Abstract: An integrated circuit (IC) package includes an interconnect. The interconnect has a connecting tie bar and a die pad. The IC package also includes a die mounted on the die pad of the interconnect. The IC package further includes a wire bond coupled to the die and the connecting tie bar to provide a current path between the die and the connecting tie bar.

Abstract: An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.

Abstract: An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.

Abstract: A method, apparatus, and program, for evaluating an optical network node. The method comprises providing at least one communication path of the node with a capability by which lasing can occur in the communication path, and detecting whether lasing has been established in the communication path to determine whether the optical node is operational. If no lasing is detected in the detecting, a fault exists in the communication path. The method further comprises determining an insertion loss in the communication path, and determining whether the insertion loss is comparable to a predetermined insertion loss, to confirm whether the node is configured correctly.

Abstract: A method, apparatus, and program, for evaluating an optical network node. The method comprises providing at least one communication path of the node with a capability by which lasing can occur in the communication path, and detecting whether lasing has been established in the communication path to determine whether the optical node is operational. If no lasing is detected in the detecting, a fault exists in the communication path. The method further comprises determining an insertion loss in the communication path, and determining whether the insertion loss is comparable to a predetermined insertion loss, to confirm whether the node is configured correctly.