Patents by Inventor Stefan Gruber

Stefan Gruber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8237192
    Abstract: A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: August 7, 2012
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Joerg Erich Sorg, Stefan Gruber, Georg Bogner
  • Publication number: 20120190140
    Abstract: A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side and which are fixed by their rear side—opposite the front side—on a first main face of a common carrier body, wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.
    Type: Application
    Filed: April 5, 2012
    Publication date: July 26, 2012
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Jörg Erich SORG, Stefan Gruber, Siegfried Herrmann, Berthold Hahn
  • Patent number: 8154040
    Abstract: A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side (101) and which are fixed by their rear side (102)—opposite the front side—on a first main face (201) of a common carrier body (2), wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack (1) and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: April 10, 2012
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Jörg Erich Sorg, Stefan Gruber, Siegfried Herrmann, Berthold Hahn
  • Publication number: 20120056235
    Abstract: An optoelectronic module includes a radiation-emitting semiconductor component, an electrical component and a carrier substrate. The carrier substrate includes a top and a bottom, wherein first electrical connections are arranged on the bottom and second electrical connections are arranged on the top. The electrical component is arranged on the top of the carrier substrate and is electrically conductively connected with the first electrical connections. The radiation-emitting semiconductor component is arranged on the side of the electrical component remote from the carrier substrate. The radiation-emitting semiconductor component furthermore includes conductive structures electrically conductively connected with the second electrical connections.
    Type: Application
    Filed: April 28, 2010
    Publication date: March 8, 2012
    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Georg Bogner, Stefan Gruber
  • Publication number: 20110266571
    Abstract: According to at least one embodiment of the semiconductor arrangement, the latter comprises a mounting side, at least one optoelectronic semiconductor chip with mutually opposing chip top and bottom, and at least one at least partially radiation-transmissive body with a body bottom, on which the semiconductor chip is mounted such that the chip top faces the body bottom. Moreover, the semiconductor arrangement comprises at least two electrical connection points for electrical contacting of the optoelectronic semiconductor chip, wherein the connection points do not project laterally beyond the body and with their side remote from the semiconductor chip delimit the semiconductor arrangement on the mounting side thereof.
    Type: Application
    Filed: April 20, 2009
    Publication date: November 3, 2011
    Inventors: Thomas Zeiler, Reiner Windisch, Stefan Gruber, Markus Kirsch, Julius Muschaweck, Torsten Baade, Herbert Brunner, Steffen Köhler
  • Patent number: 8026526
    Abstract: An optoelectronic semiconductor component includes a basic body, at least one semiconductor chip arranged thereon, and an encapsulation embedding the at least one semiconductor chip and composed of a radiation-transmissive material with scattering particles. A radiation-transmissive covering layer with an absorber is applied to the encapsulation.
    Type: Grant
    Filed: June 4, 2009
    Date of Patent: September 27, 2011
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Sven Weber-Rabsilber, Stefan Gruber
  • Publication number: 20110188846
    Abstract: A luminous unit (1) for an optical recording device (13) comprising a light source (2) for generating radiation and a partly reflective element, which is disposed downstream of the light source (2) in a main emission direction (H) and subdivides a space into a first half-space facing the light source (2) and a second half-space remote from the light source (2), wherein the partly reflective element at least partly transmits the radiation coming from the light source (2) from the first half-space and at least partly reflects the external radiation coming from an opposite direction from the second half-space.
    Type: Application
    Filed: April 16, 2009
    Publication date: August 4, 2011
    Applicant: Osram Opto Semiconductors GmbH
    Inventors: Joerg Erich Sorg, Stefan Gruber
  • Publication number: 20110162613
    Abstract: An internal combustion engine has a crankcase, a crankshaft, a cylinder block, and cylinder head assembly. The cylinder block has at least one cylinder. At least one piston is disposed in the at least one cylinder. The at least one piston is operatively connected to the crankshaft. An oil tank enclosure is connected to at least one of the crankcase outer wall and the cylinder block outer wall. The oil tank enclosure and the at least one of the crankcase outer wall and the cylinder block outer wall together form an oil tank. The arrangement of the oil inlet, oil outlet, and blow-by gas outlet in an oil tank; an oil tank having an angled portion for separating blow-by gases from oil; and an arrangement of a blow-by gas passage connected to an oil tank are also described.
    Type: Application
    Filed: June 27, 2008
    Publication date: July 7, 2011
    Applicant: BRP-POWERTRAIN GMBH & CO KG
    Inventors: Markus Schiffer, Michael Simmer, Markus Hochmayr, Stefan Gruber, Manuel Gruber, Josef Burgstaller, Clemens Hubauer, Peter Junkowitsch, Marc Renner
  • Publication number: 20110121336
    Abstract: The invention relates to an arrangement comprising at least one optoelectronic semiconductor component (101), said arrangement comprising a carrier element arrangement (108) suitable for carrying the at least one optoelectronic semiconductor component. The arrangement comprises a housing body (103) consisting of a light-absorbent plastic material, which is arranged on the carrier element arrangement. The housing body comprises a raised area (104) and a set-back area (105) between which an inclined flank (115) is formed. The set-back area extends up to the optoelectronic semiconductor component, in order to reduce reflections.
    Type: Application
    Filed: November 19, 2008
    Publication date: May 26, 2011
    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Georg Bogner, Stefan Gruber, Michael Zitzlsperger
  • Publication number: 20110057218
    Abstract: A semiconductor based component with radiation-emitting properties. A glass substrate (1) is provided, which has a first surface (2) and a second surface (1), where a semiconductor element (5) with radiation-emitting properties is accommodated on the first surface (2). Also disclosed is a method for fabricating a semiconductor based component, with the following steps: providing a glass substrate (1), application of a semiconductor element (5) to the first surface (2) of the glass substrate. Also disclosed is a receptacle for a semiconductor based component in which two electrical contact areas (13) are provided, which can be electrically connected to contact areas (7) of the semiconductor based component.
    Type: Application
    Filed: September 12, 2008
    Publication date: March 10, 2011
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Jörg Sorg, Stefan Gruber
  • Publication number: 20110002587
    Abstract: A plastic housing is arranged on a carrier element and is provided with a recess in which an optoelectronic component is arranged. On the side facing away from the carrier element, the recess has an opening to the outside which can be provided with a transparent cover. One or more structures can be provided on the plastic housing in order to orient the cover and/or optical components relative to the optoelectronic component.
    Type: Application
    Filed: January 9, 2008
    Publication date: January 6, 2011
    Inventors: Georg Bogner, Stefan Gruber, Thomas Zeiler, Markus Kirsch
  • Publication number: 20100270578
    Abstract: A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.
    Type: Application
    Filed: December 9, 2008
    Publication date: October 28, 2010
    Inventors: Joerg Erich Sorg, Stefan Gruber, Georg Bogner
  • Publication number: 20100193819
    Abstract: A light-emitting surface element includes a connection device, a light-generating element having at least two electrical connections electrically conductively connected to assigned connection lines on the connection device, and at least one planar light-guiding element formed by injection-molding in a manner at least partly embedding an arrangement composed of connection device and light-generating element in the planar light-guiding element.
    Type: Application
    Filed: September 26, 2008
    Publication date: August 5, 2010
    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Jorg E. Sorg, Stefan Gruber
  • Publication number: 20100103650
    Abstract: An arrangement includes a semiconductor chip, which is designed to emit light during operation, and a cover layer, which lies across from the light-emitting surface of the semiconductor chip, such that light emitted from the semiconductor chip penetrates into the cover layer. In an area of the cover layer, overlapping with the chip, a light deflecting structure is provided by means of which light penetrating into the cover layer is deflected. The cover layer acts as an optical waveguide and is designed to emit the light such that it is distributed over the upper surface of cover layer.
    Type: Application
    Filed: January 23, 2008
    Publication date: April 29, 2010
    Inventors: Siegfried Herrmann, Berthold Hahn, Joerg Sorg, Stefan Gruber
  • Publication number: 20100012955
    Abstract: A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side (101) and which are fixed by their rear side (102)—opposite the front side—on a first main face (201) of a common carrier body (2), wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack (1) and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.
    Type: Application
    Filed: September 25, 2007
    Publication date: January 21, 2010
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Jörg Erich Sorg, Stefan Gruber, Siegfried Hermann, Berthold Hahn
  • Publication number: 20090297090
    Abstract: An illumination unit comprising a luminescence diode chip mounted on a chip carrier and comprising an optical waveguide is specified. The optical waveguide is joined together from at least two separate parts, wherein the luminescence diode chip is encapsulated by one of the parts of the optical waveguide. A method for producing a luminescence diode chip of this type and also an LCD display comprising an illumination unit of this type are furthermore specified.
    Type: Application
    Filed: September 22, 2006
    Publication date: December 3, 2009
    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Georg Bogner, Herbert Brunner, Stefan Gruber
  • Publication number: 20090267107
    Abstract: An optoelectronic semiconductor component includes a basic body, at least one semiconductor chip arranged thereon, and an encapsulation embedding the at least one semiconductor chip and composed of a radiation-transmissive material with scattering particles. A radiation-transmissive covering layer with an absorber is applied to the encapsulation.
    Type: Application
    Filed: June 4, 2009
    Publication date: October 29, 2009
    Inventors: Sven Weber-Rabsilber, Stefan Gruber
  • Patent number: 7550827
    Abstract: Disclosed is a leadframe lot at least one electronic component, composing at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining parallel offset between the retention tab and the adjacent region of the lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.
    Type: Grant
    Filed: August 8, 2005
    Date of Patent: June 23, 2009
    Assignee: Osram Opto Semiconductor GmbH
    Inventors: Karlheinz Arndt, Huey Ling Rena Lim, Georg Bogner, Stefan Gruber, Markus Schneider
  • Publication number: 20080283322
    Abstract: A power transmission wheel having a hub and a rim is disclosed. The hub has a central annular portion for operatively engaging a power transmitting shaft. The rim has an inner annular portion and an outer annular portion for operatively engaging a flexible power transmitting element. The central annular portion is disposed inside the inner annular portion with a rolling-element bearing therebetween. At least one hub blade is disposed radially between the inner and outer annular portions. At least one rim blade extends radially from one of the inner and outer annular portions towards the other of the inner and outer annular portions. The power transmission wheel has at least two elastomeric dampers. Each damper is interposed between one of the at least one hub blade and one of the at least one rim blade. An engine and vehicles using the power transmission wheels are also disclosed.
    Type: Application
    Filed: December 6, 2007
    Publication date: November 20, 2008
    Applicant: BRP-ROTAX GMBH & CO. KG
    Inventors: Stefan GRUBER, Christian BERGER, Norbert KORENJAK, Wolfgang SCHRENK, Thomas WEINZIERL, Johann WICKENHAUSER
  • Publication number: 20080251900
    Abstract: Disclosed is a leadframe for at least one electronic component, comprising at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining a parallel offset between the retention tab and the adjacent region of lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.
    Type: Application
    Filed: August 8, 2005
    Publication date: October 16, 2008
    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Karlheinz Arndt, Huey Ling Rena Lim, Georg Bogner, Stefan Gruber, Markus Schneider