Abstract: A control assembly for a six-phase electric machine divided into two three-phase windings includes two three-phase inverters, each of which controls one of the three-phase windings. Each inverter has a circuit assembly with power semiconductors of different types, and/or different materials, and or different surface areas, and windings of the same phase in the inverter are wound onto the same cog and galvanically insulated from one another.

Abstract: A method is provided for controlling virtual units in a virtual scene at a computing device. The method includes, in response to receiving a first user input, displaying, on a display device, a first user interface (UI) that includes a plurality of command elements, the plurality of command elements comprising a union set of virtual unit actions performable by each user controllable virtual unit available to a user in the virtual scene. The method also includes receiving a second user input indicating a selection of a command element among the plurality of command elements in the first UI. The method further includes controlling one or more virtual units in the virtual scene to execute an action corresponding to the selected command element, the one or more virtual units being selected according to the first user input.

Abstract: A power electronics module includes first and second printed circuit boards, each having an upper and lower layer made of an electrically conductive material and a middle layer made of a non-conductive material, a high-side assembly having a power semiconductor forming a high-side switch, and a low-side assembly having a power semiconductor forming a low-side switch, wherein the first printed circuit board is placed opposite the second printed circuit board such that the upper layers face one another, wherein the upper layer of the first printed circuit board forms an AC-phase connection, and wherein the upper layer of the second printed circuit board forms a DC? and DC+ connection, and AC connections of the power semiconductors point toward and contact the upper layer of the first printed circuit board, and the DC connections for the power semiconductors point toward and contact the upper layer of the second printed circuit board.

Abstract: A method is provided for implementing an automated worker system. The method includes generating, at a first location in a virtual scene, a first set of virtual units of a user in the virtual scene, each of the first set of virtual units being configured to automatically collect at least one resource associated with the first location. The method further includes accumulating, for the user, the at least one resource collected by the first set of virtual units based on a number of the virtual units in the first set of virtual units and resource collection rates of the virtual units in the first set of virtual units. This allows players to focus on more exciting portions of an RTS game rather than perform repetitive and tedious tasks involved with controlling resource gathering units and resource management.

Abstract: A method is provided for indicating build element availability for users. The method includes in response to a determination to display a build element availability status information, displaying, to the first user, the build element availability status information indicating a second set of build elements selected by a second user and which of the second set of build elements is currently available to be built in a virtual scene by the second user, wherein each of the second set of build elements represents the corresponding virtual object of a different type that is controllable by the second user in the virtual scene when a corresponding virtual object of the respective build element is built by the second user.

Abstract: A method is provided for generating virtual objects in a virtual scene at a computing device. The method includes, obtaining a first selection of one or more first-level virtual object types for a first group in a deck-building interface. The method also includes obtaining a second selection of one or more second-level virtual object types for a second group in the deck-building interface, wherein the first selection and the second selection are based on user input. The method further includes in response to a determination that a deck in the deck-building interface is complete based on the obtained first selection and second selection, displaying a user interface (UI) for the user to generate and control the selected first-level virtual object types and the selected second-level virtual object types in real time in the virtual scene.

Abstract: A contact assembly for power semiconductor chips has a substrate, at least two power semiconductor chips with a first terminal on the substrate such that they are electrically connected, and at least one contact region facing outward from the substrate, with the same type of terminal for connecting to the power semiconductor, a contact component in the form of a conductive metal film, which is at least partially coated with an insulating layer, which has holes exposing the metal film for terminals for the power semiconductor chips, and wherein at least part of the metal film protrudes from the insulating layer and is connected to a dedicated contact region on the substrate in order to connect to identical types of terminals for the power semiconductor chips.

Abstract: A half-bridge arrangement includes an AC tap, DC taps, and a half-bridge including first and second topological switches formed from switch modules having semiconductor switches, each switch module having a flat top side with a cooling connection surface and an opposite underside, and side regions. A first current connection lug and signal pin project at first side regions of each switch module, and a second current connection lug projects at second side regions opposite the first side region. The switch modules are stacked so that current connection lugs of a first side region and a second side region lie one above another. Signal pin free ends point in the same direction, and the second current connection lug a switch module is provided along a partial region of the second side region and the signal pins of the other switch module are next to the second current connection lug.

Abstract: A method is provided for generating virtual units in a virtual scene at a computing device. The method includes displaying, on a display device, a user interface (UI) that includes a plurality of build elements comprising a first set of build elements corresponding to generating virtual units available to a user and a second set of build elements corresponding to generating or upgrading virtual objects available to the user. The plurality of build elements in the UI may include a union set of all virtual unit generation, build, and upgrade actions available to the user. The method also includes receiving a user input indicating a selection of a build element among the plurality of build elements in the UI. The method further generating a virtual unit, generating a virtual object, or upgrading an existing virtual object in the virtual scene according to the selection of the build element.

Abstract: The invention relates to a smoothing device (100, 200) for smoothing a structural concrete component (1), comprising a primary cutting edge (104, 204, 204?, 204?, 204??) for separating a concrete layer from the structural concrete component, an axis of rotation (102, 202), and a smoothing surface (106, 206) aligned orthogonally to the axis of rotation (102, 202) for surface contacting of a cut surface of the structural concrete component (1) formed by the separation.

Abstract: A control apparatus for operating an electric drive for a vehicle may include one or more of the following: a plurality of power module, which has one or more power semiconductors; an intermediate circuit capacitor, which is connected in parallel to the power module; a cooler for dissipating heat generated by the power module; an interconnect device for obtaining electrical contact to the power module, where the interconnect device has a first section and a second section at an angle to the first section, and where the first section and the second section are each perpendicular to a main plane of the power module.

Abstract: A power module for operating an electric vehicle drive may include one or more of the following: a plurality of semiconductor components; an intermediate circuit capacitor connected in parallel to the semiconductor components; a heatsink for the removal of heat generated by the semiconductor components, where the heatsink is located between the semiconductor components and the intermediate circuit capacitor; and an intermediate circuit line that electrically connects the intermediate circuit capacitor to the semiconductor components. The intermediate circuit line may extend perpendicular to a direction of flow for the coolant in the heatsink on a side of the semiconductor components facing away from the heatsink.

Abstract: Method for measuring an operating temperature of a power module (10) that is used for operating an electric vehicle drive, the power module (10) comprising a plurality of semiconductor switching elements (14) and drive electronics (16), wherein the semiconductor switching elements (14) can be switched by the drive electronics (16) in such a way that the semiconductor switching elements (14) allow or interrupt a drain-source current in order to convert the direct current fed into the power module (10) at the input side into an output-side alternating current, wherein the method comprises measurement of a voltage present at a point located on a side of a diode (22) that is connected in series with the semiconductor switching element (14) and that faces away from the semiconductor switching element (14), wherein the method comprises measurement of a drain-source current of the semiconductor switching element (14) that is generated by a current source (18), wherein the method comprises determination of a mathemat

Abstract: A power electronics module, having a DBC PCB having power semiconductors arranged thereon, and a multilayered leadframe including at least two separate subframes. No power or control routing takes place on the PCB. A region of the load source subregion is arranged between the PCB and the gate source and kelvin source subregion and is in electrical contact with the power semiconductors, and an adjoining region is located outside the PCB. A region of the drain source subregion is in electrical contact with a drain terminal on the PCB, and an adjoining region is located outside the PCB. The gate source subregion and the kelvin source subregion have a region above the load source subregion at which said subregions are in electrical contact with the power semiconductors and have an adjoining region outside the PCB which is opposite the drain source subregion and has pins bent above the PCB.

Abstract: A power electronics module, having a PCB having power semiconductors arranged on connecting regions of an uppermost layer of said PCB, wherein the PCB has a preset dimension to arrange a preset maximum number of power semiconductors thereon. A lead frame arranged above the power semiconductors provides three-dimensional power and control routing, and includes a drain-source connection to connect to a drain-source contact of the PCB, and a load-source connection opposite the drain-source connection via the power semiconductors that is formed from a plurality of subregions, each of which can be brought into electrical contact with the power semiconductors, and a gate- and kelvin-source terminal, which are arranged above the load-source connection and have been brought into electrical contact with the power semiconductors. At least one dummy chip consisting of an electrically nonconductive material is arranged on each of the connecting regions that are not populated by power semiconductors.

Abstract: A method for manufacturing a terminal apparatus for connecting a component for an electrical module includes bending a pre-machined sheet metal element, having a first electric terminal device for connecting to a first potential, a control terminal having a control contact, and a second electric terminal device arranged between the first electric terminal device and the control terminal and separated from the first electric terminal device by a gap, and for connecting to a second electrical potential, further having a path section including a first path for contact-connection with a terminal for the second electrical potential of the component, and a second path arranged in parallel with the first, and wherein an edge region of the sheet metal is bent such that the first electric terminal device and the path section are brought together such that the first electric terminal device and the path section overlap.

Abstract: A power module for a current converter for an electric drive of a motor vehicle comprises a termination substrate having electrical contact portions that are electrically isolated from one another, a plurality of power semiconductor elements arranged on the termination substrate, each having a first terminal, a second terminal, and a control terminal, the first terminals of all the power semiconductor elements being electrically connected to a first contact portion of the termination substrate.

Abstract: A method for manufacturing a terminal apparatus for connecting at least one electrical or electronica component for an electrical or electronic module includes bending a pre-machined sheet metal element, having a first electric terminal device for connecting to a first electrical potential, a control terminal having at least one control contact, and a second electric terminal device arranged between the first electric terminal device and the control terminal for connecting to a second electrical potential, wherein the second electric terminal device has a path section including a first path for contact-connection with a terminal for the second electrical potential of the electrical or electronic component, and at least one second path arranged in parallel with the first path, and wherein a first bending section of the first path is bent into a lower plane than a second bending section of the second path in order to form the terminal apparatus.

Abstract: The invention relates to a topological semiconductor switch for power electronics that has at least two power semiconductors, in particular power transistors, characterized in that the topological semiconductor switch has at least one first power semiconductor containing a first semiconductor material, and at least one second power semiconductor containing a second semiconductor material. The invention also relates to a motor vehicle.

Abstract: A switch module for an inverter includes a high-side switch and a low-side switch, each of which has at least one semiconductor switch, wherein the semiconductor switches are attached to a flat substrate; a DC input connection with a positive DC input contact and a negative DC input contact; an AC output connection for outputting an AC phase current of a multi-phase AC output, which is generated by activating the high-side switch and low-side switch on the basis of the DC input; a micro-heat sink that has a coolant intake, a coolant outlet, and a connecting cooling channel structure between the coolant intake and the coolant outlet; wherein the micro-heat sink is designed such that numerous micro-heat sinks, each of which are dedicated to one of numerous switch modules in the inverter, can be releasably connected to one another for fluid exchange at their respective coolant intake and/or coolant outlet.