Patents by Inventor Stefan Finkbeiner
Stefan Finkbeiner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8687255Abstract: A method for manufacturing a micromechanical component is described, including the steps of: forming a first etch stop layer on a base substrate, the first etch stop layer being formed in such a way that it has a first pattern of through-cutouts; forming a first electrode-material layer on the first etch stop layer; forming a second etch stop layer on the first electrode-material layer, the second etch stop layer being formed in such a way that it has a second pattern of through-cutouts differing from the first pattern; forming a second electrode-material layer on the second etch stop layer; forming a patterned mask on the second electrode-material layer; and carrying out a first etching step in a first direction and a second etching step in a second direction counter to the first direction in order to etch at least one first electrode unit out of the first electrode-material layer and to etch at least one second electrode unit out of the second electrode-material layer.Type: GrantFiled: July 6, 2009Date of Patent: April 1, 2014Assignee: Robert Bosch GmbHInventors: Stefan Finkbeiner, Tjalf Pirk, Christoph Friese
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Patent number: 8198130Abstract: A chip module having a substrate and at least one chip connected to the substrate is provided, the substrate featuring a first main plane of extension and the chip featuring a second main plane of extension, and an acute angle being provided between the first main plane of extension and the second main plane of extension, and the substrate also comprising a mold housing.Type: GrantFiled: March 11, 2010Date of Patent: June 12, 2012Assignee: Robert Bosch GmbHInventors: Stefan Finkbeiner, Frieder Haag, Hans-Peter Baer
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Publication number: 20110279919Abstract: A method for manufacturing a micromechanical component is described, including the steps of: forming a first etch stop layer on a base substrate, the first etch stop layer being formed in such a way that it has a first pattern of through-cutouts; forming a first electrode-material layer on the first etch stop layer; forming a second etch stop layer on the first electrode-material layer, the second etch stop layer being formed in such a way that it has a second pattern of through-cutouts differing from the first pattern; forming a second electrode-material layer on the second etch stop layer; forming a patterned mask on the second electrode-material layer; and carrying out a first etching step in a first direction and a second etching step in a second direction counter to the first direction in order to etch at least one first electrode unit out of the first electrode-material layer and to etch at least one second electrode unit out of the second electrode-material layer.Type: ApplicationFiled: July 6, 2009Publication date: November 17, 2011Inventors: Stefan Finkbeiner, Tjalf Pirk, Christoph Friese
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Publication number: 20110108932Abstract: A manufacturing method for producing a micromechanical sensor element which may be produced in a monolithically integrable design and has capacitive detection of a physical quantity is described. In addition to the manufacturing method, a micromechanical device containing such. a sensor element, e.g., a pressure sensor or an acceleration sensor, is described.Type: ApplicationFiled: November 4, 2005Publication date: May 12, 2011Inventors: Hubert Benzel, Stefan Finkbeiner, Frank Fischer, Helmut Baumann, Lars Metzger, Roland Scheuerer, Peter Brauchle, Andreas Feustel, Matthias Neubauer
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Publication number: 20100252939Abstract: A chip module having a substrate and at least one chip connected to the substrate is provided, the substrate featuring a first main plane of extension and the chip featuring a second main plane of extension, and an acute angle being provided between the first main plane of extension and the second main plane of extension, and the substrate also comprising a mold housing.Type: ApplicationFiled: March 11, 2010Publication date: October 7, 2010Inventors: Stefan Finkbeiner, Frieder Haag, Hans-Peter Baer
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Patent number: 7740459Abstract: A method for producing a micromechanical component, preferably for fluidic applications having cavities. The component is constructed from two functional layers, the two functional layers being patterned differently using micromechanical methods. A first etch stop layer having a first pattern is applied to a base plate. A first functional layer is applied to the first etch stop layer and to the first contact surfaces of the base plate. A second etch stop layer, having a second pattern, is applied to first functional layer. A second functional layer is applied to the second etch stop layer and to the second contact surfaces of the first functional layer. An etching mask is applied to the second functional layer. The second and the first functional layer are patterned as sacrificial layers by the use of the first and the second etch stop layer by etching methods and/or by using the first and the second etch stop layer.Type: GrantFiled: July 7, 2004Date of Patent: June 22, 2010Assignee: Robert Bosch GmbHInventors: Matthias Fuertsch, Hubert Benzel, Stefan Finkbeiner, Stefan Pinter, Frank Fischer, Heiko Stahl, Tjalf Pirk
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Patent number: 7572661Abstract: Described is a method for manufacturing a micromechanical sensor element and a micromechanical sensor element manufactured in particular using such a method which has a hollow space or a cavity and a membrane for detecting a physical variable. Different method steps are performed for manufacturing the sensor element, among other things, a structured etch mask having a plurality of holes or apertures being applied on a semiconductor substrate. Moreover, an etch process is used to create depressions in the semiconductor substrate beneath the holes in the structured etch mask. Anodization of the semiconductor material is subsequently carried out, the anodization taking place preferably starting from the created depressions in the semiconductor substrate. Due to this process, porous areas are created beneath the depressions, a lattice-like structure made of untreated, i.e., non-anodized, substrate material remaining between the porous areas and the depressions.Type: GrantFiled: September 8, 2005Date of Patent: August 11, 2009Assignee: Robert Bosch GmbHInventors: Hubert Benzel, Stefan Finkbeiner, Matthias Illing, Frank Schaefer, Simon Armbruster, Gerhard Lammel, Christoph Schelling, Joerg Brasas
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Patent number: 7572660Abstract: A method for manufacturing a micromechanical component and a micromechanical component manufactured using this method are described, the micromechanical component having a first substrate, which in turn has at least one cavity and one printed conductor. At least a part of the printed conductor is applied to at least a part of the walls of the cavity. In particular, the floor of the cavity is considered part of the cavity walls.Type: GrantFiled: December 17, 2004Date of Patent: August 11, 2009Assignee: Robert Bosch GmbHInventors: Hubert Benzel, Stefan Finkbeiner, Christoph Schelling, Julian Gonska
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Patent number: 7354786Abstract: A micromechanical sensor element and a method for the production of a micromechanical sensor element that is suitable, for example in a micromechanical component, for detecting a physical quantity. Provision is made for the sensor element to include a substrate, an access hole and a buried cavity, at least one of the access holes and the cavity being produced in the substrate by a trench etching and/or, in particular, an isotropic etching process. The trench etching process includes different trenching (trench etching) steps which may be divided into a first phase and a second phase. Thus, in the first phase, at least one first trenching step is carried out in which, in a predeterminable first time period, material is etched out of the substrate and a depression is produced. In that trenching step, a typical concavity is produced in the wall of the depression.Type: GrantFiled: September 8, 2005Date of Patent: April 8, 2008Assignee: Robert Bosch GmbHInventors: Hubert Benzel, Stefan Finkbeiner, Matthias Illing, Frank Schaefer, Simon Armbruster, Gerhard Lammel, Christoph Schelling, Joerg Brasas
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Publication number: 20080041151Abstract: A microfluidic device for metering a fluid or for the metered dispensing of a fluid is provided, the device having a substrate, a pipette element having a dispensing side, which pipette element has a sealed side, and the device also having a heating device in the region of the sealed side. Alternatively, the microfluidic device is provided with the pipette element having a side that is connected to a reservoir, and a heating device in the region of the side connected to the reservoir.Type: ApplicationFiled: April 30, 2007Publication date: February 21, 2008Inventors: Matthias Fuertsch, Stefan Finkbeiner, Christoph Schelling, Stefan Weiss, Thomas Wagner, Christian Maeurer, Ines Breibach
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Publication number: 20070128755Abstract: In the manufacture of at least one passage in a silicon wafer, in a first method step, starting from a first side of the wafer, a first recess is produced in the wafer, and in a second method step, starting from a second side of the wafer, a second recess is produced in the wafer. The first recess and the second recess are produced such that together they form a passage between the first and second sides of the silicon wafer.Type: ApplicationFiled: October 23, 2006Publication date: June 7, 2007Inventors: Matthias Fuertsch, Stefan Finkbeiner, Christoph Schelling, Stefan Weiss, Thomas Wagner, Christian Maeurer, Ines Breibach
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Publication number: 20060186085Abstract: A method for producing a micromechanical component, preferably for fluidic applications having cavities. The component is constructed from two functional layers, the two functional layers being patterned differently using micromechanical methods. A first etch stop layer having a first pattern is applied to a base plate. A first functional layer is applied to the first etch stop layer and to the first contact surfaces of the base plate. A second etch stop layer, having a second pattern, is applied to first functional layer. A second functional layer is applied to the second etch stop layer and to the second contact surfaces of the first functional layer. An etching mask is applied to the second functional layer. The second and the first functional layer are patterned as sacrificial layers by the use of the first and the second etch stop layer by etching methods and/or by using the first and the second etch stop layer.Type: ApplicationFiled: July 7, 2004Publication date: August 24, 2006Inventors: Matthias Fuertsch, Hubert Benzel, Stefan Finkbeiner, Stefan Pinter, Frank Fischer, Heiko Stahl, Tjalf Pirk
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Publication number: 20060063293Abstract: Described is a method for manufacturing a micromechanical sensor element and a micromechanical sensor element manufactured in particular using such a method which has a hollow space or a cavity and a membrane for detecting a physical variable. Different method steps are performed for manufacturing the sensor element, among other things, a structured etch mask having a plurality of holes or apertures being applied on a semiconductor substrate. Moreover, an etch process is used to create depressions in the semiconductor substrate beneath the holes in the structured etch mask. Anodization of the semiconductor material is subsequently carried out, the anodization taking place preferably starting from the created depressions in the semiconductor substrate. Due to this process, porous areas are created beneath the depressions, a lattice-like structure made of untreated, i.e., non-anodized, substrate material remaining between the porous areas and the depressions.Type: ApplicationFiled: September 8, 2005Publication date: March 23, 2006Inventors: Hubert Benzel, Stefan Finkbeiner, Matthias Illing, Frank Schaefer, Simon Armbruster, Gerhard Lammel, Christoph Schelling, Joerg Brasas
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Publication number: 20060057816Abstract: A micromechanical sensor element and a method for the production of a micromechanical sensor element that is suitable, for example in a micromechanical component, for detecting a physical quantity. Provision is made for the sensor element to include a substrate, an access hole and a buried cavity, at least one of the access holes and the cavity being produced in the substrate by a trench etching and/or, in particular, an isotropic etching process. The trench etching process includes different trenching (trench etching) steps which may be divided into a first phase and a second phase. Thus, in the first phase, at least one first trenching step is carried out in which, in a predeterminable first time period, material is etched out of the substrate and a depression is produced. In that trenching step, a typical concavity is produced in the wall of the depression.Type: ApplicationFiled: September 8, 2005Publication date: March 16, 2006Inventors: Hubert Benzel, Stefan Finkbeiner, Matthias Illing, Frank Schaefer, Simon Armbruster, Gerhard Lammel, Christoph Schelling, Joerg Brasas
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Publication number: 20060037932Abstract: A manufacturing method and a micromechanical component are provided in which porous silicon is used as sacrificial layer and a functional layer is exposed by etching off the sacrificial layer.Type: ApplicationFiled: February 27, 2003Publication date: February 23, 2006Inventors: Gerhard Lammel, Frank Schaefer, Heribert Weber, Stefan Finkbeiner
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Publication number: 20060016995Abstract: A microstructured infrared sensor includes: a sensor chip having a diaphragm; a cavity formed underneath the diaphragm; a thermopile structure formed on the diaphragm and having bonded printed conductors; an absorber layer formed on the thermopile structure for absorbing infrared radiation; and a cap chip attached to the sensor chip. A sensor space is formed between the cap chip and the sensor chip, and the sensor space accommodates the thermopile structure. The infrared sensor also includes a convex lens area for focusing incident infrared radiation onto the absorber layer. The lens area may be formed on the top of the cap chip or on a lens chip attached to the cap chip. The lens area may be formed by drying a dispensed lacquer droplet, or by a softened, structured lacquer cylinder, or by subsequent etching of the dried lacquer droplet and the surrounding substrate material.Type: ApplicationFiled: June 10, 2005Publication date: January 26, 2006Inventors: Nils Kummer, Roland Mueller-Fiedler, Stefan Finkbeiner, Andre Mueller, Horst Muenzel, Dieter Maurer, Stefan Hiemer, Jurgen Perthold
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Publication number: 20050133880Abstract: A method for manufacturing a micromechanical component and a micromechanical component manufactured using this method are described, the micromechanical component having a first substrate, which in turn has at least one cavity and one printed conductor. At least a part of the printed conductor is applied to at least a part of the walls of the cavity. In particular, the floor of the cavity is considered part of the cavity walls.Type: ApplicationFiled: December 17, 2004Publication date: June 23, 2005Inventors: Hubert Benzel, Stefan Finkbeiner, Christoph Schelling, Julian Gonska
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Publication number: 20050022593Abstract: In a micromechanical sensor and/or a method for manufacturing a micromechanical sensor for detecting a state variable of a substance, the sensor includes at least one heating element, one temperature measuring element and optionally an inlet opening into and/or an outlet opening out of the cavity for this purpose. The sensor includes a cavity configured to at least partially receive the substance through one of the inlet openings and discharge it again at least partially through one of the outlets or outlet openings. The at least one state variable of the substance is detected here as a function of at least one variable representing the operation of the at least one heating element and/or the operation of the at least one temperature element.Type: ApplicationFiled: July 27, 2004Publication date: February 3, 2005Inventors: Jochen Franz, Matthias Fuertsch, Stefan Finkbeiner, Stefan Weiss, Axel Kaschner
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Patent number: 6511913Abstract: A method for manufacturing a membrane in which an n-doped epitaxy layer is applied on a p-doped silicon substrate. Disposed between the silicon substrate and the epitaxy layer is a p-doping which leads to a reduction of the membrane thickness during a subsequent etching process.Type: GrantFiled: July 13, 2000Date of Patent: January 28, 2003Assignee: Robert Bosch GmbHInventors: Hubert Benzel, Stefan Finkbeiner