Patents by Inventor Stanley J. Allen

Stanley J. Allen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reservoir stencil with relief areas and method of using
    Patent number: 6722275
    Abstract: A stencil comprising two or more layers is disclosed for applying surface mount materials onto printed circuit boards, flexible circuits, wafers or other substrates. The stencil can accommodate preexisting surface mount components and materials. The stencil utilizes material reservoirs, relief areas and delivery apertures and can be used for depositing surface mount materials such as adhesives, conductive glues, solder paste and solder balls.
    Type: Grant
    Filed: February 14, 2002
    Date of Patent: April 20, 2004
    Assignee: Photo Stencil, LLC
    Inventors: William E. Coleman, Stanley J. Allen, Michele Gaddy
  • Reservoir stencil with relief areas
    Publication number: 20030061948
    Abstract: A stencil comprising two or more layers is disclosed for applying surface mount materials onto printed circuit boards, flexible circuits, wafers or other substrates. The stencil can accommodate preexisting surface mount components and materials. The stencil utilizes material reservoirs, relief areas and delivery apertures and can be used for depositing surface mount materials such as adhesives, conductive glues, solder paste and solder balls.
    Type: Application
    Filed: February 14, 2002
    Publication date: April 3, 2003
    Inventors: William E. Coleman, Stanley J. Allen, Michele Gaddy