Patents by Inventor Stanley Gaicki

Stanley Gaicki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lower cost semiconductor package with good thermal properties
    Patent number: 4285003
    Abstract: An improved mounting base is disclosed in which a semiconductor die is mounted on a thin pedestal within a large counter bore in the mounting base or header of the transistor package.
    Type: Grant
    Filed: March 19, 1979
    Date of Patent: August 18, 1981
    Assignee: Motorola, Inc.
    Inventor: Stanley Gaicki
  • Ultrasonic bonding head
    Patent number: 4067039
    Abstract: A bonding head particularly suitable for ultrasonic bonding of larger dimensioned wires to electrically conductive metallic regions for the semiconductor field comprising a stepped impact surface for simultaneously effecting an ultrasonic bond between the wire and metallic conductive regions. The lowermost stepped portion of the impact surface insures that the wire is maintained in a stationary or positively-held position with respect to the conductive regions so as to then allow both the stepped surfaces to transmit ultrasonic energy and insure scrubbing action between the elements to be bonded.
    Type: Grant
    Filed: August 16, 1976
    Date of Patent: January 3, 1978
    Assignee: Motorola, Inc.
    Inventor: Stanley Gaicki
  • Ultrasonic bonding head
    Patent number: 4063673
    Abstract: A bonding head particularly suitable for ultrasonic bonding of larger dimensioned wires to electrically conductive metallic regions for the semiconductor field comprising a stepped impact surface for simultaneously effecting an ultrasonic bond between the wire and metallic conductive regions. The lowermost stepped portion of the impact surface insures that the wire is maintained in a stationary or positively-held position with respect to the conductive regions so as to then allow both the stepped surfaces to transmit ultrasonic energy and insure scrubbing action between the elements to be bonded.
    Type: Grant
    Filed: August 11, 1976
    Date of Patent: December 20, 1977
    Assignee: Motorola, Inc.
    Inventor: Stanley Gaicki
  • Bonding method for semiconductor device manufacture
    Patent number: 3996659
    Abstract: An improved method of semiconductor device manufacture is provided in which the surfaces of glass sealed feed-through terminals are mechanically abraded to a uniform matte finish prior to plating and subsequent assembly. The mechanical abrasion, which in the preferred embodiment is performed by dry sand blasting, reduces the cost and improves the yield in subsequent assembly bonding steps and in particular substantially eliminates cold forming defects on the terminal nail head surface such that electrical conductors can be ultrasonically bonded thereto.
    Type: Grant
    Filed: February 10, 1976
    Date of Patent: December 14, 1976
    Assignee: Motorola, Inc.
    Inventors: Stanley Gaicki, Albert Louis Summers