Patents by Inventor Starlet R. Glover

Starlet R. Glover has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip-chip wire bondless power device
    Patent number: 10720380
    Abstract: A flip-chip wire bondless power device and method for using a two sided contact bare die power device as a single-connection-level power device. The device uses a top pad solder ball array for connecting a top pad electrically connected to the top contact of the bare die power device and a bottom pad solder ball array for connecting a bottom pad that is electrically through an electrically conductive bottom pad connector that is electrically connected to the bottom contact of the bare die power device using an electrically conductive die-attach material, the top pad and bottom pad, and thereby the top pad solder ball array and the bottom pad solder ball array are planar for flip chip mounting. A trench can be formed between the top pad and bottom pad for isolation and insulation purposes. A method of assembling a flip-chip wire bondless power device is also provided.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: July 21, 2020
    Inventors: Starlet R. Glover, Sayan Seal, H. Alan Mantooth