Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Abstract: The collapsing bridge crimp comprises a central portion and two mutually-opposite side arms extending from the central portion. Each side arm comprises a first portion attached to the central portion, the first portion being inwardly curved, and a second portion extending from the first portion and located above the central portion. The second portion of each side arm is substantially straight and defines an upwardly-oriented angle with reference to the central portion. The second portion also has a free end provided with an end face, the end face of both side arms defining a top-opened wire-receiving groove between them.

Abstract: The present invention relates to an anode for electroplating, which has an anode base and a shield and is characterized in that additive degradation is reduced when it is used in electroplating.

Abstract: A regenerative burner device for a furnace and a method of removing contaminants from such a device. The burner device includes a burner for introducing heat and waste gas into a furnace during ignition when supplied with fuel and a combustion gas, a media bed comprising refractory particles, and ducting for delivering combustion gas to said burner during ignition, and for drawing waste gas from said furnace on termination of ignition. The ducting causes the combustion gas and the waste gas to pass in succession through the media bed. Means are provided for periodically delivering a rapid flow of a decontaminating gas into said media bed. The rapid flow is of sufficient force to dislodge contaminants collected in the media bed from said waste gas.

Abstract: The MEMS cantilever actuator is designed to be mounted on a substrate. The actuator comprises an elongated hot arm member having two spaced-apart portions, each provided at one end with a corresponding anchor pad connected to the substrate. The portions are connected together at a common end that is opposite the anchor pads. It further comprises an elongated cold arm member adjacent to and substantially parallel of the hot arm member, the cold arm member having at one end an anchor pad connected to the substrate, and a free end that is opposite the anchor pad thereof. A dielectric tether is attached over the common end of the portions of the hot arm member and the free end of the cold arm member. This MEMS actuator allows improving the performance, reliability and manufacturability of MEMS switches.

Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Abstract: The electro-mechanical relay comprises a base having a transversal axis and a rocking member operatively connected over the base. The rocking member is pivotable, with reference to the transversal axis, between a first position and a second position. The relay also comprises a first contact provided on the base at a location facing the rocking member and being spaced-apart from the transversal axis, and a second contact having at least a portion provided on the rocking member and being in registry with the first contact. The first and second contacts are configured and disposed to be electrically engaged at the first position of the rocking member, and electrically disengaged from each other at the second position thereof.

Abstract: The MEMS cantilever actuator is designed to be mounted on a substrate. The actuator comprises an elongated hot arm member having two spaced-apart portions, each provided at one end with a corresponding anchor pad connected to the substrate. The portions are connected together at a common end that is opposite the anchor pads. It further comprises an elongated cold arm member adjacent to and substantially parallel of the hot arm member, the cold arm member having at one end an anchor pad connected to the substrate, and a free end that is opposite the anchor pad thereof. A dielectric tether is attached over the common end of the portions of the hot arm member and the free end of the cold arm member. This MEMS actuator allows improving the performance, reliability and manufacturability of MEMS switches.

Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Abstract: The present invention provides methods for the use of copper electroplating compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Abstract: The present invention relates to a method of electrodepositing metal onto a substrate, which comprises applying a pulsed periodic reverse current across the electrodes of a plating cell utilizing a peak reverse current density and peak forward current density; and varying the ratio of peak reverse current density to peak forward current density in periodic cycles to provide metal deposits of uniform thickness and appearance upon the substrate. The invention also relates to a process for improving the properties of an electrodeposit, particularly on substrates having uneven surfaces or apertures, by using programmed pulse periodic reverse current modulation. More particularly, it involves varying the anodic to cathodic current density ratio, in order to improve the surface uniformity appearance, grain structure and levelling of the deposit while maintaining high current density throwing power.

Abstract: The present invention provides inter alia copper electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention contain an increased brightener concentration that can provide effective copper plate on difficult-to-plate aperture walls, including high aspect ratio, small diameter microvias.

Abstract: The present invention relates to a method of electrodepositing metal onto a substrate, which comprises applying a pulsed periodic reverse current across the electrodes of a plating cell utilizing a peak reverse current density and peak forward current density; and varying the ratio of peak reverse current density to peak forward current density in periodic cycles to provide metal deposits of uniform thickness and appearance upon the substrate. The invention also relates to a process for improving the properties of an electrodeposit, particularly on substrates having uneven surfaces or apertures, by using programmed pulse periodic reverse current modulation. More particularly, it involves varying the anodic to cathodic current density ratio, in order to improve the surface uniformity appearance, grain structure and levelling of the deposit while maintaining high current density throwing power.