Patents by Inventor Stefan BARTHEL
Stefan BARTHEL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12155023Abstract: The invention relates to an optoelectronic semiconductor chip comprising a semiconductor layer sequence with a first semiconductor layer, a second semiconductor layer and an active layer between the first and the second semiconductor layers. The optoelectronic semiconductor chip further comprises a first contact structure with a plurality of first contact pins and a first contact layer for electrically contacting the first semiconductor layer and a second contact structure for electrically contacting the second semiconductor layer. The first semiconductor layer is disposed between the first contact layer and the active layer. The first contact pins are disposed between the first contact layer and the first semiconductor layer and are separated and spaced at a distance from one another in the lateral direction. An electrical connection with an electrical resistance between the first contact layer and the first semiconductor layer is formed by each first contact pin.Type: GrantFiled: May 14, 2020Date of Patent: November 26, 2024Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Stefan Barthel, Anna Nirschl
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Publication number: 20240204137Abstract: In an embodiment a radiation-emitting semiconductor chip includes a first doped region, an active region adjacent to the first doped region and a second doped region arranged on a side of the active region facing away from the first doped region, wherein the first doped region is structured in a step-like manner and includes several planes in a direction perpendicular to a main extension plane of the semiconductor chip, and wherein the active region covers the first doped region on a side surface and a top surface.Type: ApplicationFiled: April 5, 2022Publication date: June 20, 2024Inventors: Ali Mahdavi, Ines Pietzonka, Stefan Barthel, Alvaro Gomez-lglesias
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Patent number: 11916166Abstract: An optoelectronic device may include an optoelectronic semiconductor chip that is configured to emit electromagnetic radiation. The chip may include a first semiconductor layer, a second semiconductor layer, first and second current spreading structures, and a plurality of electrical contact elements. The first current spreading layer may be arranged on a side of the second semiconductor layer facing away from the first semiconductor layer. The plurality of electrical contact elements may electrically connect the first semiconductor layer to the first current spreading layer. The second current spreading layer may be electrically connected to the second semiconductor layer. The second current spreading layer may be arranged between the first current spreading layer and the second semiconductor layer where an insulating layer insulates a first electrical contact element and a second electrical contact element from the second current spreading layer.Type: GrantFiled: May 8, 2019Date of Patent: February 27, 2024Assignee: Osram OLED GmbHInventors: Roland Heinrich Enzmann, Christian Mueller, Stefan Barthel, Vanessa Eichinger, Marc Christian Nenstiel, Lorenzo Zini
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Publication number: 20220320398Abstract: The invention relates to an optoelectronic semiconductor chip comprising a semiconductor layer sequence with a first semiconductor layer, a second semiconductor layer and an active layer between the first and the second semiconductor layers. The optoelectronic semiconductor chip further comprises a first contact structure with a plurality of first contact pins and a first contact layer for electrically contacting the first semiconductor layer and a second contact structure for electrically contacting the second semiconductor layer. The first semiconductor layer is disposed between the first contact layer and the active layer. The first contact pins are disposed between the first contact layer and the first semiconductor layer and are separated and spaced at a distance from one another in the lateral direction. An electrical connection with an electrical resistance between the first contact layer and the first semiconductor layer is formed by each first contact pin.Type: ApplicationFiled: May 14, 2020Publication date: October 6, 2022Inventors: Stefan Barthel, Anna Nirschl
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Patent number: 11456404Abstract: An optoelectronic semiconductor chip may include a semiconductor body, a first and second contact element, a chip carrier, an electrically conductive contact layer, an electrically conductive supply layer, an insulating layer between the contact layer and the supply layer, and at least one electrically conductive feed-through element embedded in the insulating layer. The feed-through element(s) may electrically connect the supply layer to the contact layer. A quantity and/or size of the feed-through elements may be greater on a second side of the semiconductor body opposite to the first side than on the first side.Type: GrantFiled: October 25, 2018Date of Patent: September 27, 2022Assignee: OSRAM OLED GmbHInventors: Roland Heinrich Enzmann, Lorenzo Zini, Vanessa Eichinger, Stefan Barthel
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Publication number: 20210265525Abstract: An optoelectronic device may include an optoelectronic semiconductor chip that is configured to emit electromagnetic radiation. The chip may include a first semiconductor layer, a second semiconductor layer, first and second current spreading structures, and a plurality of electrical contact elements. The first current spreading layer may be arranged on a side of the second semiconductor layer facing away from the first semiconductor layer. The plurality of electrical contact elements may electrically connect the first semiconductor layer to the first current spreading layer. The second current spreading layer may be electrically connected to the second semiconductor layer. The second current spreading layer may be arranged between the first current spreading layer and the second semiconductor layer where an insulating layer insulates a first electrical contact element and a second electrical contact element from the second current spreading layer.Type: ApplicationFiled: May 8, 2019Publication date: August 26, 2021Applicant: Osram OLED GmbHInventors: Roland Heinrich ENZMANN, Christian MUELLER, Stefan BARTHEL, Vanessa EICHINGER, Marc Christian NENSTIEL, Lorenzo ZINI
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Patent number: 10940488Abstract: A method and device for slurrying a suspension, the device including a mixing container with an inlet opening configured to introduce the suspension into the mixing container, a distributor element having a collecting container and an outlet arm fastened to the collecting container, and a shaft with a longitudinal axis, with the shaft and the distributor element arranged inside the mixing container, and the distributor element rotatable around the shaft. The collecting container has a collecting opening that permits passage of the suspension from the inlet opening into the distributor element, the outlet arm has an outflow opening that lets the suspension leave the distributor element, and the outlet arm permitting the suspension to flow out of the distributor element, with a flow of the suspension causing a torque on the distributor element so that the torque supports a rotation around the shaft.Type: GrantFiled: December 14, 2018Date of Patent: March 9, 2021Assignee: OSRAM OLED GMBHInventors: Harald Dimmelmeier, Stefan Barthel, Simon Jerebic, Benedikt Beer, Harald Laux
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Publication number: 20200251639Abstract: An optoelectronic semiconductor chip may include a semiconductor body, a first and second contact element, a chip carrier, an electrically conductive contact layer, an electrically conductive supply layer, an insulating layer between the contact layer and the supply layer, and at least one electrically conductive feed-through element embedded in the insulating layer. The feed-through element(s) may electrically connect the supply layer to the contact layer. A quantity and/or size of the feed-through elements may be greater on a second side of the semiconductor body opposite to the first side than on the first side.Type: ApplicationFiled: October 25, 2018Publication date: August 6, 2020Inventors: Roland Heinrich ENZMANN, Lorenzo ZINI, Vanessa EICHINGER, Stefan BARTHEL
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Patent number: 10384701Abstract: A supply of gaseous fuel on a tender car for fuelling a locomotive engine requires the coordination of a variety of operational modes to improve the safety and efficiency 10 when operating components for delivering, refueling, draining, capturing and storing gaseous fuel. A method and apparatus for managing a supply of gaseous on a tender car comprises receiving on the tender car a command signal from the locomotive commanding delivery of gaseous fuel from the tender car to the locomotive; transferring from the tender car at least one status signal to the locomotive indicating 1 status of the tender car; representing a plurality of operational modes of the tender car as a plurality of states; and transitioning between the plurality of states in response to the command signal and the at least one status signal.Type: GrantFiled: December 17, 2014Date of Patent: August 20, 2019Assignee: WESTPORT POWER INC.Inventors: Jose F. Rosa, Stefan Barthel, Bradley E. Melanson
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Publication number: 20190184407Abstract: A device for slurrying a suspension and a method for operating such a device are disclosed.Type: ApplicationFiled: December 14, 2018Publication date: June 20, 2019Inventors: Harald Dimmelmeier, Stefan Barthel, Simon Jerebic, Benedikt Beer, Harald Laux
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Patent number: 10263143Abstract: A semiconductor chip (20) is described comprising a semiconductor layer sequence (10) based on a phosphide compound semiconductor material or arsenide compound semiconductor material wherein the semiconductor layer sequence (10) contains a p-type semiconductor region (4) and an n-type semiconductor region (2). The n-type semiconductor region (2) comprises a superlattice structure (20) for improving current spreading, wherein the superlattice structure (20) has a periodic array of semiconductor layers (21, 22, 23, 24). A period of the superlattice structure (20) has at least one undoped first semiconductor layer (21) and a doped second semiconductor layer (22), wherein an electronic band gap E2 of the doped second semiconductor layer (22) is larger than an electronic band gap E1 of the undoped first semiconductor layer (21).Type: GrantFiled: April 9, 2018Date of Patent: April 16, 2019Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Xue Wang, Markus Broell, Stefan Barthel
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Publication number: 20180301595Abstract: A semiconductor chip (20) is described comprising a semiconductor layer sequence (10) based on a phosphide compound semiconductor material or arsenide compound semiconductor material wherein the semiconductor layer sequence (10) contains a p-type semiconductor region (4) and an n-type semiconductor region (2). The n-type semiconductor region (2) comprises a superlattice structure (20) for improving current spreading, wherein the superlattice structure (20) has a periodic array of semiconductor layers (21, 22, 23, 24). A period of the superlattice structure (20) has at least one undoped first semiconductor layer (21) and a doped second semiconductor layer (22), wherein an electronic band gap E2 of the doped second semiconductor layer (22) is larger than an electronic band gap E1 of the undoped first semiconductor layer (21).Type: ApplicationFiled: April 9, 2018Publication date: October 18, 2018Inventors: Xue WANG, Markus BROELL, Stefan BARTHEL
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Publication number: 20160325769Abstract: A supply of gaseous fuel on a tender car for fuelling a locomotive engine requires the coordination of a variety of operational modes to improve the safety and efficiency 10 when operating components for delivering, refueling, draining, capturing and storing gaseous fuel. A method and apparatus for managing a supply of gaseous on a tender car comprises receiving on the tender car a command signal from the locomotive commanding delivery of gaseous fuel from the tender car to the locomotive; transferring from the tender car at least one status signal to the locomotive indicating 1 status of the tender car; representing a plurality of operational modes of the tender car as a plurality of states; and transitioning between the plurality of states in response to the command signal and the at least one status signal.Type: ApplicationFiled: December 17, 2014Publication date: November 10, 2016Inventors: Jose F. ROSA, Stefan BARTHEL, Bradley E. MELANSON