Patents by Inventor Stefan Emmert

Stefan Emmert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8430079
    Abstract: A throttle valve for controlling a fluid flow includes a throttle housing (4), a gas passage (18) in the throttle housing (4), a throttle shaft (8) which is pivotably supported in the throttle housing (4), and a throttle (6) which is connected to the throttle shaft (8). The throttle shaft (8) extends through a jacket (12) which is provided on the throttle (6) and at least partially encompasses the throttle shaft (8). After the throttle (6) is installed on the throttle shaft (8), a hardening filler material (10) creates a form-fit connection between the throttle (6) and the throttle shaft (8).
    Type: Grant
    Filed: November 3, 2008
    Date of Patent: April 30, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Stefan Emmert, Thomas Roessner, Christian Preissner, Joerg Mayer
  • Publication number: 20100206264
    Abstract: Throttle valves often have the problem that the throttle must be precisely positioned with and fixed to the throttle shaft. In the throttle valve (2) proposed by the invention, hardening filler material (10) is inserted into the intermediate space (22) between the throttle (6) and the throttle shaft (8). After said filler material (10) has hardened, the throttle (6) is precisely positioned relative to the throttle shaft (8) and fixed in a torque-proof manner. The throttle valve may be used for controlling the output of an internal combustion engine.
    Type: Application
    Filed: November 3, 2008
    Publication date: August 19, 2010
    Inventors: Stefan Emmert, Thomas Roessner, Christian Preissner, Joerg Mayer
  • Patent number: 6421248
    Abstract: A chip card module contains, in addition to conductor tracks and a chip carrier, one or more semiconductor chips and, if necessary, a stiffening frame. The semiconductor chip(s) and/or stiffening frame are attached with the aid of an adhesive, with which particles of a defined size are admixed as spacers. The adhesive in preferably a flexible adhesive, and the particles preferably are formed of a deformable material. The invention has the effect that the semiconductor chip(s) and/or stiffening frame are adhesively attached to the underlying surface at a defined, uniform distance. The flexible adhesive and the deformable particles adapt to deformations of the chip card module and thus prevent damage to the adhesively bonded mating surfaces.
    Type: Grant
    Filed: July 15, 1999
    Date of Patent: July 16, 2002
    Assignee: Infineon Technologies AG
    Inventors: Hans-Georg Mensch, Stefan Emmert, Detlef Houdeau