Patents by Inventor Stanley Bay

Stanley Bay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8672231
    Abstract: A system for manufacturing an integrated circuit system having a substrate with a integrated circuit device. A first pad is formed on the substrate and connected to the integrated circuit device. A first dielectric layer is formed over the substrate and the first pad, with the first dielectric layer having an opening provided therein exposing the first pad. An upper redistribution layer is formed over the first dielectric layer. A portion of the upper redistribution layer is formed into an antenna with the antenna connected to the first pad. A second dielectric layer is formed over the first dielectric layer and over the antenna.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: March 18, 2014
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: David Yeo, Victor Tan, Marvin Lo, Kai Keong Cheong, Stanley Bay, Anthony Yong
  • Publication number: 20090014543
    Abstract: A system for manufacturing an integrated circuit system having a substrate with a integrated circuit device. A first pad is formed on the substrate and connected to the integrated circuit device. A first dielectric layer is formed over the substrate and the first pad, with the first dielectric layer having an opening provided therein exposing the first pad. An upper redistribution layer is formed over the first dielectric layer. A portion of the upper redistribution layer is formed into an antenna with the antenna connected to the first pad. A second dielectric layer is formed over the first dielectric layer and over the antenna.
    Type: Application
    Filed: September 22, 2008
    Publication date: January 15, 2009
    Applicant: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
    Inventors: David Yeo, Victor Tan, Marvin Lo, Kai Keong Cheong, Stanley Bay, Anthony Yong
  • Patent number: 7444735
    Abstract: A system for manufacturing an integrated circuit system having a substrate with a integrated circuit device. A first pad is formed on the substrate and connected to the integrated circuit device. A first dielectric layer is formed over the substrate and the first pad, with the first dielectric layer having an opening provided therein exposing the first pad. An upper redistribution layer is formed over the first dielectric layer. A portion of the upper redistribution layer is formed into an antenna with the antenna connected to the first pad. A second dielectric layer is formed over the first dielectric layer and over the antenna.
    Type: Grant
    Filed: June 2, 2005
    Date of Patent: November 4, 2008
    Assignee: Chartered Semiconductor Manufacturing Ltd.
    Inventors: David Yeo, Victor Tan, Marvin Lo, Kai Keong Cheong, Stanley Bay, Anthony Yong
  • Publication number: 20050276028
    Abstract: A system for manufacturing an integrated circuit system having a substrate with a integrated circuit device. A first pad is formed on the substrate and connected to the integrated circuit device. A first dielectric layer is formed over the substrate and the first pad, with the first dielectric layer having an opening provided therein exposing the first pad. An upper redistribution layer is formed over the first dielectric layer. A portion of the upper redistribution layer is formed into an antenna with the antenna connected to the first pad. A second dielectric layer is formed over the first dielectric layer and over the antenna.
    Type: Application
    Filed: June 2, 2005
    Publication date: December 15, 2005
    Applicant: CHARTERED SEMICONDUCTOR MANUFACTURING LTD.
    Inventors: David Yeo, Victor Tan, Marvin Lo, Kai Keong Cheong, Stanley Bay, Anthony Yong