Patents by Inventor Stanley Louie

Stanley Louie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10424393
    Abstract: Dynamic redundancy buffers for use with a device are disclosed. The dynamic redundancy buffers allow a memory array of the device to be operated with high write error rate (WER). A first level redundancy buffer (e1 buffer) is couple to the memory array. The e1 buffer may store data words that have failed verification or have not been verified. The e1 buffer may transfer data words to another dynamic redundancy buffer (e2 buffer). The e1 buffer may transfer data words that have failed to write to a memory array after a predetermined number of re-write attempts. The e1 buffer may also transfer data words upon power down.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: September 24, 2019
    Assignee: SPIN MEMORY, INC.
    Inventors: Mourad El Baraji, Neal Berger, Benjamin Stanley Louie, Lester M. Crudele, Daniel L. Hillman, Barry Hoberman
  • Patent number: 10366775
    Abstract: Dynamic redundancy buffers for use with a device are disclosed. The dynamic redundancy buffers allow a memory array of the device to be operated with high write error rate (WER). A first level redundancy buffer (e1 buffer) is couple to the memory array. The e1 buffer may store data words that have failed verification or have not been verified. The e1 buffer may transfer data words to another dynamic redundancy buffer (e2 buffer). The e1 buffer may transfer data words that have failed to write to a memory array after a predetermined number of re-write attempts. The e1 buffer may also transfer data words upon power down.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: July 30, 2019
    Assignee: SPIN MEMORY, INC.
    Inventors: Mourad El-Baraji, Neal Berger, Benjamin Stanley Louie, Lester M Crudele, Daniel L Hillman, Barry Hoberman
  • Patent number: 10366774
    Abstract: Dynamic redundancy registers for use with a device are disclosed. The dynamic redundancy registers allow a memory bank of the device to be operated with high write error rate (WER). A first level redundancy register (e1 register) is couple to the memory bank. The e1 register may store data words that have failed verification or have not been verified. The e1 register may transfer data words to another dynamic redundancy register (e2 register). The e1 register may transfer data words that have failed to write to a memory bank after a predetermined number of re-write attempts. The e1 register may also transfer data words upon power down.
    Type: Grant
    Filed: September 27, 2016
    Date of Patent: July 30, 2019
    Assignee: Spin Memory, Inc.
    Inventors: Mourad El Baraji, Neal Berger, Benjamin Stanley Louie, Lester M. Crudele, Daniel L. Hillman, Barry Hoberman
  • Patent number: 10115446
    Abstract: A nonvolatile error buffer is added to STT-MRAM memory design to reduce the error correction coding ECC required to achieve reliable operation with a non-zero Write Error Rate (“WER”). The error buffer is fully associative, storing both the address and the data of memory words which have failed to write correctly within an assigned ECC error budget. The write cycle includes a verify to determine if the word has been written correctly. The read cycle includes a search of the error buffer to determine if the address is present in the buffer.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: October 30, 2018
    Assignee: SPIN TRANSFER TECHNOLOGIES, INC.
    Inventors: Benjamin Stanley Louie, Neal Berger
  • Publication number: 20180114590
    Abstract: Dynamic redundancy buffers for use with a device are disclosed. The dynamic redundancy buffers allow a memory array of the device to be operated with high write error rate (WER). A first level redundancy buffer (e1 buffer) is couple to the memory array. The e1 buffer may store data words that have failed verification or have not been verified. The e1 buffer may transfer data words to another dynamic redundancy buffer (e2 buffer). The e1 buffer may transfer data words that have failed to write to a memory array after a predetermined number of re-write attempts. The e1 buffer may also transfer data words upon power down.
    Type: Application
    Filed: December 20, 2017
    Publication date: April 26, 2018
    Inventors: Mourad EL-BARAJI, Neal BERGER, Benjamin Stanley LOUIE, Lester M CRUDELE, Daniel L HILLMAN, Barry HOBERMAN
  • Publication number: 20180114589
    Abstract: Dynamic redundancy buffers for use with a device are disclosed. The dynamic redundancy buffers allow a memory array of the device to be operated with high write error rate (WER). A first level redundancy buffer (e1 buffer) is couple to the memory array. The e1 buffer may store data words that have failed verification or have not been verified. The e1 buffer may transfer data words to another dynamic redundancy buffer (e2 buffer). The e1 buffer may transfer data words that have failed to write to a memory array after a predetermined number of re-write attempts. The e1 buffer may also transfer data words upon power down.
    Type: Application
    Filed: December 20, 2017
    Publication date: April 26, 2018
    Inventors: Mourad EL-BARAJI, Neal BERGER, Benjamin Stanley LOUIE, Lester M. CRUDELE, Daniel L. HILLMAN, Barry HOBERMAN
  • Publication number: 20180090226
    Abstract: Dynamic redundancy registers for use with a device are disclosed. The dynamic redundancy registers allow a memory bank of the device to be operated with high write error rate (WER). A first level redundancy register (e1 register) is couple to the memory bank. The e1 register may store data words that have failed verification or have not been verified. The e1 register may transfer data words to another dynamic redundancy register (e2 register). The e1 register may transfer data words that have failed to write to a memory bank after a predetermined number of re-write attempts. The e1 register may also transfer data words upon power down.
    Type: Application
    Filed: September 27, 2016
    Publication date: March 29, 2018
    Inventors: Mourad EL BARAJI, Neal BERGER, Benjamin Stanley LOUIE, Lester M. CRUDELE, Daniel L. HILLMAN, Barry Hoberman
  • Patent number: 8645252
    Abstract: The present invention relates to a method and system for offering mandatorily convertible securities (e.g., DECS) with associated forward purchase contracts and call options. Each mandatorily convertible security combines a forward purchase contract, a mandatory portable remarketable security, and a call option to form a single investment unit. The call option provides additional capital to the issuer of the investment unit and profits to the remarketing agent handling the mandatory portable remarketable security.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: February 4, 2014
    Assignee: Citigroup Global Markets, Inc.
    Inventors: John Dickey, Adam Dohrenwend, Peter Jurdjevic, Daniel Khouri, Stanley Louie, Vincent Vignale
  • Patent number: 8504453
    Abstract: The present invention relates to a method and system for offering mandatorily convertible securities (e.g., DECS) with associated forward purchase contracts and call options. Each mandatorily convertible security combines a forward purchase contract, a mandatory portable remarketable security, and a call option to form a single investment unit. The call option provides additional capital to the issuer of the investment unit and profits to the remarketing agent handling the mandatory portable remarketable security.
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: August 6, 2013
    Assignee: Citigroup Global Markets Inc.
    Inventors: John Dickey, Adam Dohrenwend, Peter Jurdjevic, Daniel Khouri, Stanley Louie, Vincent Vignale
  • Patent number: 7877324
    Abstract: A system and method for issuing letters of credit. The system and method issue a first letter of credit from a second party to a third party, and issue at least one second letter of credit from the third party to at least one fourth party. The system and method also provide a credit facility from the second party to a first party, the credit facility associated with the first and second letters of credit. The system and method also transfer credit risk from the credit facility to at least one fifth party under a participation agreement.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: January 25, 2011
    Assignee: Citigroup Global Markets, Inc.
    Inventors: Rick Caplan, Marcy Engel, Steve Incontro, Stanley Louie, Frank Pertusiello
  • Patent number: 7801790
    Abstract: Securities, methods for raising capital using such securities, and systems for managing such securities are provided. The securities provide protection in bankruptcy to investors for a portion of deferred distributions earned by the investor on the security. The security may also provide a call protection period with limitations on capital replacement, and optional and/or mandatory deferral of distributions.
    Type: Grant
    Filed: August 17, 2006
    Date of Patent: September 21, 2010
    Assignee: Citigroup Global Markets Inc.
    Inventors: John W. Dickey, Adam Dohrenwend, Stanley Louie, Michael Regan, Laura Stephenson, Vincent Vignale, Jee-Won Yang
  • Publication number: 20060136331
    Abstract: A system and method for issuing letters of credit. The system and method issue a first letter of credit from a second party to a third party, and issue at least one second letter of credit from the third party to at least one fourth party. The system and method also provide a credit facility from the second party to a first party, the credit facility associated with the first and second letters of credit. The system and method also transfer credit risk from the credit facility to at least one fifth party under a participation agreement.
    Type: Application
    Filed: December 22, 2004
    Publication date: June 22, 2006
    Inventors: Rick Caplan, Marcy Engel, Steve Incontro, Stanley Louie, Frank Pertusiello
  • Publication number: 20060055308
    Abstract: A plasma display filter includes five metallic layers, such as silver alloy layers, having a combined thickness that exceeds 50 nm. The metallic layers form an alternating pattern with dielectric layers, where the layer in the pattern closest to a supporting substrate is the first of the dielectric layers. Layer thicknesses are selected to achieve a low reflected color shift with changes in the viewing angle, relatively neutral transmitted color properties, and desirable shielding characteristics with respect to infrared and electromagnetic radiation.
    Type: Application
    Filed: September 16, 2004
    Publication date: March 16, 2006
    Inventors: Bruce Lairson, Stanley Louie, Chris Schmidt, Erik Gaderlund