Patents by Inventor Stéphane Ottobon

Stéphane Ottobon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240419933
    Abstract: A contactless electronic module for a data carrier comprises a substrate, at least one electronic chip, and at least one electrical connector. The electronic chip is arranged on the substrate, and the electrical connector is in connection with the electronic chip. The substrate is electrically non-conductive. Other embodiments disclosed.
    Type: Application
    Filed: October 21, 2022
    Publication date: December 19, 2024
    Applicant: THALES DIS FRANCE SAS
    Inventors: David BYRNE, Lucile DOSSETTO, Stéphane OTTOBON, Frédérick SEBAN
  • Patent number: 10804594
    Abstract: The invention relates to a module with integrated circuit chip, comprising an insulating substrate, metallisations comprising conductive tracks produced on one side of the substrate, forming an antenna and comprising two connection ends, and a coating area or location of the radiofrequency integrated circuit chip and of a device in the form of a surface-mounted device, the radiofrequency integrated circuit chip and the device being disposed on the same face of the substrate and connected to the antenna. The metallisations are on a single same side of the insulating substrate, the connection being made by means of perforations through the insulating film or directly on the surface metallisations.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: October 13, 2020
    Assignee: THALES DIS FRANCE SA
    Inventors: Remy Janvrin, Line Degeilh, Lucile Dossetto, Stéphane Ottobon
  • Patent number: 10282652
    Abstract: The invention relates to a method for producing a module having an electronic chip including metallizations which are accessible from a first side of the metallizations and an integrated circuit chip which is arranged on the second side of the metallizations, opposite the first side. The method comprises the step of forming electrical interconnection elements which are separate from the metallizations, directly connecting the chip, and are arranged on the second side of the metallizations. The invention also relates to a module corresponding to the method and to a device comprising said module.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: May 7, 2019
    Assignee: GEMALTO SA
    Inventors: Stéphane Ottobon, Lucile Dossetto, Luc Charles, Thierry Laviron
  • Publication number: 20180351233
    Abstract: The invention relates to a module with integrated circuit chip, comprising an insulating substrate, metallisations comprising conductive tracks produced on one side of the substrate, forming an antenna and comprising two connection ends, and a coating area or location of the radiofrequency integrated circuit chip and of a device in the form of a surface-mounted device, the radiofrequency integrated circuit chip and the device being disposed on the same face of the substrate and connected to the antenna. The metallisations are on a single same side of the insulating substrate, the connection being made by means of perforations through the insulating film or directly on the surface metallisations.
    Type: Application
    Filed: December 13, 2016
    Publication date: December 6, 2018
    Applicant: GEMALTO SA
    Inventors: Remy Janvrin, Line Degeilh, Lucile Dossetto, Stéphane Ottobon
  • Patent number: 10091883
    Abstract: The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: October 2, 2018
    Assignee: GEMALTO SA
    Inventors: Stéphane Ottobon, Lucile Dossetto, Line Degeilh
  • Patent number: 10013651
    Abstract: The invention relates to a method for making an electronic module having an integrated circuit chip connected to an antenna. The method includes the steps of producing a module having electrical interconnection areas, a chip connected to the interconnection areas and a protection element covering at least the chip and part of the interconnection areas, and a radio antenna connected to the chip and arranged above the chip. The method includes a step of producing the entirety or part of the antenna, or the tracks thereof for coupling same with the interconnection areas, in three dimensions directly on the protection element.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: July 3, 2018
    Assignee: GEMALTO SA
    Inventors: Stephane Ottobon, Jean-Christophe Fidalgo, Laurent Audouard, Frederick Seban
  • Publication number: 20170372186
    Abstract: The invention relates to a method for producing a module having an electronic chip including metallisations which are accessible from a first side of the metallisations and an integrated circuit chip which is arranged on the second side of the metallisations, opposite the first side. The method comprises the step of forming electrical interconnection elements which are separate from the metallisations, directly connecting the chip, and are arranged on the second side of the metallisations. The invention also relates to a module corresponding to the method and to a device comprising said module.
    Type: Application
    Filed: February 9, 2016
    Publication date: December 28, 2017
    Applicant: GEMALTO SA
    Inventors: Stéphane OTTOBON, Lucile DOSSETTO, Luc CHARLES, Thierry LAVIRON
  • Publication number: 20170178991
    Abstract: The invention relates to a method for producing an electronic device including at least one electronic component in a substrate body, said method including at least one step of transferring said electronic component to a surface of a removable dielectric substrate, of delivering a protective resin on said electronic component, and of transferring, onto the protective resin, a reinforcement disc having a main front surface with a peripheral contour, wherein the protective resin extends up to the peripheral contour of the disc in order to form, together with the disc, the peripheral side contours and the final layer of the substrate body of the device.
    Type: Application
    Filed: November 13, 2014
    Publication date: June 22, 2017
    Applicant: GEMALTO SA
    Inventors: Stéphane OTTOBON, Lucile DOSSETTO, Lauren AUDOUARD, Sébastien GUIJARRO
  • Publication number: 20160183377
    Abstract: The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive.
    Type: Application
    Filed: June 19, 2014
    Publication date: June 23, 2016
    Applicant: GEMALTO SA
    Inventors: Stéphane OTTOBON, Lucile DOSSETTO, Line DEGEILH
  • Patent number: 9165236
    Abstract: This invention relates to a smart card (1) manufacturing method that makes it possible to reduce the thickness of the said smart card and directly obtain a final 3FF or 4FF format. The smart card manufacturing method comprises steps for depositing resin forming a first protective coat (11) over the electronic element assembly with a surface greater than the required smart card format and depositing a second protective coat with a format larger than the required card format on the first protective coat. The second protective coat is fixed to the first protective coat by curing the first protective coat, and then the assembly obtained in that way is cut to the required format.
    Type: Grant
    Filed: December 7, 2012
    Date of Patent: October 20, 2015
    Assignee: GEMALTO SA
    Inventors: Stephane Ottobon, Lucile Dossetto
  • Publication number: 20150269473
    Abstract: The invention relates to a method for making an electronic module having an integrated circuit chip connected to an antenna. The method includes the steps of producing a module having electrical interconnection areas, a chip connected to the interconnection areas and a protection element covering at least the chip and part of the interconnection areas, and a radio antenna connected to the chip and arranged above the chip. The method includes a step of producing the entirety or part of the antenna, or the tracks thereof for coupling same with the interconnection areas, in three dimensions directly on the protection element.
    Type: Application
    Filed: November 25, 2013
    Publication date: September 24, 2015
    Applicant: GEMALTO SA
    Inventors: Stephane Ottobon, Jean-Christophe Fidalgo, Laurent Audouard, Frederick Seban
  • Publication number: 20150228505
    Abstract: The invention concerns a method for producing a smart card or telecommunication module electronic housing, comprising an electronic chip in the housing, a face comprising at least one set of conductive metal platings, said method comprising the following steps: providing or producing at least one set of metal platings comprising conductive circuit pads or tracks, on one side of a substrate, transferring and connecting a chip to each set of platings, overmoulding each chip with the set of metal platings of same on the substrate with a moulding material in order to produce at least one housing, separating the housing from the substrate thereof, wherein the side of the substrate in contact with the metal platings comprises an adhesive or has low adhesiveness and in that the overmoulding is carried out at the final dimensions of the housing. The invention also concerns a moulding apparatus and the housing obtained.
    Type: Application
    Filed: September 17, 2013
    Publication date: August 13, 2015
    Applicant: GEMALTO SA
    Inventors: Stéphane Ottobon, Lucile Dossetto, Laurent Audouard, Sébastien Guijarro
  • Publication number: 20150001306
    Abstract: The embodiments of this invention relate to a smart card (1) comprising the following:—an integrated circuit chip (10),—a primary card body (3) with a first form factor, comprising a slot (5) on the front (7) designed to accommodate the integrated circuit chip (10), wherein the said primary card body (3) also comprises a detachable contour (c1), peripheral to the slot (5), which represents another form factor and defines a secondary card body (11), characterised in that the primary card body (3) has a first thickness (el), between the front (7) and a back (8), and in that the secondary card body (11) has a second thickness (e2), between a front (7, 12) and a back (14), which is smaller than the first thickness (el).
    Type: Application
    Filed: December 24, 2012
    Publication date: January 1, 2015
    Applicant: GEMALTO SA
    Inventors: Stephane Ottobon, Laurent Oddou, Alexis Froger, Jeremy Renouard
  • Publication number: 20140367473
    Abstract: This invention relates to a smart card (1) manufacturing method that makes it possible to reduce the thickness of the said smart card and directly obtain a final 3FF or 4FF format. The smart card manufacturing method comprises steps for depositing resin forming a first protective coat (11) over the electronic element assembly with a surface greater than the required smart card format and depositing a second protective coat with a format larger than the required card format on the first protective coat. The second protective coat is fixed to the first protective coat by curing the first protective coat, and then the assembly obtained in that way is cut to the required format.
    Type: Application
    Filed: December 7, 2012
    Publication date: December 18, 2014
    Applicant: GEMALTO SA
    Inventors: Stéphane Ottobon, Lucile Dossetto
  • Patent number: 7686228
    Abstract: A smart card includes a card bearing a module that is made up of a support supporting at least an electronic chip. The support is fixed on one surface of the card. This surface extends up to at least one of the edges of the card.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: March 30, 2010
    Assignee: Gemalto SA
    Inventors: Laurent Oddou, Stéphane Ottobon
  • Publication number: 20080296606
    Abstract: The invention generally relates to devices comprising semiconductor chips. More specifically, the invention relates to an electronic module (1) comprising at least one integrated circuit chip (10) which is connected to the conductor tracks of an insulating support and at least one light-emitting diode (16). According to one aspect of the invention, the assembly formed by the integrated circuit (10) and the light-emitting diode (16) is coated with a translucent resin (32), thereby forming an element for the mechanical protection of the assembly and for the transmission of the light emitted by the diode (16). According to another aspect of the invention, the coated assembly comprises at least one indicator light (LED) and a radio-frequency coil (preferably in the module).
    Type: Application
    Filed: March 17, 2006
    Publication date: December 4, 2008
    Inventors: Stephane Ottobon, Thierry Karlisch, Thierry Laviron, Lucile Dossetto
  • Publication number: 20070263368
    Abstract: The invention relates to an electronic device comprising a module which is affixed to a support body by means of a layer of adhesive. According to the invention, the module comprises a support film having a first metallisation on an upper face and a printed circuit chip on a lower face, said chip being connected to the first metallisation through the film. The invention is characterised in that the device comprises a primer separation layer (9, 14) which is disposed between the lower face (10) and the chip (8). The invention is also characterised in that the primer separation layer adheres more to the adhesive layer than the film. The invention also relates to the associated modules.
    Type: Application
    Filed: October 20, 2005
    Publication date: November 15, 2007
    Applicant: Gemplus
    Inventor: Stephane Ottobon
  • Publication number: 20050001039
    Abstract: A smart card includes a card bearing a module that is made up of a support supporting at least an electronic chip. The support is fixed on one surface of the card. This surface extends up to at least one of the edges of the card.
    Type: Application
    Filed: December 18, 2002
    Publication date: January 6, 2005
    Inventors: Laurent Oddou, Stephane Ottobon