Patents by Inventor Stanley G. Markwell

Stanley G. Markwell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Edge-sealed substrates and methods for effecting the same
    Patent number: 6951778
    Abstract: Methods and systems of protecting substrates that are intended for use in fluidic devices are described. In accordance with one embodiment, sealant material is applied over one or more edges of at least one multi-chip module substrate that is intended for use in a fluidic device. At least one edge has an exposed electrical interconnect and the sealant material is applied over less than an entirety of the substrate and sufficiently to cover the exposed electrical interconnect. The sealant material is exposed to conditions effective to seal the one or more edges.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: October 4, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mohammad Akhavain, Stanley G. Markwell, Janis Horvath, Joseph E. Scheffelin
  • Edge-sealed substrates and methods for effecting the same
    Publication number: 20040087063
    Abstract: Methods and systems of protecting substrates that are intended for use in fluidic devices are described. In accordance with one embodiment, sealant material is applied over one or more edges of at least one multi-chip module substrate that is intended for use in a fluidic device. At least one edge has an exposed electrical interconnect and the sealant material is applied over less than an entirety of the substrate and sufficiently to cover the exposed electrical interconnect. The sealant material is exposed to conditions effective to seal the one or more edges.
    Type: Application
    Filed: October 31, 2002
    Publication date: May 6, 2004
    Inventors: Mohammad Akhavin, Stanley G. Markwell, Janis Horvath, Joseph E. Scheffelin