and a second metal layer arranged directly on the second face of the insulating plate. At least one of the metal layers is made by a step of depositing a thin layer of copper and a step of annealing the metal layer, and the method further includes a step of forming at least one thermomechanical transition layer on at least one of the first and second metal layers, the at least one thermomechanical transition layer including a material presenting a coefficient of thermal expansion that is less than that of the metal of the metal layer.
    Type: Application
    Filed: January 5, 2018
    Publication date: November 28, 2019
    Inventors: Rabih KHAZAKA, Stéphane AZZOPARDI, Donatien Henri Edouard MARTINEAU