Patents by Inventor Stefan Bonekamp

Stefan Bonekamp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonded adhesion of wire-shaped individual elements by means of a two-layer acrylate resin-based system
    Patent number: 8425170
    Abstract: The present invention relates to a method for the bonded adhesion, or connection, of a plurality of wire-shaped individual elements into an arrangement, particularly into a wire band, wherein the adjacent individual elements have predetermined breaking points allowing for the mechanical removal of the individual elements. The bonded adhesion is brought about according to the invention utilizing a two-layer system on the basis of acrylate resins consisting of an inner coating (A) and of an outer coating (B), wherein the inner coating (A) has a lower hardness, than the outer coating. In a further aspect the invention also comprises arranging a plurality of wire-shaped individual elements through such a bonded connection, particularly a wire band.
    Type: Grant
    Filed: April 15, 2011
    Date of Patent: April 23, 2013
    Assignee: Henkel AG & Co. KGAA
    Inventors: Andreas Kunz, Juergen Stodt, Holger Endres, Wolfgang Schneider, Stefan Bonekamp, Patrick Podwoiski
  • Bonded Adhesion of Wire-Shaped Individual Elements by Means of a Two-Layer Acrylate Resin-Based System
    Publication number: 20110194914
    Abstract: The present invention relates to a method for the bonded adhesion, or connection, of a plurality of wire-shaped individual elements into an arrangement, particularly into a wire band, wherein the adjacent individual elements have predetermined breaking points allowing for the mechanical removal of the individual elements. The bonded adhesion is brought about according to the invention utilizing a two-layer system on the basis of acrylate resins consisting of an inner coating (A) and of an outer coating (B), wherein the inner coating (A) has a lower hardness, than the outer coating. In a further aspect the invention also comprises arranging a plurality of wire-shaped individual elements through such a bonded connection, particularly a wire band.
    Type: Application
    Filed: April 15, 2011
    Publication date: August 11, 2011
    Inventors: Andreas Kunz, Juergen Stodt, Holger Endres, Wolfgang Schneider, Stefan Bonekamp, Patrick Podwoiski