Abstract: A processing system for processing a flexible substrate is described. The processing system includes a vacuum chamber having a wall with an opening for the flexible substrate, a substrate support for supporting the flexible substrate during transportation of the flexible substrate through the opening, and a measurement assembly for measuring at least one of a property of the flexible substrate and a property of one or more coatings on the flexible substrate. The measurement assembly and the substrate support are attached to the wall.

Abstract: An evaporation source for depositing an evaporated material on a substrate is described. The evaporation source includes an evaporation crucible for evaporating a material; a vapor distributor with a plurality of nozzles for directing the evaporated material toward the substrate; a vapor conduit extending in a conduit length direction (A) from the evaporation crucible to the vapor distributor and providing a fluid connection between the evaporation crucible and the vapor distributor, wherein at least one nozzle of the plurality of nozzles has a nozzle axis extending in, or essentially parallel to, the conduit length direction (A); and a baffle arrangement in the vapor conduit. Further described are a vapor deposition apparatus including such an evaporation source and methods of coating a substrate in a vacuum chamber.

Abstract: A crucible for flash evaporation of a liquid material is described. The crucible includes one or more sidewalls and a reservoir portion below the one or more sidewalls, the reservoir portion of having a first cross-section of a first size and a second cross-section above the first cross-section of a second size, the second size being larger than the first size.

Abstract: A vapor deposition apparatus is described. The vapor deposition apparatus includes a substrate support for supporting a substrate to be coated; a vapor source with a plurality of nozzles for directing vapor toward the substrate support through a vapor propagation volume; and a heatable shield extending from the vapor source toward the substrate support. The heatable shield surrounds the vapor propagation volume at least partially and includes an edge exclusion portion for masking areas of the substrate not to be coated. The substrate support may be a rotatable drum with a curved drum surface, and the vapor deposition apparatus may be configured to move the substrate on the curved drum surface past the vapor source in a circumferential direction.

Abstract: A temperature-controlled shield for an evaporation source is described. The temperature-controlled shield is configured to provide a pre-heating zone or a post-cooling zone.

Abstract: A vacuum processing system for routing a carrier with a substrate is described. The system includes a first vacuum processing chamber for processing the substrate on the carrier; a vacuum buffer chamber providing a processing time delay for the substrate; a second vacuum processing chamber for masked deposition of a material layer on the substrate; and one or more transfer chambers for routing the carrier from the first vacuum chamber to the vacuum buffer chamber and for routing the carrier from the vacuum buffer chamber to the second vacuum chamber.

Abstract: An apparatus for carrier alignment in a vacuum chamber is described. The apparatus includes a support extending in a first direction in the vacuum chamber, a magnetic levitation system configured to transport a first carrier in the first direction in the vacuum chamber, the magnetic levitation system comprising at least one magnet unit, and an alignment system for aligning the first carrier. The at least one magnet unit and the alignment system are rigidly fixed to the support. Further, a vacuum system and a method of aligning a carrier are described.

Abstract: An evaporation source for organic material is described. The evaporation source includes an evaporation crucible, wherein the evaporation crucible is configured to evaporate the organic material; a distribution pipe with one or more outlets, wherein the distribution pipe is in fluid communication with the evaporation crucible and wherein the distribution pipe is rotatable around an axis during evaporation; and a support for the distribution pipe, wherein the support is connectable to a first drive or includes the first drive, wherein the first drive is configured for a translational movement of the support and the distribution pipe.

Abstract: A holding arrangement for supporting a substrate carrier and a mask carrier during layer deposition in a processing chamber is provided. The holding arrangement includes two or more alignment actuators connectable to at least one of the substrate carrier and the mask carrier, wherein the holding arrangement is configured to support the substrate carrier in, or parallel to, a first plane, wherein a first alignment actuator of the two or more alignment actuators is configured to move the substrate carrier and the mask carrier relative to each other at least in a first direction, wherein a second alignment actuator of the two or more alignment actuators is configured to move the substrate carrier and the mask carrier relative to each other at least in the first direction and a second direction different from the first direction, and wherein the first direction and the second direction are in the first plane.

Abstract: A deposition system for depositing evaporated material on a substrate is described. The deposition system includes a vapor source having one or more vapor outlets; a shield; and a cooling device for cooling the shield, wherein the vapor source is movable to an idle position in which the one or more vapor outlets are directed toward the shield. Further, a deposition apparatus with a deposition system as well as a method of operating a deposition system are described.

Abstract: The present disclosure provides an apparatus (200) for vacuum processing of a substrate (10). The apparatus (200) includes a vacuum chamber, a first track arrangement (110) configured for transportation of a substrate carrier (120), a second track arrangement (130) configured for transportation of a mask carrier (140), and a holding arrangement configured for positioning the substrate carrier (120) and the mask carrier (140) with respect to each other. The first track arrangement (110) includes a first portion configured to support the substrate carrier (120) at a first end (12) of the substrate (10) and a second portion configured to support the substrate carrier (120) at a second end (14) of the substrate (10) opposite the first end (12) of the substrate (10).

Abstract: A sputter deposition source for sputter deposition in a vacuum chamber is described. The source includes a wall portion of the vacuum chamber; a target providing a material to be deposited during the sputter deposition; an RF power supply for providing RF power to the target; a power connector for connecting the target with the RF power supply; and a conductor rod extending through the wall portion from inside of the vacuum chamber to outside of the vacuum chamber, wherein the conductor rod is connected to one or more components inside of the vacuum chamber and wherein the conductor rod is connected to the RF power supply outside of the vacuum chamber to generate a defined RF return path through the conductor rod.

Abstract: An apparatus for routing a carrier in a processing system is described. The apparatus includes a first holding assembly attached to a vacuum chamber for transportation of the carrier along a first direction, a second holding assembly attached to the vacuum chamber for transportation of the carrier along a second direction different from the first direction, and a rotatable support for rotating the carrier from the first direction to the second direction.

Abstract: A positioning arrangement for positioning a substrate carrier and a mask carrier in a vacuum chamber is described. The positioning arrangement comprising a first track extending in a first direction and configured transportation of the substrate carrier configured for holding a substrate having a substrate surface, a second track extending in the first direction and configured for transportation of the mask carrier, wherein the first track and the second track are offset by an offset distance in a plane coplanar with the substrate surface, and a holding arrangement configured for holding the mask carrier, wherein the holding arrangement is arranged between the first track and the second track.

Abstract: A method of operating a deposition apparatus is provided. The method comprises: Deposition of an evaporated source material on a substrate by guiding the evaporated source material from one or more outlets of an evaporation source toward the substrate, wherein part of the evaporated source material is blocked by and attaches to a shielding device arranged between the one or more outlets and the substrate, followed by a cleaning of the shielding device by at least locally heating the shielding device for releasing at least part of the attached source material from the shielding device. According to a further aspect, a deposition apparatus is provided that can be operated according to the described methods.

Abstract: A material deposition arrangement for depositing a material on a substrate in a vacuum deposition chamber is described. The material deposition arrangement comprises at least one material deposition source having a crucible configured to evaporate the material, a distribution assembly connected to the crucible, wherein the distribution assembly is configured for providing the evaporated material to the substrate, and a valve configured to control a flow of the evaporated material from the crucible to the distribution assembly.

Abstract: A mask arrangement for masking a substrate in a processing chamber is provided. The mask arrangement includes a mask frame having one or more frame elements and is configured to support a mask device, wherein the mask device is connectable to the mask frame; and at least one actuator connectable to at least one frame element of the one or more frame elements, wherein the at least one actuator is configured to apply a force to the at least one frame element.

Abstract: An apparatus for contactless transportation of a deposition source is provided. The apparatus includes a deposition source assembly. The deposition source assembly includes the deposition source. The deposition source assembly includes a first active magnetic unit. The apparatus includes a guiding structure extending in a source transportation direction. The deposition source assembly is movable along the guiding structure. The first active magnetic unit and the guiding structure are configured for providing a first magnetic levitation force for levitating the deposition source assembly.

Abstract: A method of operating a deposition apparatus is provided. The method comprises: Deposition of an evaporated source material on a substrate by guiding the evaporated source material from one or more outlets of an evaporation toward the substrate, wherein part of the evaporated source material is blocked by and attaches to a shielding device arranged between the one or more and the substrate, followed by a cleaning of the shielding device by at least locally heating the shielding device for releasing at least part of the attached source material from the shielding device. According to a further aspect, a deposition apparatus is provided that can be operated according to the described methods.

Abstract: A depositing arrangement for evaporation of a material is disclosed herein. The depositing arrangement has an alkali metal or alkaline earth metal for deposition of the material on a substrate. The deposition arrangement has a first chamber configured for liquefying the material; a valve being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve. The deposition arrangement has an evaporation zone being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material; a heating unit to heat the material to higher temperatures before providing the liquid material in the evaporation zone; and one or more outlets for directing the vaporized material towards the substrate.