Patents by Inventor Stanley F. Tead

Stanley F. Tead has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
    Patent number: 6884833
    Abstract: Incorporating organophilic clay into hot melt adhesive compositions, particularly those comprising semi-crystalline, thermoplastic polymers, greatly improves the adhesive properties in many respects. Some of these improvements are particularly beneficial to the specific use of hot melt adhesives filled with electrically conductive particles for use as electrically conductive adhesives.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: April 26, 2005
    Assignee: 3M Innovative Properties Company
    Inventors: Theary Chheang, Andrew M. Hine, Mark W. Muggli, Susan C. Noe, Patricia M. Sanft, William J. Schultz, Robert D. Taylor, Stanley F. Tead
  • Adhesive compositions and methods of use
    Publication number: 20030236362
    Abstract: A screen-printable adhesive composition capable of being applied to a substrate at room temperature comprising at least one alkyl acrylate; at least one reinforcing comonomer, a polyepoxide resin, and a polyepoxide resin curing agent; wherein said composition is substantially solvent free and said composition has a yield point of greater than 3 Pascals and a viscosity of less than 6000 centipoise. In another aspect, the invention provides heat-curable electrically and/or thermally conductive adhesive films that are substantially solvent-free acrylic polymers further containing a polyepoxide resin, a polyepoxide resin curing agent, and an electrically conductive material and/or a thermally conductive material.
    Type: Application
    Filed: June 24, 2003
    Publication date: December 25, 2003
    Applicant: 3M Innovative Properties Company
    Inventors: Gregory L. Bluem, Christopher A. Haak, Fred B. McCormick, Stanley F. Tead
  • Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
    Publication number: 20030100654
    Abstract: Incorporating organophilic clay into hot melt adhesive compositions, particularly those comprising semi-crystalline, thermoplastic polymers, greatly improves the adhesive properties in many respects. Some of these improvements are particularly beneficial to the specific use of hot melt adhesives filled with electrically conductive particles for use as electrically conductive adhesives.
    Type: Application
    Filed: June 29, 2001
    Publication date: May 29, 2003
    Inventors: Theary Chheang, Andrew M. Hine, Mark W. Muggli, Susan C. Noe, Patricia M. Sanft, William J. Schultz, Robert D. Taylor, Stanley F. Tead
  • Adhesive compositions and methods of use
    Publication number: 20010028953
    Abstract: A screen-printable adhesive composition capable of being applied to a substrate at room temperature comprising at least one alkyl acrylate; at least one reinforcing comonomer, a polyepoxide resin, and a polyepoxide resin curing agent; wherein said composition is substantially solvent free and said composition has a yield point of greater than 3 Pascals and a viscosity of less than 6000 centipoise. In another aspect, the invention provides heat-curable electrically and/or thermally conductive adhesive films that are substantially solvent-free acrylic polymers further containing a polyepoxide resin, a polyepoxide resin curing agent, and an electrically conductive material and/or a thermally conductive material.
    Type: Application
    Filed: January 18, 2001
    Publication date: October 11, 2001
    Applicant: 3M Innovative Properties Company
    Inventors: Gregory L. Bluem, Christopher A. Haak, Fred B. McCormick, Stanley F. Tead
  • Adhesive compositions and methods of use
    Patent number: 6214460
    Abstract: A screen-printable adhesive composition capable of being applied to a substrate at room temperature comprising at least one alkyl acrylate; at least one reinforcing comonomer, a polyepoxide resin, and a polyepoxide resin curing agent; wherein said composition is substantially solvent free and said composition has a yield point of greater than 3 Pascals and a viscosity of less than 6000 centipoise. In another aspect, the invention provides heat-curable electrically and/or thermally conductive adhesive films that are substantially solvent-free acrylic polymers further containing a polyepoxide resin, a polyepoxide resin curing agent, and an electrically conductive material and/or a thermally conductive material.
    Type: Grant
    Filed: November 16, 1998
    Date of Patent: April 10, 2001
    Assignee: 3M Innovative Properties Company
    Inventors: Gregory L. Bluem, Christopher A. Haak, Fred B. McCormick, Jr., Stanley F. Tead