Patents by Inventor Stanley C. Chu

Stanley C. Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Barrier layer enhancement in metallization scheme for semiconductor device fabrication
    Patent number: 5624874
    Abstract: The properties of a diffusion barrier material layer over a semiconductor substrate are enhanced in a simple and time-effective manner by immersing the substrate in an oxidizing liquid. For a titanium-tungsten barrier metal, a dip in nitric acid for 1-60 minutes provides the metal with an oxide layer of the right thickness of 10-20 .ANG..
    Type: Grant
    Filed: October 18, 1995
    Date of Patent: April 29, 1997
    Assignee: North America Philips Corporation
    Inventors: Sheldon C. P. Lim, Stanley C. Chu