Abstract: A method for producing damper structures on a micromechanical wafer. The method includes: providing an at least partially UV-transparent master mold for molding damper structures; inserting and pressing a micromechanical wafer into the master mold so that micromechanical structures in the wafer are aligned in relation to the damper structures; filling the master mold with UV-curing LSR and subsequent UV irradiation; and mold release and removal of the connected structure of the micromechanical wafer with attached dampers. A method for producing a singulated MEMS chip comprising a UV-cured damper is also described.

Abstract: A method for producing damper structures on a micromechanical wafer. The method includes: providing an at least partially UV-transparent master mold for molding damper structures; inserting and pressing a micromechanical wafer into the master mold so that micromechanical structures in the wafer are aligned in relation to the damper structures; filling the master mold with UV-curing LSR and subsequent UV irradiation; and mold release and removal of the connected structure of the micromechanical wafer with attached dampers. A method for producing a singulated MEMS chip comprising a UV-cured damper is also described.

Abstract: A method for manufacturing a camera module array, made up of at least two camera modules, each camera module including a circuit carrier, an image sensor and at least one optical element, including: mounting the image sensor on the circuit carriers; applying a protective layer to the circuit carriers, the image sensors not being covered by the protective layer or being left exposed; and mounting the optical elements on the image sensors with the aid of an injection molding process and/or embossing process.

Abstract: An image recording system, for example of a motor vehicle, includes a carrier plate, an optics holder with a through hole of which one side is closed by a surface of the carrier plate, and an image recorder situated on the carrier plate surface, a needle channel that extends through the optics holder from the through hole to an outer side of the optics holder and that is suitable for, after the optics holder has been manufactured, injection molding of an encapsulation that forms an optical lens of the image recorder without having to protect a surface of the encapsulation during the manufacturing of the optics holder. Manufacturing of a microstructured protective lens directly after manufacturing of the optics holder on the same injection mold is thus enabled.

Abstract: A method for manufacturing a camera module array, made up of at least two camera modules, each camera module including a circuit carrier, an image sensor and at least one optical element, including: mounting the image sensor on the circuit carriers; applying a protective layer to the circuit carriers, the image sensors not being covered by the protective layer or being left exposed; and mounting the optical elements on the image sensors with the aid of an injection molding process and/or embossing process.

Abstract: A lens carrier for a camera system of a surroundings detection system of a motor vehicle including a printed circuit foil, tracks being applied as conductors or resistors to a first side of the printed circuit foil, and a plastic material being injection-molded onto a second side of the printed circuit foil situated opposite the first side. A corresponding method for manufacturing a lens carrier, device for manufacturing a lens carrier, and a camera system for a surroundings detection system of a motor vehicle, are also described.

Abstract: An image recording system, for example of a motor vehicle, includes a carrier plate, an optics holder with a through hole of which one side is closed by a surface of the carrier plate, and an image recorder situated on the carrier plate surface, a needle channel that extends through the optics holder from the through hole to an outer side of the optics holder and that is suitable for, after the optics holder has been manufactured, injection molding of an encapsulation that forms an optical lens of the image recorder without having to protect a surface of the encapsulation during the manufacturing of the optics holder. Manufacturing of a microstructured protective lens directly after manufacturing of the optics holder on the same injection mold is thus enabled.

Abstract: A lens carrier for a camera system of a surroundings detection system of a motor vehicle including a printed circuit foil, tracks being applied as conductors or resistors to a first side of the printed circuit foil, and a plastic material being sputtered onto a second side of the printed circuit foil situated opposite the first side. A corresponding method for manufacturing a lens carrier, device for manufacturing a lens carrier, and a camera system for a surroundings detection system of a motor vehicle, are also described.