Abstract: A positioning system, a robot that employs the positioning system and a method of assembling the robot. The positioning system typically includes a stator and a linear variable reluctance motor that moves along the stator, wherein the stator, besides having an electromagnetic purpose, also acts as the sole structural beam element for the motor to rest upon. The robot employs the positioning system such that subsystems can be attached directly to the motor.

Abstract: A variable reluctance linear motor comprising a motor system, that includes a bearing assembly and a spacer block that is incorporated into the motor so as to guarantee that an air gap that is maintained between the motor and stator during relative motion there between. The invention further includes means to replace the bearing assembly(s) and winding(s) that can be used with the motor and a method of assembly.

Abstract: A variable reluctance linear motor comprising a motor system, that includes a bearing assembly that is incorporated into the motor so as to guarantee that an air gap is maintained between the motor and stator during relative motion there between. The invention further includes means to replace the bearing assembly(s) and winding(s) that can be used with the motor and a method of assembly.

Abstract: A mechanism for handling semiconductor wafers includes a feed section which comprises a vertically movable elevator able to hold a number of vertically spaced carriers. Each carrier has a film frame mounted thereon for supporting a wafer. A pulling mechanism pulls a selected carrier out of the elevator along a first axis and into a pick and place section. A transfer mechanism removes individual dies from the wafer and moves them to a flip station along a second axis oriented perpendicularly to the first axis. The transfer mechanism can move different distances along the second axis to be able to remove dies arranged in a row along the second axis. The flip station is driven by a single motor to both lower and invert the dies.

Abstract: A dual lane board handling apparatus includes a first zone including first and second parallel pairs of rails extending in a first direction; a second zone including third and fourth parallel pairs of rails extending in the first direction; first tracks supporting the first and second pairs of rails so that the first and second pairs of rails can move on the first tracks in a second direction perpendicular to the first direction; a drive for moving the first pair of rails on the first tracks in the second direction such that the first pair of rails can be selectively moved between a first orientation wherein it is in alignment with the fourth pair of rails and a second orientation wherein it is in alignment with the third pair of rails; a drive for moving the second pair of rails in the second direction; and belts on the first, second, third, and fourth pairs of rails for conveying boards along the rails in the first direction.

Abstract: A dual lane board handling apparatus includes a first zone including first and second parallel pairs of rails extending in a first direction; a second zone including third and fourth parallel pairs of rails extending in the first direction; first tracks supporting the first and second pairs of rails so that the first and second pairs of rails can move on the first tracks in a second direction perpendicular to the first direction; a drive for moving the first pair of rails on the first tracks in the second direction such that the first pair of rails can be selectively moved between a first orientation wherein it is in alignment with the fourth pair of rails and a second orientation wherein it is in alignment with the third pair of rails; a drive for moving the second pair of rails in the second direction; and belts on the first, second, third, and fourth pairs of rails for conveying boards along the rails in the first direction.

Abstract: An apparatus is provided for trimming and forming the leads of multi-lead electronic components such as dual in-line package (DIP) components, wherein component leads extending through the holes of a circuit board are trimmed and formed on the underside thereof, with the presence or absence of each lead being detected after trimming and during forming thereof.

Abstract: A method and apparatus are provided to form leads of components prior to insertion into a printed circuit board while, at the same time, straightening bent leads and testing the electronic functioning of each component through the use of a controller which electronically simulates the operating mode of the component. The orientation of the component is also tested.

Abstract: An apparatus is provided for individually selecting a number of dual in-line (DIP) components and sequentially inserting them into a printed circuit board. The apparatus has a basic mode of operation, under a program control, and comprises a shuttle assembly and a component insertion assembly. In operation, the shuttle assembly transfers a component from a selected one of a plurality of magazines to an unload station. At the unload station, the shuttle assembly loads the insertion assembly which rotates to a vertical position for insertion of the component in a printed circuit board. The printed circuit board is mounted on an X-Y positioning system controlled by a tape reader or a computer which also determines the automatic sequencing of the shuttle assembly.

Abstract: Two or four lead DIP components are stored in a generally vertical, adjustable chute for gravity feed during lateral removal of a single component by a coacting shuttle tooling clamp arm from the bottom of the supply. Individual component removal is facilitated by a spring biased plunger for blocking removal of the bottom-most component until the coacting clamp arm raises the plunger against the action of the spring biasing.