Patents by Inventor Stanley Craig

Stanley Craig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fine pitch bumping with improved device standoff and bump volume
    Patent number: 6372622
    Abstract: Embodiments of the present invention relate generally to solder bump formation and semiconductor device assemblies. One embodiment related to a method for forming a bump structure includes providing a semiconductor device (10) having a bond pad (12), and forming a first masking layer (20) overlying the bond pad (12). The first masking layer (20) is patterned to form a first opening (22) overlying at least a portion of the bond pad (12). A second masking layer (40) is formed overlying the first masking layer (20), and the second masking layer (40) is patterned to form a second opening (42) overlying at least a portion of the first opening (22). The method further includes forming a stud (30) at least within the first opening (22) and a solder bump (60) at least within the second opening (42).
    Type: Grant
    Filed: October 26, 1999
    Date of Patent: April 16, 2002
    Assignee: Motorola, Inc.
    Inventors: Qing Tan, Stanley Craig Beddingfield, Douglas G. Mitchell
  • Flip chip bump structure and method of making
    Patent number: 5977632
    Abstract: A passivation layer (16) is formed over a substrate (10) having an interconnect pad (12, 13). An opening in the passivation layer (16) exposes a portion of the interconnect pad (12, 13). A polyimide structure (18, 20) is formed adjacent to the opening in the passivation layer 16. Under bump metallurgy (22, 24) is formed over at least a portion of the polyimide structure (18, 20). A solder bump (28, 26) is formed over the Under bump metallurgy (22, 24).
    Type: Grant
    Filed: February 2, 1998
    Date of Patent: November 2, 1999
    Assignee: Motorola, Inc.
    Inventor: Stanley Craig Beddingfield