Abstract: In infrared soldering of components onto circuit boards, where components such as leaded components are first soldered on one surface of a circuit board and then additional components are soldered on the other surface, it is a problem that the solder joints of the first arrangement of components may melt during the second soldering step. Also, heat is reflected from the apparatus and can raise the temperature of components above a defined maximum. In the invention, a heat sink is provided for absorbing heat from the infrared heat source when no circuit board is present, and for absorbing heat from components already soldered, during the second soldering step. Usually the infrared heat source is above the path of the circuit boards and the heat sink is below the path of, and not in contact with, the circuit boards.

Abstract: In the plating of wire, particularly gold plating of wire for terminal pins, obtaining a high quality fixed gold plate is a problem. The invention provides for testing the wire prior to plating to detect surface irregularities which affect the quality of the plate. A test length of wire has a length of tape wrapped spirally around, with at least an edge portion in contact with the wire. The wire, and tape, is then twisted, in the direction of the spiral of the tape, in a direction to tighten the tape. The tape is then unwound and the number of particles of wire material which have separated from the wire at defects adhere to the tape is counted. For premium grade wire, less than 6 defects per foot is a standard. Commercial grade wire, between 50 and 150 defects per foot is normal.