Patents by Inventor Stefan Endler

Stefan Endler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicon Substrate with ESD Protection Element
    Publication number: 20250081628
    Abstract: In an embodiment a silicon substrate includes integrated circuits located on a first surface, a second surface opposite to the first surface, a first via and an ESD protection element, wherein the ESD protection element is fully integrated into the silicon substrate, wherein the ESD protection element is spatially distant from the first via, wherein the ESD protection element is connected to the via by a first rewiring, and wherein the ESD protection element comprises a suppressor diode, a transistor or a thyristor.
    Type: Application
    Filed: November 15, 2021
    Publication date: March 6, 2025
    Inventors: Thomas Feichtinger, Stefan Endler
  • Component and method for manufacturing a component
    Patent number: 12177986
    Abstract: In an embodiment a component includes at least one carrier layer, the carrier layer having a top side and a bottom side and at least one functional layer arranged on the top side of the carrier layer, the functional layer including a material having a specific electrical characteristic, wherein the component is configured for direct integration into an electrical system as a discrete component.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: December 24, 2024
    Assignee: TDK Electronics AG
    Inventors: Jan Ihle, Thomas Bernert, Stefan Endler, Michael Krenn, Stephan Bigl, Markus Puff, Sebastian Redolfi
  • Component and Method for Manufacturing a Component
    Publication number: 20220287187
    Abstract: In an embodiment a component includes at least one carrier layer, the carrier layer having a top side and a bottom side and at least one functional layer arranged on the top side of the carrier layer, the functional layer including a material having a specific electrical characteristic, wherein the component is configured for direct integration into an electrical system as a discrete component.
    Type: Application
    Filed: October 12, 2020
    Publication date: September 8, 2022
    Inventors: Jan Ihle, Thomas Bernert, Stefan Endler, Michael Krenn, Stephan Bigl, Markus Puff, Sebastian Redolfi