Patents by Inventor Stan Wietecha

Stan Wietecha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-module current sharing scheme
    Patent number: 7732941
    Abstract: A circuit provides multi-module current sharing for circuit modules. The circuit includes an error amplifier having a negative and a positive input and an output. The positive input of the error amplifier is connected to a reference voltage. A buffered differential amplifier has an output connected to the negative input of the error amplifier and a positive and a negative input. A correction current is sourced to the negative input of the buffered differential amplifier. A resistor connected to the negative input of the buffered differential amplifier has a value that controls the amount of current correction applied to the negative input of the buffer differential amplifier by the current correction source.
    Type: Grant
    Filed: July 10, 2007
    Date of Patent: June 8, 2010
    Assignee: Intersil Americas Inc.
    Inventors: Chun Cheung, Stan Wietecha
  • MULTI-MODULE CURRENT SHARING SCHEME
    Publication number: 20080238197
    Abstract: A circuit provides multi-module current sharing for circuit modules. The circuit includes an error amplifier having a negative and a positive input and an output. The positive input of the error amplifier is connected to a reference voltage. A buffered differential amplifier has an output connected to the negative input of the error amplifier and a positive and a negative input. A correction current is sourced to the negative input of the buffered differential amplifier. A resistor connected to the negative input of the buffered differential amplifier has a value that controls the amount of current correction applied to the negative input of the buffer differential amplifier by the current correction source.
    Type: Application
    Filed: July 10, 2007
    Publication date: October 2, 2008
    Applicant: INTERSIL AMERICAS, INC.
    Inventors: CHUN CHEUNG, STAN WIETECHA