Patents by Inventor Stanislas Pereverzev

Stanislas Pereverzev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM FOR A SINGLE-LAYER SENSOR HAVING REDUCED NUMBER OF INTERCONNECT PADS FOR THE INTERCONNECT PERIPHERY OF THE SENSOR PANEL
    Publication number: 20130100041
    Abstract: The structure disclosed reduces the number of bonding pads and interconnect traces in the opaque portion of a single-layer touch panel. By sharing and multiplexing the bonding pads in the opaque portion of panel, half as many pads are needed to provide the interconnection bases for the traces in the opaque portion of the panel that extend to the control electronics subsystem. Further, by connecting the ground plane structures that are adjacent to each TCO column electrode, all ground planes are made part of a common ground-plane electrode. That single common ground-plane electrode can be connected to the appropriate trace and control electronic subsystem using a single pad, rather than several individual ground-plane pads.
    Type: Application
    Filed: October 21, 2011
    Publication date: April 25, 2013
    Applicant: TOUCH TURNS LLC
    Inventors: Mykola Golovchenko, Stanislas Pereverzev, William Stacy