Abstract: A light-emitting module is specified, comprising at least two light sources disposed on a common carrier. At least one of said light sources includes at least two LED chips. Each light source of the module is followed downstream by an optic body of an optical element, and the optic bodies are suitable for guiding electromagnetic radiation to a light exit surface of the optical element. An optical projection apparatus comprising such a light-emitting module is also specified.

Abstract: The invention relates to an optical projection device. Said optical projection device comprises a plurality of light-emitting diode chips and at least one optical element comprising a light input surface which is associated with at least one of the light-emitting diode chips. The light decoupling surface of the light-emitting diode chip, which is adapted to the refraction index, is optically connected to the light input surface of the associated optical element.

Abstract: An optoelectronic module comprising: at least one light-emitting diode chip arranged on a carrier, and a mounting attachment fastened to the carrier and at least partly covering the light-emitting diode chip, and having a structured top which allows positioning of an optical element.

Abstract: A multicolour LED, in which layers for generating light of different colours are arranged one above the other, is used as the light source in a projector.

Abstract: An optoelectronic module for emitting monochromatic radiation in the visible wavelength range is specified. The module has a plurality of light emitting diode chips which generate UV radiation. The UV radiation is converted into light in the visible range, for example, into green light, by a wavelength converter. The coupling-out of light from the module is optimized by the use of two selectively reflecting and transmitting filters. This module can be used as a light source in a projection apparatus.

Abstract: An optoelectronic semiconductor chip (1) comprises a radiation passage area (3), a contact metallization (2a) applied to the radiation passage area (3), and a first reflective layer sequence (2b) applied to that surface of the contact metallization (2a) which is remote from the radiation passage area (3). An optoelectronic component comprising such a chip is also specified.

Abstract: A light source, such as for a projection system, having a plurality of semiconductor chips and at least two different, electromagnetic-radiation-emitting chip types with different emission spectra, each semiconductor chip having a chip coupling-out area through which radiation is coupled out. Furthermore, the light source has a plurality of primary optical elements, each semiconductor chip being assigned a primary optical element, which in each case has a light input and a light output and reduces the divergence of at least part of the radiation emitted by the semiconductor chip during the operation thereof. The semiconductor chips with the primary optical elements are arranged in at least two groups that are spatially separate from one another, with the result that the groups emit separate light cones during operation of the semiconductor chips. The separate light cones of the groups are superposed by means of a secondary optical arrangement to form a common light cone.

Abstract: An optoelectronic semiconductor module includes a chip carrier, a light emitting semiconductor chip mounted on the chip carrier and a cover element with an at least partly light transmissive cover plate, which is arranged on the side of the semiconductor chip facing away from the chip carrier, and has a frame part, wherein the frame part laterally encloses the semiconductor chip, is joined to the cover plate in a joining-layer free fashion and is joined to the chip carrier on its side remote from the cover plate.

Abstract: A radiation-emitting component includes a semiconductor layer stack having an active region that emits electromagnetic radiation, and at least one surface of the semiconductor layer stack or of an optical element that transmits the electromagnetic radiation wherein the surface has a normal vector, wherein on the at least one surface of the semiconductor layer stack or of the optical element through which the electromagnetic radiation passes, an antireflection layer is arranged such that, for a predetermined wavelength, it has a minimum reflection at a viewing angle relative to the normal vector of the surface at which an increase in a zonal luminous flux of the electromagnetic radiation has approximately a maximum.

Abstract: In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface, and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.

Abstract: A carrier layer (1) for a semiconductor layer sequence comprising an electrical insulation layer (2) containing AlN or a ceramic. Furthermore a method for producing semiconductor chips is described.

Abstract: A pulsed electric operating current that rises during a pulse duration is generated for operating at least one radiation-emitting semiconductor component. For this purpose, in a method for producing a control device for operating the at least one radiation-emitting semiconductor component, a temporal profile of a thermal impedance representative of the at least one radiation-emitting semiconductor component is determined. A profile of the electric operating current that is to be set is determined depending on the determined temporal profile of the thermal impedance. The control device is furthermore designed such that the profile of the operating current that is to be set is set in each case during the pulse duration.

Abstract: At least two semiconductor components emit electromagnetic radiation in different wavelength ranges. The superimposition of these electromagnetic radiations of all semiconductor components has at least one fraction in the visible wavelength range. At least one of the semiconductor components has a luminescence conversion element in the beam path.

Abstract: A light-emitting diode arrangement having at least one light-emitting diode chip (1), each light-emitting diode chip (1) being assigned at least one optical element (4). In addition, the light-emitting diode arrangement has at least one heat-conducting element (13) which is suitable to carry away the heat generated by the light-emitting diode chip, and at least one cooling apparatus which is suitable to carry heat away from the heat-conducting element. The light-emitting diode arrangement is particularly well suited, for example, to use in motor vehicle headlamps.

Abstract: A lens arrangement for an LED display device includes a lens. The lens has a first lens surface and an optical axis. The optical axis penetrates the first lens surface of the lens. Furthermore, the lens arrangement includes a transparent transition body, which is firmly coupled with the lens on the first lens surface, which is more temperature-resistant than the lens and which has an optical axis that is parallel to the optical axis of the lens.

Abstract: An optical element comprising includes a base body containing a base material, and a filling body containing a filling material, wherein the filling body adheres to the base body. A radiation-emitting component and a method for producing an optical element are futhermore described.

Abstract: A light-emitting module is specified that comprises a light source, a carrier for said light source, and an optical element, wherein the optical element comprises dowel pins that engage in corresponding recesses in the carrier. The light-emitting module is particularly well suited for use in optical projection apparatuses and in motor vehicle projection lamps.

Abstract: Disclosed is a lighting device comprising at least one LED and at least one optical element, wherein the LED and the optical element are aligned with each other by means of at least one dowel pin. A method of making such a lighting device is also specified. The described lighting device is particularly well suited for use in a vehicle headlight.

Abstract: A headlight having a multitude of headlight elements, which each have at least one semiconductor chip which emits electromagnetic radiation; a primary optics element, which reduces the divergence of the light which is incident through the light input; and at least one headlight element output, which emits a part of the headlight light from the headlight element. At least some of the headlight element outputs are arranged in at least two groups in such a way that the arrangement of at least one of the groups and/or at least overall arrangement of headlight element outputs of multiple groups corresponds essentially to a desired emission characteristic of the headlight, in that, in particular, it has a shape which corresponds essentially to the cross-sectional shape of a desired headlight beam, wherein the semiconductor chips which belong to the headlight element outputs of one group can each be operated independently of other semiconductor chips.

Abstract: A semiconductor device comprising a semiconductor component, particularly a power laser diode bar, disposed on a cooling element, wherein the cooling element contains in its interior a cooling channel for conducting a coolant. The coolant channel comprises in at least one region microstructures for effective heat transfer to the coolant. The semiconductor component substantially completely overlaps the region of the cooling channel comprising the microstructures. Disposed between the semiconductor component and the cooling element is an intermediate support so arranged and configured that it compensates for mechanical stresses between the semiconductor component and the cooling element occurring as a result of differing thermal expansions of the semiconductor component and the cooling element. The material of the cooling element particularly preferably has a high modulus of elasticity such that the compensation takes place substantially within the elastic strain regime.