Patents by Inventor Stefan Dorrhofer

Stefan Dorrhofer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6905361
    Abstract: With an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, the support plate is in heat-conducting connection with at least a part of the leadframe. The leadframe may be formed at least partly with a flat surface area and the support plate may rest on the flat part. An electrical insulation between the support plate and the leadframe may be formed by a double-sided adhesive film or by a printed-on adhesive.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: June 14, 2005
    Assignee: Siemens Aktiengesellschaft
    Inventors: Stefan Dörrhöfer, Dietmar Schultz, Michael Nitzschke
  • Publication number: 20030171026
    Abstract: In the case of an electrical device with a circuit arranged on a support plate and with a leadframe, forming electrical leads, for the electrical connection of the circuit to further electrical components, it is provided that the support plate is in heat-conducting connection with at least a part of the leadframe. In this case, the leadframe may be formed at least partly with a flat surface area and the support plate may rest on the flat part. An electrical insulation between the support plate and the leadframe may be formed by a double-sided adhesive film or by a printed-on adhesive.
    Type: Application
    Filed: January 15, 2003
    Publication date: September 11, 2003
    Inventors: Stefan Dorrhofer, Dietmar Schultz, Michael Nitzschke