Abstract: Disclosed is a leadframe lot at least one electronic component, composing at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining parallel offset between the retention tab and the adjacent region of the lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.

Abstract: A power transmission wheel having a hub and a rim is disclosed. The hub has a central annular portion for operatively engaging a power transmitting shaft. The rim has an inner annular portion and an outer annular portion for operatively engaging a flexible power transmitting element. The central annular portion is disposed inside the inner annular portion with a rolling-element bearing therebetween. At least one hub blade is disposed radially between the inner and outer annular portions. At least one rim blade extends radially from one of the inner and outer annular portions towards the other of the inner and outer annular portions. The power transmission wheel has at least two elastomeric dampers. Each damper is interposed between one of the at least one hub blade and one of the at least one rim blade. An engine and vehicles using the power transmission wheels are also disclosed.

Abstract: Disclosed is a leadframe for at least one electronic component, comprising at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining a parallel offset between the retention tab and the adjacent region of lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.

Abstract: A friction-bearing assembly is disclosed which comprises a friction bearing and a shaft, the friction-bearing assembly includes a first bearing gap defined between the sliding surface of the friction bearing and the outer surface of the shaft, and a second bearing gap defined between the inside surface of the friction bearing and the outer surface of the shaft, the second bearing gap being at least 10% wider relative to the first bearing gap, to a maximum of 1 mm. The second bearing gap is positioned adjacent the first bearing gap and located in-between a lubricating oil supply and the first bearing gap such that the first bearing gap is supplied with lubricating oil through the second bearing gap.

Abstract: In an optoelectronic component, having a semiconductor body (1) which includes a substrate (2) and a layer system (3) deposited on the substrate (2), a main surface of the semiconductor body (1) on the opposite side from the substrate (2) being secured to a support (4) by means of a soldered join (7), and the support (4) having a metallization (5) on the side facing the semiconductor body (1), wherein the metallization (5) is silver-free. Also disclosed is an optoelectronic component having a thin-film semiconductor body (8) which is secured to a support (4) by means of a soldered join (7), and the support (4) has a metallization (5) on the side facing the semiconductor body (8), in which the metallization (5) is silver-free.

Abstract: A stripe laser diode element is provided that comprises a longitudinal propagation direction in the main propagation direction of a laser light and comprises contacts on a surface in the longitudinal propagation direction in order to impress a current into the element. The surface is limited transversely to the longitudinal direction by sidewalls in whose region an absorption zone is formed.

Abstract: An injection-molded part (1) includes elevations (2) and/or depressions (12) arranged between integrated printed conductors (4). If the elevations (2) or depressions (12) are uncoated and thus electrically insulating, they increase the effective voltage clearances between the printed conductors (4) and the components (3) arranged next to the printed conductors (4). The geometric distances can then be reduced. Alternatively, by electroconductively coating the elevations (2), electric and magnetic shielding is achieved in a simple manner. A cover (6) is provided as a top of a box which uses elevations (2) as side walls. A tapering portion (5) connects coatings (7,7') of the cover (6) and elevations (2) via a printed conductor (8) running diagonally across the tapering portion (5).

Abstract: An insulating part for an electronic device includes a first metallized outer surface capable of cooling one or more electronic components disposed on the insulating part. The insulating part also includes one or more additional metallized outer surfaces, such as a set of cooling ribs, to provide improved cooling for the electronic components. These additional outer surfaces are coupled electrically and thermally to the first metallized outer surface, and to each other by recesses containing a heat transfer element, such as a metallization or a soldered connection. Thus, heat transferred to the first outer surface is further dissipated among the several additional cooling surfaces.

Abstract: An insulating part for an electronic device includes a body having a metallized outer surface and a heat sink arranged within the body. The heat sink is thermally coupled to an electronic component and to the metallized outer surface, and may also be either electrically coupled or electrically isolated from the electronic component. The insulating part is preferably made of plastic by an injection-molding process, while the heat sink is preferably a metal block integrally formed within the insulating part.