Abstract: A semiconductor device system for coupling with external circuitry. The system includes a control signal on a carrier substrate. A semiconductor device is attached to the carrier substrate with an impedance matching device coupled to the control signal.

Abstract: A semiconductor device system for coupling with external circuitry. The system includes a control signal on a carrier substrate. A semiconductor device is attached to the carrier substrate with an impedance matching device coupled to the control signal.

Abstract: A SIMM (single in-line memory module) board is provided with a plurality of integrated semiconductor memory or other integrated semiconductor circuit devices which include, as a part of each integrated circuit device, a current spike leveling capacitor. The capacitor is on the die side of circuitry connecting the device to the board. By connecting the on-chip capacitors of the integrated circuit devices in parallel, sufficient capacitance is provided to stabilize current to all of the integrated circuit devices.

Abstract: A SIMM (single in-line memory module) board is provided with a plurality of integrated semiconductor memory or other integrated semiconductor circuit devices which include, as a part of each integrated circuit device, a current spike leveling capacitor. The capacitor is on the die side of circuitry connecting the device to the board. By connecting the on chip capacitors of the integrated circuit devices in parallel, sufficient capacitance is provided to stabilize current to all of the circuit devices.

Abstract: A SIMM (single in-line memory module) board is provided with a plurality of integrated semiconductor memory or other integrated semiconductor circuit devices which include, as a part of each integrated circuit device, a current spike leveling capacitor. The capacitor is on the die side of circuitry connecting the device to the board. By connecting the on-chip capacitors of the integrated circuit devices in parallel, sufficient capacitance is provided to stabilize current to all of the integrated circuit devices.

Abstract: A carrier injected dynamic random access memory is defined. A depletion region adjacent to a source/drain region of a transistor is used as a storage cell in a memory array, and logic levels may then be measured by sensing the conductive portion. A low logic level is stored by a reduced formation of the depletion adjacent the conductive portion. These logic levels are sensed and periodically refreshed by conduction through the access device. The logic levels may be read by measuring potential through the access device, or by measuring punch through voltage between the source/drain region and a nearby conductive region. As the level of injected carriers increases, the punch through also increases. A punch through results in a readable increase in current through the access device, thereby providing an indicia of a in logic level.

Abstract: A SIMM (single in-line memory module) board is provided with a plurality of semiconductor memory devices which include, as a part of each memory device, a current spike leveling capacitor. The capacitor is on the die side of circuitry connecting the memory device to the board. By connecting the on-chip capacitors of the memory devices in parallel, sufficient capacitance is provided to stabilize current to all of the memory devices.