Abstract: A silicone composition is provided that is resistant to a hydrocarbon fluid, such as a transmission fluid, and other harsh environments when cured. The silicone composition includes a dihydroxy-terminated silicone fluid, a filler material and amine-cured cross-linking agent, the composition containing substantially no plasticizer, and wherein the cured composition can be utilized as a sealant that is resistant to exposure to transmission fluid and high temperatures for extended periods of time. The silicone composition provides effective sealant properties that withstand the foregoing conditions present in the transmission fluids. Methods of making and using the cured silicone sealants made from the present compositions are also provided.

Abstract: A method of preparing an amine-cured silicone composition is provided that is resistant to a hydrocarbon fluid, such as a transmission fluid, and other harsh environments when cured. The silicone composition includes a dihydroxy-terminated silicone fluid, a filler material and an amine-cured cross-linking agent, the composition containing substantially no plasticizer, and wherein the cured composition can be utilized as a sealant that is resistant to exposure to transmission fluid and high temperatures for extended periods of time. The silicone composition provides effective sealant properties that withstand the foregoing conditions present in the transmission fluids. Methods of using the cured silicone sealants made from the present compositions are also provided.

Abstract: A silicone composition is provided that is resistant to a hydrocarbon fluid, such as a transmission fluid, and other harsh environments when cured. The silicone composition includes a dihydroxy-terminated silicone fluid, a filler material and amine-cured cross-linking agent, the composition containing substantially no plasticizer, and wherein the cured composition can be utilized as a sealant that is resistant to exposure to transmission fluid and high temperatures for extended periods of time. The silicone composition provides effective sealant properties that withstand the foregoing conditions present in the transmission fluids. Methods of making and using the cured silicone sealants made from the present compositions are also provided.

Abstract: A method and module for securing a conductive interconnect (30) through a metallic substrate (36). The method includes the steps of: forming a hole (34) in the metallic substrate (36), the hole (34) defined by an internal surface (46) of the metallic substrate (36); applying an electrically insulating layer (48) to the metallic substrate (36) including the internal surface (46); applying a solderable coating (50) to at least a portion of the electrically insulating layer (48) around the hole (34); applying a solder (52) to at least a portion of the solderable coating (50) at and above the hole (34); inserting the conductive interconnect (30) through the hole (34); and solder bonding the conductive interconnect (30) within the hole (34).

Abstract: An electronic control module (20) comprising a housing (30), a printed circuit board (40), and a rigidizer (50). The housing (30) has an opening or window (34) for a removable connector (22). The printed circuit board (40) has a first side (42), a second side (44), and a plurality of contact pads (46). The first side (42) of the board (40) is used to retain components and circuitry. The plurality of contact pads (46) is positioned on the first side (42) of the printed circuit board (40). The rigidizer (50) is attached to the second side (44) of the printed circuit board (40) and provides structural backing for the printed circuit board (40) to compensate for any pressure induced to the first side (42) of the printed circuit board (40) by the removable connector (22). The window (34) in the housing (30) is positioned adjacent to the plurality of contact pads (46) on the first side (42) of the printed circuit board (40) to provide a single opening to each of the contact pads (46).

Abstract: A method for securing an electrically conductive interconnect (30) through a metallic substrate (36) having a first surface (36) and a second surface (38). The method may include the steps of: forming a hole (34) in the metallic substrate (36), the hole (34) defined by an internal surface (46) of the metallic substrate (36) that extends from the first surface (36) to the second surface (38) of the metallic substrate (36); applying an electrically insulating layer (48) to the metallic substrate (36) including at least the first surface (36), the second surface (38), and the internal surface (46); applying a solderable coating (50) to at least a portion of the electrically insulating layer (48) on the second surface (38) of the metallic substrate (36) around the hole (34); applying a solder (52) to at least a portion of the solderable coating (50) at and above the hole (34); inserting the interconnect (30) through the hole (34); and solder bonding the interconnect (30) within the hole (34).

Abstract: A multiple cure adhesive (204) is used to secure a circuit substrate (104) to an underlying rigid surface (106). The adhesive is screen printed on the underlying surface. A first cure is then applied to the adhesive to at least partially cure the adhesive and to make the adhesive tacky. The circuit substrate is mounted on the tacky adhesive and a second cure is applied to the adhesive to firmly secure the circuit substrate to the housing. By screen printing the adhesive on the underlying surface, the process of mounting a circuit substrate on a rigid surface can be completely automated, providing cost saving and waste reduction.