Abstract: A vehicle having an exoskeleton exterior panel that provides crash resistance is described. The exterior panel may be formed from a monolithic metal sheet and attached to an exterior portion of the vehicle frame, and the exterior panel does not comprise an additional support structure. At least one component may be directly attached to the exterior panel, and the exterior panel may bear the load of the at least one component. Methods of manufacturing the vehicle are also described.

Abstract: This invention is related to an apparatus for attaching resists and wafers to substrates, including: first and a second moving devices for moving substrates and wafers respectively; a first tank for containing an adhesive agent; a dispensing device which dispenses a predetermined amount of the adhesive agent at the central region of the wafer; a third moving device for placing the substrate on the wafer, a compressing device which compresses the substrate to squeeze out any possible air bubble existing within the adhesive agent between the substrate and the wafer; a second tank for containing the adhesive agent; a fourth moving device for moving the attached substrate and the wafer together to the second tank such that the complete area of the wafer at the side thereof opposite to the substrate is covered with the adhesive agent in an appropriate amount; a mold having a plurality of cavities arranged in a required pattern; a supplying device for providing a plurality of resists on the mold; a shake-and-load d

Abstract: A leaded semiconductor device package for nonsoldering assembling is disclosed. In the package of the invention, both leads of a semiconductor device package are flattened, cut and bent by automatic machines on the bais of conventional packaging process. Unlike a conventional semiconductor device package which is electrically connected to a circuit by soldering, the flattened and bent parts of both leads of the semiconductor device package can be electrically connected to a circuit by elastically contacting and directly assembling without soldering.

Abstract: A leaded semiconductor device package for nonsoldering assembling is disclosed. In the package of the invention, both leads of a semiconductor device package are flattened, cut and bent by automatic machines on the bais of conventional packaging process. Unlike a conventional semiconductor device package which is electrically connected to a circuit by soldering, the flattened and bent parts of both leads of the semiconductor device package can be electrically connected to a circuit by elastically contact and directly assembling without soldering.

Abstract: Techniques for computing power and delay values for macrocells in an ASIC design are described whereby the power or delay values are encoded as a multi-dimensional mathematical expression relating the power or delay value to the values of a plurality of operating conditions. The mathematical expression is derived from a multiple regression analysis of a plurality of power or delay sample values determined for a plurality of specific operating conditions. Delay values are derived directly from the mathematical relationship. Power dissipation values are determined by encoding current draw as a function of the various operating conditions. When a predicted current draw value is computed, it is multiplied by a value of power supply voltage to determine power dissipation.