Abstract: A skin grooming device comprising a planar surface for removable attachment to a stationary surface, having affixed thereto an undulating abrasive block for use in abrading rough, dead, or dry skin from keratinous surfaces and a method for grooming skin using the device.

Abstract: A nail file in the form of an arc with generally rounded edges and a method for grooming finger- and toenails using the file.

Abstract: A tool for abrading skin from keratinous surfaces comprising a closed loop of a certain circumference, said loop having an outer surface to which is affixed a continuous contoured abrasive surface covering at least a portion of the outer loop circumference, and a method for treating skin with such a tool.

Abstract: An implement for removing skin comprised of a handle in the form of a tab with generally curved edges and a skin scraping surface being flat with generally curved edges wherein the handle is in a first plane and the skin scraping surface in a second plane and the first plane is perpendicular to the second plane, and a method for removing undesired skin from skin surfaces using the implement.

Abstract: A tweezer comprised of arms diverging from a base, wherein each arm has a first section closest to the base that diverges from a straight line perpendicular to the base, and a second section furthest from the base that converges toward a straight line perpendicular to the base.

Abstract: A tweezer comprised of a handle and a detachably engageable tweezer component that engages with handle and is detachable from handle, a kit containing the handle and tweezer component, point-of-sale packages, and a method for grooming using the tweezer of the invention.

Abstract: Different techniques may be used to realize the simultaneous provision of bonding material at a controlled height on a wafer level. These techniques include photolithographically patterning a layer of bonding material and providing spacer elements on a wafer then contacting another surface having the bonding material provided thereon to transfer the bonding material to the spacer elements. The patterning of the bonding material may include using a mask direct contact with or spaced from the bonding material. The providing of the spacer elements may include forming the spacers in the wafer itself or attaching spacer elements, particularly a wafer of spacer elements. The resultant integrated structure has controlled spacing between the bonded elements.