Patents by Inventor Stefan Behler
Stefan Behler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240363386Abstract: A die ejector (2) comprising a chamber (4) with a cover plate (40) having a passageway, a plurality of plates (56) arranged inside the chamber (4) and reciprocally moveable between an initial position (58) and an operating position (60), respectively, the plates (56) intended to interact with a die carrier to support the removal of dies from the carrier, and a drive member (100) for moving the plates (56) between the operating position and the initial position.Type: ApplicationFiled: July 4, 2024Publication date: October 31, 2024Inventors: Fabian HURSCHLER, Stefan BEHLER, Brian PULIS
-
Patent number: 12062566Abstract: A die-ejector (2) comprising a chamber (4) with a cover plate (40) having a passageway, a plurality of plates (56) arranged inside the chamber (4) and reciprocally movable between an initial position (58) and an operating position (60), respectively, intended to interact with the carrier to support the removal of the dies from the carrier, and a drive member (100) for moving the plates (56) to be moved from the operating position towards the initial position. The die-ejector (2) further comprises a magnet (20) and a spring system, respectively, which interacts with anchor sections (74) of the plates (56) and exerts on the plates (54) an attraction force (F?) or an impact force, respectively, directed towards the operating position, and a stop member (78) for stopping the movement of the plates (56) in the operating position, the plates abutting the stop member (78) in the operating position.Type: GrantFiled: October 15, 2019Date of Patent: August 13, 2024Assignee: BESI SWITZERLAND AGInventors: Fabian Hurschler, Stefan Behler, Brian Pulis
-
Publication number: 20210391205Abstract: A die-ejector (2) comprising a chamber (4) with a cover plate (40) having a passageway, a plurality of plates (56) arranged inside the chamber (4) and reciprocally movable between an initial position (58) and an operating position (60), respectively, intended to interact with the carrier to support the removal of the dies from the carrier, and a drive member (100) for moving the plates (56) to be moved from the operating position towards the initial position. The die-ejector (2) further comprises a magnet (20) and a spring system, respectively, which interacts with anchor sections (74) of the plates (56) and exerts on the plates (54) an attraction force (F?) or an impact force, respectively, directed towards the operating position, and a stop member (78) for stopping the movement of the plates (56) in the operating position, the plates abutting the stop member (78) in the operating position.Type: ApplicationFiled: October 15, 2019Publication date: December 16, 2021Inventors: Fabian Hurschler, Stefan Behler, Brian Pulis
-
Patent number: 8715457Abstract: The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away.Type: GrantFiled: November 3, 2009Date of Patent: May 6, 2014Assignee: Esec AGInventor: Stefan Behler
-
Patent number: 8133823Abstract: The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to a first system of coordinates. The position and orientation of the substrate place on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates. The conversion of coordinates of the first or second system of coordinates into coordinates of motion of the pick-and-place system occurs by means of two fixed mapping functions and two changeable correction vectors. The correction vectors are readjusted on the occurrence of a predetermined event.Type: GrantFiled: October 8, 2008Date of Patent: March 13, 2012Assignee: Oerlikon Assembly Equipment AG, SteinhausenInventors: Stefan Behler, Patrick Blessing
-
Publication number: 20110214819Abstract: The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away.Type: ApplicationFiled: November 3, 2009Publication date: September 8, 2011Applicant: ESEC AGInventor: Stefan Behler
-
Publication number: 20100315655Abstract: Determination of the height difference between a first reference point and a second reference point, at least one of the two reference points lying on a semiconductor chip, which is mounted on a substrate, comprises the steps A) recording a first image from a first direction, which runs diagonally to the surface of the substrate at a predetermined angle ?2, the substrate and the semiconductor chip being illuminated from a second direction which runs diagonally to the surface of the substrate at a predetermined angle ?3, a telecentric optics being located in the beam path, B) recording a second image from the second direction, the substrate and the semiconductor chip being illuminated from the first direction, either the cited telecentric optics or a further telecentric optics being located in the beam path, C) ascertaining a first coordinate of the position of the first reference point and a first coordinate of the position of the second reference point in the first image and determining a first differenceType: ApplicationFiled: November 19, 2007Publication date: December 16, 2010Applicant: ESEC AGInventors: Stefan Behler, Patrick Blessing, Stephan Scholze, Roland Stalder, Martin Von Arx
-
Publication number: 20090098667Abstract: The invention relates to a method for picking up semiconductor chips from a wafer table and, optionally, their mounting on a substrate by means of a pick-and-place system. The position and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to a first system of coordinates. The position and orientation of the substrate place on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates. The conversion of coordinates of the first or second system of coordinates into coordinates of motion of the pick-and-place system occurs by means of two fixed mapping functions and two changeable correction vectors. The correction vectors are readjusted on the occurrence of a predetermined event.Type: ApplicationFiled: October 8, 2008Publication date: April 16, 2009Applicant: Oerlikon Assembly Equipment AG, SteinhausenInventors: Stefan Behler, Patrick Blessing
-
Patent number: 7066373Abstract: In order to eliminate the inclination of a semiconductor chip picked by a gripper, the height of at least three points on the underneath of the semiconductor chip is determined in relation to a reference surface and from this the inclination is calculated. Determining the heights takes place in that the semiconductor chip is lowered until the semiconductor chip comes into contact with a needle.Type: GrantFiled: September 10, 2004Date of Patent: June 27, 2006Assignee: Unaxis International Trading LtdInventor: Stefan Behler
-
Publication number: 20050061852Abstract: In order to eliminate the inclination of a semiconductor chip picked by a gripper, the height of at least three points on the underneath of the semiconductor chip is determined in relation to a reference surface and from this the inclination is calculated. Determining the heights takes place in that the semiconductor chip is lowered until the semiconductor chip comes into contact with a needle.Type: ApplicationFiled: September 10, 2004Publication date: March 24, 2005Inventor: Stefan Behler
-
Patent number: 6585145Abstract: A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.Type: GrantFiled: December 4, 2001Date of Patent: July 1, 2003Assignee: ESEC Trading SAInventors: Stefan Behler, Beat Zumbuehl, Reto Schubiger, Ruedi Grueter, Rolf Schuermann
-
Patent number: 6435492Abstract: A Die Bonder or Wire Bonder has a suction device for pulling flat and holding down a curved substrate equipped with or to be equipped with a semiconductor chip onto a supporting surface of a plate. The plate contains at least one cavity open towards the supporting surface in which there is a vacuum gripper made out of flexible material, whereby the vacuum gripper is lowerable into the cavity during transport of the substrate and which is raisable above the level of the supporting surface to apply suction to the substrate.Type: GrantFiled: December 8, 2000Date of Patent: August 20, 2002Assignee: ESEC Trading SAInventors: Stefan Behler, Reto Schubiger, Beat Zumbuehl
-
Publication number: 20020093130Abstract: A Die Bonder or Wire Bonder has a suction device for pulling flat and holding down a curved substrate equipped with or to be equipped with a semiconductor chip onto a supporting surface of a plate. The plate contains at least one cavity open towards the supporting surface in which there is a vacuum gripper made out of flexible material, whereby the vacuum gripper is lowerable into the cavity during transport of the substrate and which is raisable above the level of the supporting surface to apply suction to the substrate.Type: ApplicationFiled: December 8, 2000Publication date: July 18, 2002Inventors: Stefan Behler, Reto Schubiger, Beat Zumbuehl
-
Publication number: 20020066765Abstract: A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.Type: ApplicationFiled: December 4, 2001Publication date: June 6, 2002Inventors: Stefan Behler, Beat Zumbuehl, Reto Schubiger, Ruedi Grueter, Rolf Schuermann