Abstract: Embodiments of a substrate are provided herein, which include: a first metal plane and a second metal plane in a first metal layer, the first and second metal planes laterally separated by a first gap of dielectric material; and a third metal plane and a fourth metal plane in a second metal layer vertically adjacent to the first metal layer, the third and fourth metal planes laterally separated by a second gap of dielectric material, wherein the second gap comprises a first laterally-shifted gap portion and a second laterally-shifted gap portion, the first laterally-shifted gap portion is laterally offset from a vertical footprint of the first gap in a first lateral direction, and the second laterally-shifted gap portion is laterally offset from the vertical footprint of the first gap in a second lateral direction opposite the first lateral direction.

Abstract: A semiconductor device includes a package substrate, a semiconductor die attached to a first major surface of the package substrate, and a plurality of wire bonds attached between the semiconductor die and the first major surface of the package substrate. The device further includes a conductive plate over the semiconductor die, plurality of wire bonds, and package substrate wherein a first major surface of the conductive plate faces the first major surface of the package substrate. The device further includes a plurality of conductive extensions attached to the first major surface of the conductive plate, wherein each conductive extension extends from the first major surface of the conductive plate and between two adjacent wire bonds of the plurality of wire bonds.

Abstract: A stacked monitor structure and method of measuring thicknesses of embedded layers in a build-up substrate is provided. The stacked monitor structure includes a multi-layer substrate having a first shape formed in a first conductive layer of the multi-layer substrate and a second shape formed in a second conductive layer of the multi-layer substrate, a region of the second shape overlapping the first shape. A first dielectric layer is disposed between the first conductive layer and the second conductive layer. A measuring device is configured to measure a thickness of the first conductive layer at a first location on the stacked monitor structure, a thickness of the second conductive layer at a second location on the stacked monitor structure, and a combined thickness of the first conductive layer, the second conductive layer, and the first dielectric layer at a third location on the stacked monitor structure.

Abstract: A stacked monitor structure and method of measuring thicknesses of embedded layers in a build-up substrate is provided. The stacked monitor structure includes a multi-layer substrate having a first shape formed in a first conductive layer of the multi-layer substrate and a second shape formed in a second conductive layer of the multi-layer substrate, a region of the second shape overlapping the first shape. A first dielectric layer is disposed between the first conductive layer and the second conductive layer. A measuring device is configured to measure a thickness of the first conductive layer at a first location on the stacked monitor structure, a thickness of the second conductive layer at a second location on the stacked monitor structure, and a combined thickness of the first conductive layer, the second conductive layer, and the first dielectric layer at a third location on the stacked monitor structure.

Abstract: The subject matter of this specification can be implemented in, among other things, a method for providing geographic location information. The method includes a step for receiving a request for geographic location information from a mobile device, wherein requested geographic location information includes latitude and longitude coordinates for one or more data transmission points (DTPs), wherein a DTP includes wireless access points and cellular towers. The method also includes a step for determining a set of anticipated data transmission points (DTPs), wherein the anticipated DTPs are those DTPs that the mobile device is anticipated to require in the future. The method also includes a step for retrieving geographic location information associated with at least a portion of the anticipated DTPs from a locations catalog server. The method also includes a step for sending at least a portion of the retrieved geographic location information to the requesting mobile device.

Abstract: Systems and methods for identifying mobile access points are provided. In one aspect, a method includes receiving an indication of an accessible access point and an indication of geographic location. The method also includes determining that a stored geographic location associated with the accessible access point is inconsistent with the indication of the geographic location. The method also includes providing, to a server and to a local memory, an indication that the accessible access point is a candidate mobile access point based on the determination that the stored geographic location is inconsistent with the indication of the geographic location.

Abstract: Systems and methods for identifying mobile access points are provided. In one aspect, a method includes receiving an indication of an accessible access point and an indication of geographic location. The method also includes determining that a stored geographic location associated with the accessible access point is inconsistent with the indication of the geographic location. The method also includes providing, to a server and to a local memory, an indication that the accessible access point is a candidate mobile access point based on the determination that the stored geographic location is inconsistent with the indication of the geographic location.

Abstract: A one-piece bowl including an open top, a bottom opening, a rim portion, an interior space and a plurality of cavities is provided. The rim portion substantially surrounds the bowl near the open top, and an inner channel is formed along and within the rim portion. The interior space is substantially defined by an interior surface, the open top and the bottom opening. The plurality of cavities extends from the inner channel to the interior space. The inner channel and the cavities are configured to pass fluid from an outer fluid source to the interior space. A mold assembly and a method for forming a one-piece greenware piece for the bowl are also provided. The mold assembly includes a top mold component and a bottom mold component that are configured to mate and thereby form a reservoir substantially defining the bowl.

Abstract: A one-piece bowl including an open top, a bottom opening, a rim portion, an interior space and a plurality of cavities is provided. The rim portion substantially surrounds the bowl near the open top, and an inner channel is formed along and within the rim portion. The interior space is substantially defined by an interior surface, the open top and the bottom opening. The plurality of cavities extends from the inner channel to the interior space. The inner channel and the cavities are configured to pass fluid from an outer fluid source to the interior space. A mold assembly and a method for forming a one-piece greenware piece for the bowl are also provided. The mold assembly includes a top mold component and a bottom mold component that are configured to mate and thereby form a reservoir substantially defining the bowl.

Abstract: Food products are disclosed. Methods of producing and distributing the food products are further disclosed.