Patents by Inventor Stanley Eckert

Stanley Eckert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12575035
    Abstract: A passive circuit element is disclosed. The passive circuit element includes an array of conductive pads arranged on a substrate such that a gap is formed between each of the conductive pads. The passive circuit element further includes a first wire electrically connected to a first conductive pad of the array of conductive pads such that the first wire passes through a first gap formed between a second conductive pad and a third conductive pad. The passive circuit element further includes a second wire electrically connected to a fourth conductive pad of the array of conductive pads such that the second wire passes through the first gap. At least one of the second and third conductive pads has a substantially planar side facing toward the first gap.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: March 10, 2026
    Assignee: International Business Machines Corporation
    Inventors: Stanley Eckert, Steven Louis Makow, Todd Edward Takken
  • Patent number: 11765849
    Abstract: A structure is provided for a structure for providing electrical connections across a connection interface is provided. The structure may include one or more signal connections, a plurality of reference connections, and one or more high-pass filters. One or more of the reference connections is configured to connect a first reference voltage in a first region on a first side of the interface with a second reference voltage in a second region on a second side of the interface. One or more of the reference connections in a first class of reference connections is coupled one or more of the reference voltages through the one or more high-pass filters, and low-bandwidth information is communicated across the one or more reference connections in the first class of reference connection.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: September 19, 2023
    Inventors: Stanley Eckert, Steven Louis Makow, Todd Edward Takken
  • Publication number: 20230292447
    Abstract: A passive circuit element is disclosed. The passive circuit element includes an array of conductive pads arranged on a substrate such that a gap is formed between each of the conductive pads. The passive circuit element further includes a first wire electrically connected to a first conductive pad of the array of conductive pads such that the first wire passes through a first gap formed between a second conductive pad and a third conductive pad. The passive circuit element further includes a second wire electrically connected to a fourth conductive pad of the array of conductive pads such that the second wire passes through the first gap. At least one of the second and third conductive pads has a substantially planar side facing toward the first gap.
    Type: Application
    Filed: March 14, 2022
    Publication date: September 14, 2023
    Inventors: Stanley Eckert, Steven Louis Makow, Todd Edward Takken
  • Publication number: 20230262919
    Abstract: A structure is provided for a structure for providing electrical connections across a connection interface is provided. The structure may include one or more signal connections, a plurality of reference connections, and one or more high-pass filters. One or more of the reference connections is configured to connect a first reference voltage in a first region on a first side of the interface with a second reference voltage in a second region on a second side of the interface. One or more of the reference connections in a first class of reference connections is coupled one or more of the reference voltages through the one or more high-pass filters, and low-bandwidth information is communicated across the one or more reference connections in the first class of reference connection.
    Type: Application
    Filed: February 16, 2022
    Publication date: August 17, 2023
    Inventors: Stanley Eckert, Steven Louis Makow, Todd Edward Takken