Patents by Inventor Stanley E. Eppert

Stanley E. Eppert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor polishing pad
    Publication number: 20020058468
    Abstract: A belt has a polishing pad with one or more polishing pad sections joined to the belt by an adhesive layer. A seam joint is reinforced with caulking material. Edge portions of the seam joint are beveled or dovetailed. Parallel stress relief grooves in the upper surface of the polishing pad prevent delamination of the polishing pad from the belt.
    Type: Application
    Filed: May 3, 2001
    Publication date: May 16, 2002
    Inventors: Stanley E. Eppert, Marco A. Acevedo, Peter W. Freeman, Tuyen Vo
  • Eliminating air pockets under a polishing pad
    Publication number: 20020002027
    Abstract: A polishing pad assembly is provided that is useful for the chemical mechanical polishing of glass and electrical devices such as semiconductor wafers that comprises a polish pad and a semi-rigid base material firmly adhered to the polishing pad for positioning on a polishing platen of a polishing machine; wherein the semi-rigid base material has a modulus of rigidity of 0.01-50 GPa (GigaPascals) determined according to ASTM D 790, a thickness of 0.25-15.0 mm, and a grooved surface having a pitch of 5-100 mm and the grooves have a width of 0.025-2.5 mm and a depth of 0.1-2.5 mm.
    Type: Application
    Filed: May 22, 2001
    Publication date: January 3, 2002
    Inventors: Stanley E. Eppert, Adam Manzonie, Peter W. Freeman, Elizabeth A. Langlois