Abstract: A contactless electronic module for a data carrier comprises a substrate, at least one electronic chip, and at least one electrical connector. The electronic chip is arranged on the substrate, and the electrical connector is in connection with the electronic chip. The substrate is electrically non-conductive. Other embodiments disclosed.

Abstract: The invention relates to a module with integrated circuit chip, comprising an insulating substrate, metallisations comprising conductive tracks produced on one side of the substrate, forming an antenna and comprising two connection ends, and a coating area or location of the radiofrequency integrated circuit chip and of a device in the form of a surface-mounted device, the radiofrequency integrated circuit chip and the device being disposed on the same face of the substrate and connected to the antenna. The metallisations are on a single same side of the insulating substrate, the connection being made by means of perforations through the insulating film or directly on the surface metallisations.

Abstract: The invention relates to a method for producing a module having an electronic chip including metallizations which are accessible from a first side of the metallizations and an integrated circuit chip which is arranged on the second side of the metallizations, opposite the first side. The method comprises the step of forming electrical interconnection elements which are separate from the metallizations, directly connecting the chip, and are arranged on the second side of the metallizations. The invention also relates to a module corresponding to the method and to a device comprising said module.

Abstract: The invention relates to a module with integrated circuit chip, comprising an insulating substrate, metallisations comprising conductive tracks produced on one side of the substrate, forming an antenna and comprising two connection ends, and a coating area or location of the radiofrequency integrated circuit chip and of a device in the form of a surface-mounted device, the radiofrequency integrated circuit chip and the device being disposed on the same face of the substrate and connected to the antenna. The metallisations are on a single same side of the insulating substrate, the connection being made by means of perforations through the insulating film or directly on the surface metallisations.

Abstract: The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive.

Abstract: The invention relates to a method for producing a module having an electronic chip including metallisations which are accessible from a first side of the metallisations and an integrated circuit chip which is arranged on the second side of the metallisations, opposite the first side. The method comprises the step of forming electrical interconnection elements which are separate from the metallisations, directly connecting the chip, and are arranged on the second side of the metallisations. The invention also relates to a module corresponding to the method and to a device comprising said module.

Abstract: The invention relates to a method for producing an electronic device including at least one electronic component in a substrate body, said method including at least one step of transferring said electronic component to a surface of a removable dielectric substrate, of delivering a protective resin on said electronic component, and of transferring, onto the protective resin, a reinforcement disc having a main front surface with a peripheral contour, wherein the protective resin extends up to the peripheral contour of the disc in order to form, together with the disc, the peripheral side contours and the final layer of the substrate body of the device.

Abstract: The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive.

Abstract: The invention concerns a method for producing a smart card or telecommunication module electronic housing, comprising an electronic chip in the housing, a face comprising at least one set of conductive metal platings, said method comprising the following steps: providing or producing at least one set of metal platings comprising conductive circuit pads or tracks, on one side of a substrate, transferring and connecting a chip to each set of platings, overmoulding each chip with the set of metal platings of same on the substrate with a moulding material in order to produce at least one housing, separating the housing from the substrate thereof, wherein the side of the substrate in contact with the metal platings comprises an adhesive or has low adhesiveness and in that the overmoulding is carried out at the final dimensions of the housing. The invention also concerns a moulding apparatus and the housing obtained.

Abstract: This invention relates to a smart card (1) manufacturing method that makes it possible to reduce the thickness of the said smart card and directly obtain a final 3FF or 4FF format. The smart card manufacturing method comprises steps for depositing resin forming a first protective coat (11) over the electronic element assembly with a surface greater than the required smart card format and depositing a second protective coat with a format larger than the required card format on the first protective coat. The second protective coat is fixed to the first protective coat by curing the first protective coat, and then the assembly obtained in that way is cut to the required format.

Abstract: A smart card includes a card bearing a module that is made up of a support supporting at least an electronic chip. The support is fixed on one surface of the card. This surface extends up to at least one of the edges of the card.