Patents by Inventor Stefan Grötsch

Stefan Grötsch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250113678
    Abstract: The invention relates to an optoelectronic component comprising an optoelectronic semiconductor chip having an emission surface which is located on an upper side and is designed to emit light into an emission space. The emission surface is laterally delimited by a cover which has: a first portion that annularly delimits the emission surface; and a second portion. The cover is designed in such a way that light incident on the second portion of the cover from outside the optoelectronic component is predominantly reflected. Light emitted from the emission surface towards the cover is predominantly deflected by the cover in such a way that it is not specularly reflected into the emission space.
    Type: Application
    Filed: January 26, 2023
    Publication date: April 3, 2025
    Inventors: Ulrich STREPPEL, Stefan GRÖTSCH, Hansjörg SCHÖLL
  • Publication number: 20240278645
    Abstract: It is provided a window of a vehicle, optoelectronic circuits, in particular optoelectronic circuits for a window of a vehicle and a method for manufacturing a window of a vehicle including at least one optoelectronic component. It is further provided a display comprising at least one display module each comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a ?LED. In addition, a method for manufacturing a display module comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a ?LED, is provided.
    Type: Application
    Filed: May 1, 2024
    Publication date: August 22, 2024
    Inventors: Matthias GOLDBACH, Stefan Grötsch, Lugwig Hofbauer, Sebastian Wittmann, Robert Regensburger, Thomas Schwarz, Michael Brandl, Andreas Dobner, Sebastian Stigler
  • Patent number: 12022586
    Abstract: An assembly of electronic semiconductor components includes a carrier, at least one optoelectronic semiconductor component, a varactor component and a receiving element. The optoelectronic semiconductor component, the varactor component and the receiving element are arranged on the carrier. The optoelectronic semiconductor component and the varactor component are formed with the same semiconductor material. The optoelectronic semiconductor component has an active region configured for emitting electromagnetic radiation. The varactor component together with the receiving element forms a tunable resonant circuit. The resonant circuit is configured to draw energy for operating the optoelectronic semiconductor component from an alternating electromagnetic field.
    Type: Grant
    Filed: July 8, 2020
    Date of Patent: June 25, 2024
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Victor Goldrin, Stefan Grötsch
  • Publication number: 20220272811
    Abstract: An assembly of electronic semiconductor components includes a carrier, at least one optoelectronic semiconductor component, a varactor component and a receiving element. The optoelectronic semiconductor component, the varactor component and the receiving element are arranged on the carrier. The optoelectronic semiconductor component and the varactor component are formed with the same semiconductor material. The optoelectronic semiconductor component has an active region configured for emitting electromagnetic radiation. The varactor component together with the receiving element forms a tunable resonant circuit. The resonant circuit is configured to draw energy for operating the optoelectronic semiconductor component from an alternating electromagnetic field.
    Type: Application
    Filed: July 8, 2020
    Publication date: August 25, 2022
    Inventors: Victor GOLDRIN, Stefan GRÖTSCH
  • Patent number: 11187392
    Abstract: A headlamp includes a first semiconductor chip and a second semiconductor chip for generating light. The first and second semiconductor chips each include several pixels. A first optics is arranged to direct light from the first semiconductor chip with a first magnification into a base region. Via a second optics, light of the second semiconductor chip is directed into a bright region with a second magnification. The second magnification is between 0.3 times and 0.7 times the first magnification inclusive, so that the bright region is smaller than the base region. The bright region is within the base region.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: November 30, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Stefan Grötsch, Joachim Reill
  • Patent number: 11149913
    Abstract: A headlamp includes a first semiconductor chip and a second semiconductor chip for generating light. The first and second semiconductor chips each include several pixels. A first optics is arranged to direct light from the first semiconductor chip with a first magnification into a base region. Via a second optics, light of the second semiconductor chip is directed into a bright region with a second magnification. The second magnification is between 0.3 times and 0.7 times the first magnification inclusive, so that the bright region is smaller than the base region. The bright region is within the base region.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: October 19, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Stefan Grötsch, Joachim Reill
  • Publication number: 20210190282
    Abstract: A headlamp includes a first semiconductor chip and a second semiconductor chip for generating light. The first and second semiconductor chips each include several pixels. A first optics is arranged to direct light from the first semiconductor chip with a first magnification into a base region. Via a second optics, light of the second semiconductor chip is directed into a bright region with a second magnification. The second magnification is between 0.3 times and 0.7 times the first magnification inclusive, so that the bright region is smaller than the base region. The bright region is within the base region.
    Type: Application
    Filed: November 16, 2018
    Publication date: June 24, 2021
    Inventors: Stefan GRÖTSCH, Joachim REILL
  • Patent number: 10820390
    Abstract: A method of operating an optoelectronic component, including a plurality of picture elements and a plurality of temperature sensors, wherein the picture elements are each configured to emit light, and the temperature sensors thermally conductively connect to the picture elements, the method including acquiring temperature values supplied by the temperature sensors; and controlling the picture elements in dependence on the acquired temperature values.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: October 27, 2020
    Assignee: OSRAM OLED GmbH
    Inventors: Thorsten Baumheinrich, Stefan Grötsch
  • Patent number: 10727386
    Abstract: A radiation-emitting component includes a radiation source including at least one semiconductor layer sequence that generates radiation; an optical waveguide device disposed downstream of the radiation source; and a conversion element for radiation conversion disposed downstream of the optical waveguide device, wherein radiation is emittable from the radiation source via an emission surface and couplable into the optical waveguide device, radiation is couplable from the optical waveguide device into the conversion element via an input surface, and the emission surface of the radiation source is larger than the input surface of the conversion element.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: July 28, 2020
    Assignee: OSRAM OLED GmbH
    Inventor: Stefan Grötsch
  • Patent number: 10586827
    Abstract: An optoelectronic semiconductor component is specified that has a semiconductor chip having a main side, the main side comprising a plurality of emission fields that are arranged next to one another. The emission fields are individually and independently actuatable and, during operation, they are each used to couple radiation out of the semiconductor chip. The main side has reflective partitions mounted on it that are arranged between adjacent emission fields and at least partially surround the emission fields in a plan view of the main side. In addition, the main side has a conversion element mounted on it, having an underside, which faces the semiconductor chip, and an averted top. The partitions are formed from a different material from the semiconductor material of the semiconductor chip and jut out from the semiconductor chip in a direction away from the main side.
    Type: Grant
    Filed: December 2, 2015
    Date of Patent: March 10, 2020
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Britta Göötz, Walter Wegleiter, Stefan Grötsch
  • Patent number: 10582585
    Abstract: A radiation emitting device is disclosed. In an embodiment a radiation emitting device includes a pixelated optoelectronic semiconductor chip configured to emit a first radiation having a first peak wavelength, a conversion element or color control medium configured to convert at least a portion of the first radiation into a second radiation having a second peak wavelength and a color control element including a semiconductor diode configured to absorb a portion of the first and/or second radiation, wherein devise is configured to emit radiation of a first color temperature composed mainly of the first and second radiations when a reverse voltage is applied to the semiconductor diode and to emit radiation of a second color temperature composed mainly of the first and second radiations and a third radiation with a third peak wavelength generated by the absorbed first and/or second radiation in the semiconductor diode when a forward voltage is applied to the semiconductor diode.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: March 3, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Peter Brick, Stefan Grötsch, Stephan Pawlik, Michael Wittmann, Uli Hiller
  • Publication number: 20200060004
    Abstract: A method of operating an optoelectronic component, including a plurality of picture elements and a plurality of temperature sensors, wherein the picture elements are each configured to emit light, and the temperature sensors thermally conductively connect to the picture elements, the method including acquiring temperature values supplied by the temperature sensors; and controlling the picture elements in dependence on the acquired temperature values.
    Type: Application
    Filed: March 9, 2018
    Publication date: February 20, 2020
    Inventors: Thorsten Baumheinrich, Stefan Grötsch
  • Patent number: 10475778
    Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: November 12, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Alexander F. Pfeuffer, Norwin von Malm, Stefan Grötsch, Andreas Plößl
  • Publication number: 20190230763
    Abstract: A radiation emitting device is disclosed. In an embodiment a radiation emitting device includes a pixelated optoelectronic semiconductor chip configured to emit a first radiation having a first peak wavelength, a conversion element or color control medium configured to convert at least a portion of the first radiation into a second radiation having a second peak wavelength and a color control element including a semiconductor diode configured to absorb a portion of the first and/or second radiation, wherein devise is configured to emit radiation of a first color temperature composed mainly of the first and second radiations when a reverse voltage is applied to the semiconductor diode and to emit radiation of a second color temperature composed mainly of the first and second radiations and a third radiation with a third peak wavelength generated by the absorbed first and/or second radiation in the semiconductor diode when a forward voltage is applied to the semiconductor diode.
    Type: Application
    Filed: January 24, 2019
    Publication date: July 25, 2019
    Inventors: Peter Brick, Stefan Grötsch, Stephan Pawlik, Michael Wittmann, Uli Hiller
  • Publication number: 20190207071
    Abstract: A radiation-emitting component includes a radiation source including at least one semiconductor layer sequence that generates radiation; an optical waveguide device disposed downstream of the radiation source; and a conversion element for radiation conversion disposed downstream of the optical waveguide device, wherein radiation is emittable from the radiation source via an emission surface and couplable into the optical waveguide device, radiation is couplable from the optical waveguide device into the conversion element via an input surface, and the emission surface of the radiation source is larger than the input surface of the conversion element.
    Type: Application
    Filed: May 11, 2017
    Publication date: July 4, 2019
    Inventor: Stefan Grötsch
  • Patent number: 10217731
    Abstract: A method produces a plurality of optoelectronic modules, and includes: A) providing a metallic carrier assembly with a plurality of carrier units; B) applying a logic chip, each having at least one integrated circuit, to the carrier units; C) applying emitter regions that generate radiation, which can be individually electrically controlled; D) covering the emitter regions and the logic chips with a protective material; E) overmolding the emitter regions and the logic chips so that a cast body is formed, which joins the carrier units, the logic chips and the emitter regions to one another; F) removing the protective material and applying electrical conductor paths to the upper sides of the logic chips and to a cast body upper side; and G) dividing the carrier assembly into the modules.
    Type: Grant
    Filed: November 30, 2015
    Date of Patent: February 26, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Frank Singer, Thomas Schwarz, Stefan Grötsch
  • Patent number: 10217915
    Abstract: An optoelectronic semiconductor device includes a carrier having a carrier top side, at least one optoelectronic semiconductor chip arranged at the carrier top side and having a radiation main side remote from the carrier top side, at least one bonding wire, at least one covering body on the radiation main side, and at least one reflective potting compound surrounding the semiconductor chip in a lateral direction and extending from the carrier top side at least as far as the radiation main side, wherein the bonding wire is completely covered by the reflective potting compound or completely covered by the reflective potting compound and the covering body, the bonding wire is fixed to the semiconductor chip in an electrical connection region on the radiation main side, and the electrical connection region is free of the covering body and covered partly or completely by the reflective potting compound.
    Type: Grant
    Filed: October 11, 2017
    Date of Patent: February 26, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Johann Ramchen, David Racz, Hans-Christoph Gallmeier, Stefan Grötsch, Simon Jerebic
  • Publication number: 20180261648
    Abstract: An optoelectronic semiconductor component is specified that has a semiconductor chip having a main side, the main side comprising a plurality of emission fields that are arranged next to one another. The emission fields are individually and independently actuatable and, during operation, they are each used to couple radiation out of the semiconductor chip. The main side has reflective partitions mounted on it that are arranged between adjacent emission fields and at least partially surround the emission fields in a plan view of the main side. In addition, the main side has a conversion element mounted on it, having an underside, which faces the semiconductor chip, and an averted top. The partitions are formed from a different material from the semiconductor material of the semiconductor chip and jut out from the semiconductor chip in a direction away from the main side.
    Type: Application
    Filed: December 2, 2015
    Publication date: September 13, 2018
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Britta Göötz, Walter Wegleiter, Stefan Grötsch
  • Publication number: 20180151548
    Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed.
    Type: Application
    Filed: May 24, 2016
    Publication date: May 31, 2018
    Inventors: Alexander F. Pfeuffer, Norwin von Malm, Stefan Grötsch, Andreas Plößl
  • Patent number: 9964270
    Abstract: An optoelectronic semiconductor component and an adaptive headlight are disclosed. In an embodiment an optoelectronic semiconductor component includes a carrier having a carrier top side and a carrier underside, a plurality of active zones, which are fitted at the carrier top side and which are designed for emitting radiation, electrical contact locations at the carrier underside, which are designed for electrically connecting the semiconductor component and a drive unit for electrically addressing the semiconductor component and for electrically driving the active zones, wherein the active zones are fitted in a regular grid at the carrier top side, wherein the grid has a grid pitch, wherein geometrical midpoints of radiation main sides of the active zones lie on grid points of the grid, and wherein a distance between the geometrical midpoints of marginal active zones and a closest edge of the carrier is at most 50% of the grid pitch.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: May 8, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Stefan Grötsch, Norbert Häfner