Abstract: UV curable compositions and methods for depositing one or more metal or metal alloy films on substrates are disclosed. The UV curable compositions contain a catalyst, one or more carrier particles, one or more UV curing agents, and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.

Abstract: UV curable compositions and methods for depositing one or more metal or metal alloy films on substrates are disclosed. The UV curable compositions contain a catalyst, one or more carrier particles, one or more UV curing agents, and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.

Abstract: UV curable compositions and methods for depositing one or more metal or metal alloy films on substrates are disclosed. The UV curable compositions contain a catalyst, one or more carrier particles, one or more UV curing agents, and one or more water-soluble or water-dispersible organic compounds. Metal or metal alloys may be deposited on the substrates by electroless or electrolytic deposition.

Abstract: A UV curable composition comprising a UV curable epoxy-functional essentially solvent free reactant, and a UV curing agent, and a conductive filler, said conductive filler present at a selected concentration, particle size distribution and shape, wherein said composition, subsequent to cure, provides a deposited conductive film whose conductivity is controlled by said conductive filler concentration, particle size distribution and shape.

Abstract: A C4 or flip chip reworkable electronic device is provided comprising an integrated circuit chip having conductive pads thereon which pads are electrically connected to corresponding pads on an interconnection substrate by solder connections, wherein the space between the chip and substrate is sealed using a specially defined thermoplastic resin such as polysulfone and polyetherimide.

Abstract: A C4 or flip chip reworkable electronic device is provided comprising integrated circuit chip having conductive pads thereon which pads are electrically connected to corresponding pads on an interconnection substrate by solder connections, wherein the space between the chip and substrate is sealed using a specially defined thermoplastic resin such as polysulfone and polyetherimide.

Abstract: Fully cyclized polyimides based on aromatic tetracarboxylic acid dianhydrides with substitution in the positions ortho to the bridging moiety and aromatic diamines, exhibiting solubility in organic solvents, increased glass transition temperatures, low coefficients of thermal expansion and photoimagability; said polyimides being suitable for the production of films, protective coatings and photolithographic relief images.

Abstract: Processable conductive polymers and a method for their production are disclosed. The processable conductive organic polymers comprise the cationic electropolymerized polymer of an electropolymerizable monomer and, as a counterion in affiliation therewith, a polymer being anionic surface character, the counterion polymer having effective to confer processability. During the production of the conductive polymer from the electropolymerizable monomer, a polymeric electrolyte having anionic surface character is present as a dispersed phase and functions as the counterion.

Abstract: Processable conductive polymers and a method for their production are disclosed. The processable conductive organic polymers comprise the cationic electropolymerized polymer of an electropolymerizable monomer and, as a counterion in affiliation therewith, a polymer having anionic surface character, the counterion polymer being effective to confer processability. During the production of the conductive polymer from the electropolymerizable monomer, a polymeric electrolyte having anionic surface character is present as a dispersed phase and functions as the counterion.

Abstract: The present invention relates to copolyimides of 100-70 mol % of recurring structural units of the formula I and 0-30 mol % of recurring structural units of the formula II ##STR1## in which z.sup.a is a tetravalent aromatic tetracarboxylic acid radical other than that of thioxanthonetetracarboxylic acid, the carboxyl groups thereof in each case being located in pairs in the ortho-position or peri-position relative to one another, and x.sup.a is a divalent aromatic diamine radical which, in at least one ortho-position relative to at least one nitrogen atom, carries a hydrocarbon substituent having at least one aliphatic .alpha.-hydrogen atom or x.sup.a is a radical of the formula III ##STR2## in which X.sup.c is a divalent aromatic diamine radical which, in ortho-position relative to both nitrogen atoms, carries in each case at least one mono-valent hydrocarbon substituent having at least one aliphatic .alpha.-hydrogen atom, n assumes an average value of 1.0 to 2.5, Z.sup.b is as defined for Z.sup.a and X.sup.

Abstract: Aromatic dianhydrides being substituted in the positions ortho to the bridging moiety, said substituent groups including halogen, alkyl, hydroxy, nitro, cyano, ester, alkoxy, perfluoroalkyl, mercapto and thioester groups, said dianhydrides providing certain beneficial properties to polyimides prepared therefrom.

Abstract: The present invention relates to copolyimides of 100-70 mol % of recurring structural units of the formula I and 0-30 mol % of recurring structural units of the formula II ##STR1## in which Z.sup.a is a tetravalent aromatic tetracarboxylic acid radical other than that of thioxanthonetetracarboxylic acid, the carboxyl groups thereof in each case being located in pairs in the ortho-position or peri-position relative to one another, and X.sup.a is a divalent aromatic diamine radical which, in at least one ortho-position relative to at least one nitrogen atom, carries a hydrocarbon substituent having at least one aliphatic .alpha.-hydrogen atom or X.sup.a is a radical of the formula III ##STR2## in which X.sup.c is a divalent aromatic diamine radical which, in ortho-position relative to both nitrogen atoms, carries in each case at least one monovalent hydrocarbon substituent having at least one aliphatic .alpha.-hydrogen atom, n assumes an average value of 1.0 to 2.5, Z.sup.b is as defined for Z.sup.a and X.sup.

Abstract: Processable conductive polymers prepared by an oxidative polymerization are disclosed. A monomer which is oxidatively polymerizable into an electrically conductive polymer is polymerized with the aid of a chemical oxidizing agent in a reaction medium containing a dispersed phase of a polymeric counterion having anionic surface character. The polymeric counterion, which is in affiliation with the oxidatively polymerized polymer, confers processability to the conductive polymer material.

Abstract: The invention comprises processing together an electropolymerized polymer and the anode on which it is formed by shaping them or by size reducing them and dispersing the resulting size reduced material into a liquid vehicle for production of a coatable composition.

Abstract: Photographic diffusion transfer film units including polymeric diffusion control layers are disclosed. The diffusion control layers comprise polymers which are hydrolyzable in an alkaline medium so as to convert a layer comprising one or more of the polymers from a condition of impermeability to alkali or materials soluble in or solubilized by an aqueous alkaline processing composition to a condition of substantial permeability thereto.

Abstract: The present invention relates to itaconamide compounds of the formula ##STR1## wherein R is hydrogen, alkyl, aryl, alkaryl, or aralkyl and to a method of preparing the subject compounds which comprises preparing a mixed anhydride of 2-methylenesuccinamic acid and reacting the mixed anhydride with a compound of the formula RNH.sub.2, wherein R is as previously defined, to provide the corresponding itaconamide compound.

Abstract: A process for preparing 2-methylene-1,3-propanediamide is disclosed which comprises providing a solution of a novel compound of the formula ##STR1## wherein R.sub.1, R.sub.2, and R.sub.3 can each independently be lower alkyl of from 1 to 10 carbon atoms, aryl, alkaryl, aralkyl, or halogen and X is an electron-accepting leaving group, in an inert, aprotic organic solvent, and subjecting the compound in solution to .beta.-elimination reaction conditions effective to eliminate the silyl group ##STR2## and the electron-accepting leaving group--Xfrom the compound to form a double bond between those carbon atoms to which the silyl group and the electron-accepting leaving group were bonded, thereby forming 2-methylene-1,3-propanediamide. 2-Methylene-1,3-propanediamide is useful in preparing polymers which can be used in preparing coating compositions, films, and filaments.