Patents by Inventor Stanley E. Eppert

Stanley E. Eppert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Eliminating air pockets under a polished pad
    Patent number: 6561891
    Abstract: A polishing pad assembly is provided that is useful for the chemical mechanical polishing of glass and electrical devices such as semiconductor wafers that comprises a polish pad and a semi-rigid base material firmly adhered to the polishing pad for positioning on a polishing platen of a polishing machine; wherein the semi-rigid base material has a modulus of rigidity of 0.01-50 GPa (GigaPascals) determined according to ASTM D 790, a thickness of 0.25-15.0 mm, and a grooved surface having a pitch of 5-100 mm and the grooves have a width of 0.025-2.5 mm and a depth of 0.1-2.5 mm.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: May 13, 2003
    Assignee: Rodel Holdings, Inc.
    Inventors: Stanley E. Eppert, Jr., Adam Manzonie, Peter W. Freeman, Elizabeth A. Langlois
  • Semiconductor polishing pad
    Publication number: 20020058468
    Abstract: A belt has a polishing pad with one or more polishing pad sections joined to the belt by an adhesive layer. A seam joint is reinforced with caulking material. Edge portions of the seam joint are beveled or dovetailed. Parallel stress relief grooves in the upper surface of the polishing pad prevent delamination of the polishing pad from the belt.
    Type: Application
    Filed: May 3, 2001
    Publication date: May 16, 2002
    Inventors: Stanley E. Eppert, Marco A. Acevedo, Peter W. Freeman, Tuyen Vo
  • Polishing pad
    Patent number: 6358130
    Abstract: A polishing pad for use with a polishing fluid has, a polishing layer, a window in an opening through the polishing layer, and a fluid impermeable layer spanning across the polishing layer and the window and the opening to provide an uninterrupted continuous barrier to leakage of polishing fluid, the fluid impermeable layer having thereon an adhesive forming bond seals with the polishing layer and the window.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: March 19, 2002
    Assignee: Rodel Holdings, Inc.
    Inventors: Peter W. Freeman, Stanley E. Eppert, Jr., Alan H. Saikin, Marco A. Acevedo
  • Eliminating air pockets under a polishing pad
    Publication number: 20020002027
    Abstract: A polishing pad assembly is provided that is useful for the chemical mechanical polishing of glass and electrical devices such as semiconductor wafers that comprises a polish pad and a semi-rigid base material firmly adhered to the polishing pad for positioning on a polishing platen of a polishing machine; wherein the semi-rigid base material has a modulus of rigidity of 0.01-50 GPa (GigaPascals) determined according to ASTM D 790, a thickness of 0.25-15.0 mm, and a grooved surface having a pitch of 5-100 mm and the grooves have a width of 0.025-2.5 mm and a depth of 0.1-2.5 mm.
    Type: Application
    Filed: May 22, 2001
    Publication date: January 3, 2002
    Inventors: Stanley E. Eppert, Adam Manzonie, Peter W. Freeman, Elizabeth A. Langlois
  • Calenderable blends containing broad molecular weight distribution propylene polymer material
    Patent number: 5409992
    Abstract: Disclosed are calenderable blends consisting essentially of (A) a heterophasic olefin polymer composition and (B) a broad molecular weight distribution propylene polymer material, and film or sheet materials thereof.
    Type: Grant
    Filed: February 28, 1994
    Date of Patent: April 25, 1995
    Assignee: Himont Incorporated
    Inventor: Stanley E. Eppert, Jr.
  • Compositions of propylene polymer materials and olefin polymer materials with reduced gloss
    Patent number: 5338801
    Abstract: Disclosed is a polyolefin composition comprising (A) a propylene polymer material and (B) an olefin polymer material selected from the group consisting of a partially crosslinked thermoplastic elastomer composition, an olefin copolymer rubber and a mixture thereof.The polyolefin composition of this invention provides reduction in gloss.
    Type: Grant
    Filed: October 20, 1993
    Date of Patent: August 16, 1994
    Assignee: Himont Incorporated
    Inventor: Stanley E. Eppert, Jr.