Abstract: An electrical interconnect system includes a support element; and an array of groups of multiple electrically conductive contacts arranged on the support element such that at least one contact of each group includes a front surface facing outwardly and away from that group along a line initially intersected by a side surface of a contact from another one of the groups of the array. The groups may be arranged in a configuration such that the array has a density of at least 500, 600, or 1,000 contacts per square inch. One array may include groups of contacts (11) arranged around insulative buttresses (12), as shown in FIG. 5a, for example, and the other array may include groups of flexible beam contacts (31), as shown in FIG. 20, for example. Further, a group of contacts may include a zero-insertion-force component 60 having a bulbous member 64 for spreading apart the groups of contacts, as shown in FIGS. 24(a) and 24(b).

Abstract: A computer system including a plurality of air circulation areas to facilitate cooling of components with in the air circulation areas. Specifically, the system includes an air circulation area for a plurality of printed circuit boards, for a power supply, and for a plurality of internal and external peripherals, such as disk drives. The system also includes an automatic door that covers the external peripherals. The external peripherals slide forward, out of a casing of the system to facilitate upgrade and/or repair of the peripherals. In addition, the system includes cabling slots and structure to effect electromagnetic interference (EMI) shielding.

Abstract: An electrical interconnect system includes an insulative substrate, and a plurality of groups of electrically conductive contacts arranged on the substrate. The contacts are electrically isolated from one another, and the groups are interleaved among one another in a nested configuration. The system also includes a plurality of receiving-type interconnect components each for receiving one of the groups of contacts within that component. The nested configuration of the groups of contacts maintains the contacts in close proximity to one another and, at the same time, allows adequate clearance between the contacts so that each group may be received within one of the receiving-type interconnect components. In one embodiment, a device is provided to reduce the insertion force associated with mating by separating the contacts of the receiving-type interconnect components just prior to mating.

Abstract: An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of the multi-layer substrate, and an electrically conductive component formed within the well on the inner surface of the multi-layer substrate; and a device having at least one electrically conductive lead or wire extending into the well and being in direct physical contact with the electrically conductive component formed on the inner surface of the multi-layer substrate.

Abstract: A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the groups from adjacent columns, and a portion of each group overlaps into an adjacent row or an adjacent column of the groups of the array; a semiconductor die; and structure for providing electrical connection between the semiconductor die and the conductive contacts.

Abstract: An ultra-high density electrical interconnect system is described wherein the pins and sockets are generally triangular in cross-section. This configuration allows for a density of 400 or more contacts per square inch wherein the contacts are supported on a grid pattern having 50 mil or less spacing between intersections. Further, the substrate supporting the contacts need be no wider than 50 mil per row of contacts. Still further, at least three rows and columns of contacts may be provided with the 50 mil or less spacing.