Patents by Inventor Stanley Job Doraisamy

Stanley Job Doraisamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC DEVICE AND METHOD OF MANUFACTURING
    Publication number: 20090189259
    Abstract: An electronic device and method of manufacturing. One embodiment includes attaching a first semiconductor chip to a first metallic clip. The first semiconductor chip is placed over a leadframe after the attachment of the first semiconductor chip to the first metallic clip.
    Type: Application
    Filed: January 28, 2008
    Publication date: July 30, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Abdul Rahman Mohamed, Stanley Job Doraisamy, Tien Lai Tan, Ralf Otremba
  • SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING
    Publication number: 20090045493
    Abstract: A semiconductor component and method for producing. The semiconductor component includes a semiconductor device and a leadframe. A package layout is defined and the orientation of electrically conductive members with respect to the semiconductor device and inner contact areas of the leadframe is altered so as to maximize the interfacial bonding area. The constraints of the standard package dimensions and the component assembly method are taken into account.
    Type: Application
    Filed: September 27, 2005
    Publication date: February 19, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Wae Chet Yong, Mohd Fauzi HJ Mahat, Stanley Job Doraisamy, Tien Lai Tan
  • SEMICONDUCTOR DEVICE INCLUDING ISOLATION LAYER
    Publication number: 20080173992
    Abstract: A semiconductor device includes a carrier, a semiconductor chip including an active area on a first face and a separate isolation layer applied to a second face, and an adhesion material coupling the isolation layer to the carrier with the second face facing the carrier.
    Type: Application
    Filed: July 16, 2007
    Publication date: July 24, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Joachim Mahler, Wae Chet Yong, Stanley Job Doraisamy, Gerhard Deml, Rupert Fischer, Reimund Engl
  • Method of Forming Component Package
    Publication number: 20080160677
    Abstract: There is provided a method of forming a component package. The method includes the steps of providing the die pad or heat sink, forming an isolation layer on the rear surface of the die pad or heat sink and encapsulating the die pad with encapsulating material in a mold cavity after forming the isolation layer on the rear of the die pad or heat sink.
    Type: Application
    Filed: March 15, 2008
    Publication date: July 3, 2008
    Inventors: Soon Hock TONG, Wae Chet YONG, Stanley JOB DORAISAMY