Abstract: The invention relates to an optoelectronic device comprising a photonic interposer comprising: a photonic circuit containing at least one active optical component, an upper interconnect layer comprising at least one upper control portion, a lower interconnect layer comprising at least one lower control portion and lower intermediate portions, at least one TSV directly connecting the upper control portion to the lower control portion, conductive vias connecting the lower intermediate portions to the active optical component; at least one first microelectronic chip joined to the upper face of the photonic interposer; a second microelectronic chip joined to the lower face of the photonic interposer, and connected to the lower control portion and to the lower intermediate portions.

Abstract: The invention relates to an optoelectronic device 1 comprising: a photonic interposer 10 comprising: a photonic circuit 14.1 containing at least one active optical component 14.2, an upper interconnect layer 11, comprising at least one upper control portion 11.2, a lower interconnect layer 17, comprising at least one lower control portion 17.2, and lower intermediate portions 17.3, at least one TSV 18.1 directly connecting the upper control portion 11.2 to the lower control portion 17.2, conductive vias 15.1 connecting the lower intermediate portions 17.3 to the active optical component 14.2; at least one first microelectronic chip 20, joined to the upper face 10a of the photonic interposer; a second microelectronic chip 30, joined to the lower face 10b of the photonic interposer, and connected to the lower control portion 17.2 and to the lower intermediate portions 17.3.

Abstract: A photonic circuit testing device, including a photonic test chip including, on the side of a first surface of the chip: micropillars, each intended to be placed in contact with a corresponding electric connection pad of the photonic circuit; and first optical input/output ports, each intended to be optically coupled to a second corresponding optical input/output port of the photonic circuit.

Abstract: A photonic circuit testing device, including a photonic test chip including, on the side of a first surface of the chip: micropillars, each intended to be placed in contact with a corresponding electric connection pad of the photonic circuit; and first optical input/output ports, each intended to be optically coupled to a second corresponding optical input/output port of the photonic circuit.

Abstract: Optical coupling of a photonic chip to an external device by use of a system with two lenses. The photonic chip comprises a light guide layer supported by a substrate and covered by an encapsulation layer, and a lens integrated into either the front face or the back face. The light guide layer includes a wave guide coupled to a surface grating coupler. An arrangement of one or several reflecting structures each on either the front face or the back face, is provided. This arrangement comprises a reflecting structure on the back face and is made so as to assure propagation of light between the surface grating coupler, and the lens along an optical path having at least one fold. The invention also covers the fabrication method of such a photonic chip.

Abstract: Optical coupling of a photonic chip to an external device by use of a system with two lenses. The photonic chip comprises a light guide layer supported by a substrate and covered by an encapsulation layer, and a lens integrated into either the front face or the back face. The light guide layer includes a wave guide coupled to a surface grating coupler. An arrangement of one or several reflecting structures each on either the front face or the back face, is provided. This arrangement comprises a reflecting structure on the back face and is made so as to assure propagation of light between the surface grating coupler, and the lens along an optical path having at least one fold. The invention also covers the fabrication method of such a photonic chip.

Abstract: An optical duplexer intended to receive light at a first optical wavelength and to transmit back light at a second optical wavelength, including, on a substrate, successive layers forming a photoreceptor of the first optical wavelength, a selective filter letting through the first optical wavelength, and a waveguide having a surface including a grating which is transparent for the first optical wavelength and diffracting for the second optical wavelength.

Abstract: An optical device including at least one first optical waveguide coupled to a second optical waveguide of smaller cross-section which penetrates into it on the side of a first end. The first optical waveguide is capable of being coupled with an optical fiber on the side of a second end. A surface of the first optical waveguide includes a diffraction grating capable of introducing-extracting-sending back light into and from the first optical waveguide.

Abstract: The invention relates to a device for coupling an optical fiber and a nanophotonic component formed on a first substrate, wherein the device comprises: an intermediate component formed on a second substrate including a first wave guide adapted for receiving light from the optical fiber and for transmitting the same to a first diffraction grating independently from the polarization of the incident light; second and third diffraction gratings formed on the first substrate and coupled to the nanophotonic component, the first diffraction grating being adapted to provide the first and second light beams respectively towards the second diffraction grating and the third diffraction grating, the first and second beams having perpendicular polarizations.

Abstract: An optical duplexer intended to receive light at a first optical wavelength and to transmit back light at a second optical wavelength, including, on a substrate, successive layers forming a photoreceptor of the first optical wavelength, a selective filter letting through the first optical wavelength, and a waveguide having a surface including a grating which is transparent for the first optical wavelength and diffracting for the second optical wavelength.

Abstract: A single-mode planar nanophotonic waveguide includes an optical core, a cladding coating the optical core, and a structure for the optical coupling of the core of the waveguide with the core of a single-mode optical fibre. The coupling structure includes an adaptation element including a gradual broadening of the core of the waveguide ending in a broadened region of dimension adapted to the core of the optical fibre; and a light transmission element, optically connected to the broadened region, and defining a plane coupling surface by which light is transmitted to the optical fibre, the optical coupling ratio through the surface when the surface is in contact with the air being maximum for a predetermined coupling angle (?) of the light relative to the coupling surface.

Abstract: The invention relates to a device for coupling an optical fiber and a nanophotonic component formed on a first substrate, wherein the device comprises: an intermediate component formed on a second substrate including a first wave guide adapted for receiving light from the optical fiber and for transmitting the same to a first diffraction grating independently from the polarization of the incident light; second and third diffraction gratings formed on the first substrate and coupled to the nanophotonic component, the first diffraction grating being adapted to provide the first and second light beams respectively towards the second diffraction grating and the third diffraction grating, the first and second beams having perpendicular polarizations.

Abstract: An optical device including at least one first optical waveguide coupled to a second optical waveguide of smaller cross-section which penetrates into it on the side of a first end. The first optical waveguide is capable of being coupled with an optical fiber on the side of a second end. A surface of the first optical waveguide includes a diffraction grating capable of introducing-extracting-sending back light into and from the first optical waveguide.

Abstract: A hermetic coupling device between an optoelectronic component emitting and/or receiving a light beam, and an optical transmission mechanism conveying the light beam. The hermetic coupling device includes a substrate including a blind hole, having a bottom wall, into which one part of the optical transmission mechanism is inserted. The substrate is formed of a stack of a first layer and a second layer. The light beam crosses the substrate passing through the bottom wall of the blind hole, the substrate receiving the optoelectronic component substantially opposite the blind hole. Reflective patterns are inserted between two layers of the hermetic coupling device, substantially on the periphery of the blind hole, and reflect one part of the light beam emitted by the optoelectronic component.

Abstract: A hermetic coupling device between an optoelectronic component emitting and/or receiving a light beam, and an optical transmission mechanism conveying the light beam. The hermetic coupling device includes a substrate including a blind hole, having a bottom wall, into which one part of the optical transmission mechanism is inserted. The substrate is formed of a stack of a first layer and a second layer. The light beam crosses the substrate passing through the bottom wall of the blind hole, the substrate receiving the optoelectronic component substantially opposite the blind hole. Reflective patterns are inserted between two layers of the hermetic coupling device, substantially on the periphery of the blind hole, and reflect one part of the light beam emitted by the optoelectronic component.

Abstract: According to the invention, in an assembly comprising an electronic component (108), said component is connected by microbeads (107) to at least one heat sink (106, 109), said beads being connected to electrically-conductive lines on said electronic component and to electrically-conductive lines on at least one heat sink, said beads carrying, on the one hand, electrical signals between the electronic component and each heat sink bearing said electrically-conductive lines and, on the other hand, the heat from the electronic component to each heat sink, via heat conduction.