Abstract: A method is specified for production of an insulator layer. This method comprises the following process steps: A) providing a precursor comprising a mixture of a first, a second and a third component where—the first component comprises a compound of the general where R1 and R2 are each independently selected from a group comprising hydrogen and alkyl radicals and n=1 to 10 000; the second component comprises a compound of the general where R3 is an alkyl radical, and the third component comprises at least one amine compound; B) applying the precursor to a substrate; C) curing the precursor to form the insulator layer. The first compound comprises an epoxy group and a hydroxyl group. The second compound comprises an ester group. The curing takes place at room temperature or at temperatures between 50° C. and 260° C.

Abstract: Various embodiments may relate to a method for forming a conductor path structure on an electrode surface of an electronic component. The method includes introducing electrically conductive metal particles into an insulating carrier material, producing a mixed composition by mixing the carrier material with the metal particles, applying the mixed composition to the electrode surface, separating the metal particles from the carrier material, allowing the metal particles to become attached to the electrode surface, fixing the metal particles attached to the electrode surface, and curing the carrier material.

Abstract: A method is specified for production of an insulator layer. This method comprises the following process steps: A) Providing a precursor comprising a mixture of a first, a second and a third component where—the first component comprises a compound of the general formula IA where R1 and R2 are each independently selected from a group comprising hydrogen and alkyl radicals and n=1 to 10 000; the second component comprises a compound of the general formula ILA where R3 is an alkyl radical, and the third component comprises at least one amine compound; B) applying the precursor to a substrate; C) curing the precursor to form the insulator layer.

Abstract: A light-emitting device includes a substrate having a substrate upper side, a layer sequence arranged on the substrate upper side and having at least one active, light-emitting, organic layer, wherein the layer sequence includes a plurality of emission regions that emit light, current-conducting rails which are a part of the layer sequence, wherein, in a plan view of the substrate upper side, the emissionr egions of the layer sequence are arranged next to the current-conducting rails, an encapsulation glass, wherein the layer sequence is arranged between the substrate and the encapsulation glass, and spacers formed as elevations on an encapsulation glass underside and facing towards the layer sequence of the encapsulation glass, wherein, in a plan view of the substrate upper side, the spacers at least partly overlap with the current-conducting rails, and the spacers prevent direct contact between the encapsulation glass and the layer sequence in the emission regions.

Abstract: Various embodiments may relate to a method for forming a conductor path structure on an electrode surface of an electronic component. The method includes introducing electrically conductive metal particles into an insulating carrier material, producing a mixed composition by mixing the carrier material with the metal particles, applying the mixed composition to the electrode surface, separating the metal particles from the carrier material, allowing the metal particles to become attached to the electrode surface, fixing the metal particles attached to the electrode surface, and curing the carrier material.