Abstract: This invention relates to a curable silicone composition comprising: (A) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by the following average unit formula: (R1SiO3/2)a(R12SiO2/2)b(R13SiO1/2)c(SiO4/2)d(XO1/2)e wherein, R1 each independently represent an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, an aralkyl group having from 7 to 20 carbons, or a group in which some or all of the hydrogen atoms of these groups are substituted with halogen atoms, with the proviso that at least two R1 in a molecule are the alkenyl groups, X is a hydrogen atom or an alkyl group, a is a number from 0 to 0.3, b is 0 or a positive number, c is a positive number, d is a positive number, e is a number from 0 to 0.4, a+b+c+d=1, c/d is a number from 0 to 10, and b/d is a number from 0 to 0.

Abstract: A copolymer composition is provided that is formed as the reaction product of (I) a cured polyorganosiloxane intermediate having repeating Si—O—Si units and at least one Si—OH functional group and (II) a polyfluoropolyether silane. The cured polyorganosiloxane intermediate has a surface having a water contact angle ranging from 40° to 90° as measured by ASTM 5946-04. In certain embodiments, the copolymer composition provides improved dust resistance as compared with cured polyorganosiloxanes from which the copolymer composition is formed.

Abstract: A composition comprises (A) a silicone resin; (B) an organosilicon compound; (C) a hydrosilylation catalyst; and (D) a flame retardant component comprising aluminum hydroxide. The composition further comprises (E) a reflective component different from component (D) and comprising titanium dioxide. The composition forms articles having excellent physical properties, including reflectance, flame retardant properties, and self-extinguishing properties. An article formed from the composition and a method of forming a molded article are also provided.

Abstract: This invention relates to a curable silicone composition comprising: (A) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by the following average unit formula: (R1SiO3/2)a (R12SiO2/2)b(R13SiO1/2)c(SiO4/2)d(XO1/2)e wherein, R1 each independently represent an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, an aralkyl group having from 7 to 20 carbons, or a group in which some or all of the hydrogen atoms of these groups are substituted with halogen atoms, with the proviso that at least two R1 in a molecule are the alkenyl groups, X is a hydrogen atom or an alkyl group, a is a number from 0 to 0.3, b is 0 or a positive number, c is a positive number, d is a positive number, e is a number from 0 to 0.4, a+b+c+d=1, c/d is a number from 0 to 10, and b/d is a number from 0 to 0.

Abstract: A composition comprises (A) a silicone resin; (B) an organosilicon compound; (C) a hydrosilylation catalyst; and (D) a flame retardant component comprising aluminum hydroxide. The composition further comprises (E) a reflective component different from component (D) and comprising titanium dioxide. The composition forms articles having excellent physical properties, including reflectance, flame retardant properties, and self-extinguishing properties. An article formed from the composition and a method of forming a molded article are also provided.

Abstract: A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 ?m/m° C. between ?40 and 150° C. and a modulus of from 1 to 300 MPa at 25° C., and the silicone member is prepared by the method of the invention.

Abstract: A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 &mgr;m/m° C. between −40 and 150° C. and a modulus of from 1 to 300 MPa at 25° C., and the silicone member is prepared by the method of the invention.

Abstract: A vacuum dispensable silicone composition comprising (A) a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organopolysiloxane resin consisting essentially of (a) R.sup.3.sub.2 (CH.sub.2 .dbd.CH)SiO.sub.1/2 siloxane units, (b) R.sup.3.sub.3 SiO.sub.1/2 siloxane units, and (c) SiO.sub.4/2 siloxane units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups free of aliphatic unsaturation, the mole ratio of the combination of (a) and (b) units to (c) units is from 0.6 to 1.