Abstract: A method is provided. The method includes forming a conductive layer on an inner surface of a substrate and providing a sacrificial layer over the conductive layer. The method includes forming a plurality of channels in the sacrificial layer and plating the sacrificial layer to substantially fill the plurality of channels with a plating material comprising conducting material. The method also includes etching the sacrificial layer to form a conducting structure having fins where conducting material remains separated by microchannels where the sacrificial layer is etched.

Abstract: A method of making an electronic device cooling system includes forming a thermally conductive layer on an inner surface of the substrate and laser ablating the thermally conductive layer to form microchannels.

Abstract: According to some embodiments, a Microelectromechanical System (MEMS) sensor includes a sensing material on a spring element. The sensor may also include a detector adapted to determine a resonant frequency associated with the spring element, wherein the resonant frequency changes upon the exposure of the sensing material to an analyte.

Abstract: A method of fabricating a stamping mold suitable for use in the formation of a tapered waveguide structure includes defining a stamping pattern upon the surface of a silicon wafer, and removing portions of the silicon wafer surface in accordance with the stamped pattern, thereby creating tapered vertical surfaces within the wafer.