Abstract: The invention relates to a method for the operational analysis of an engine and/or for calibrating a controller of the engine, in particular an internal combustion engine, wherein run-up occurs of test points defined by values of a plurality of predetermined operating parameters and selected from a multidimensional test space using a statistical experiment design, whereby at least one operating parameter is in each case changed from one test point to the next test point in a plurality of steps in the run-up of the test points, wherein operational measurements are performed at measurement points resulting from a respective increment and at the actual test points, whereby measurement data from the operational measurements for the analysis and calibration of the controller are output and continuously stored, as well as a corresponding system.

Abstract: A permanent resist, such as TMMF, is used when patterning conductive material on a substrate, enabling lines that have a higher line-to-space ratio (L/S) or a higher aspect ratio (T/L) or both. Pattern density can thus be increased, allowing for improved performance (e.g., greater efficiency, in the case of transformer coil patterning) and greater heat dissipation. As examples, the permanent-resist-based patterning fabrication methods can be used to create transformer coils within an integrated circuit (IC) module, or a routable lead frame for one or more IC dies.

Abstract: In some examples, a circuit includes a resistor network, a filter, a current generator, and a capacitor. The resistor network has a resistor network output and is adapted to be coupled between a switch terminal of a power converter (104) and a ground terminal. The filter has a filter input and a filter output, the filter input coupled to the resistor network output. The current generator has a current generator output and first and second current generator inputs, the first current generator input configured to receive an input voltage and the second current generator input coupled to the filter output. The capacitor is coupled between the current generator output and the ground terminal.

Abstract: In some examples, a circuit comprises a first field effect transistor (FET) having a first gate adapted to couple to a reference voltage source, a first source coupled to a first current source, and a first drain coupled to a second current source. The circuit comprises a second FET having a second gate coupled to the first drain, a second drain coupled to the first current source, and a second source coupled to a first resistor. The circuit comprises a third FET having a third gate adapted to couple to a feedback loop of a voltage converter, a third source coupled to a third current source, and a third drain coupled to a fourth current source. The circuit comprises a fourth FET having a fourth gate coupled to the third drain, a fourth drain coupled to the third current source, and a fourth source coupled to a second resistor.

Abstract: A method includes performing a non-screen printing process that deposits solder on a lead frame or on conductive features of a semiconductor die or wafer, or on or in a conductive via of a laminate structure. The method further comprises engaging the semiconductor die to the lead frame, performing a thermal process that reflows the solder, performing a molding process that forms a package structure which encloses the semiconductor die and a portion of the lead frame, and separating a packaged electronic device from a remaining portion of the lead frame.

Abstract: A semiconductor device with an isolation structure and a trench capacitor, each formed using a single resist mask for etching corresponding first and second trenches of different widths and different depths, with dielectric liners formed on the trench sidewalls and polysilicon filling the trenches and deep doped regions surrounding the trenches, including conductive features of a metallization structure that connect the polysilicon of the isolation structure trench to the deep doped region to form an isolation structure.

Abstract: A voltage regulation circuit includes a switching output terminal, a high-side output transistor, a low-side output transistor, a high-side replica transistor, a low-side replica transistor, and a comparator circuit. The high-side output transistor is configured to drive the switching output terminal. The low-side output transistor is configured to drive the switching output terminal. The high-side replica transistor is coupled to the high-side output transistor. The low-side replica transistor is coupled to the high-side replica transistor and the low-side output transistor. The comparator circuit is coupled to the high-side replica transistor and the low-side replica transistor, and is configured to compare a signal received from both the high-side replica transistor and the low-side replica transistor to a ramp signal.

Abstract: An integrated circuit comprising: a source comprising an output port; a set of serially-connected resistors electrically coupled to the output port of the source; a comparator comprising a first input port, a second input port, and an output port; a set of switches, each switch in the set of switches comprising a first terminal electrically coupled to the first input port of the comparator, and a second terminal electrically coupled to the set of serially-connected resistors; a current source comprising an output port electrically coupled to the second input port of the comparator; and a pin electrically coupled to the output port of the current source.

Abstract: A voltage regulation circuit includes a switching output terminal, a high-side output transistor, a low-side output transistor, a high-side replica transistor, a low-side replica transistor, and a comparator circuit. The high-side output transistor is configured to drive the switching output terminal. The low-side output transistor is configured to drive the switching output terminal. The high-side replica transistor is coupled to the high-side output transistor. The low-side replica transistor is coupled to the high-side replica transistor and the low-side output transistor. The comparator circuit is coupled to the high-side replica transistor and the low-side replica transistor, and is configured to compare a signal received from both the high-side replica transistor and the low-side replica transistor to a ramp signal.

Abstract: A voltage regulation circuit includes a switching output terminal, a high-side output transistor, a low-side output transistor, a high-side replica transistor, a low-side replica transistor, and a comparator circuit. The high-side output transistor is configured to drive the switching output terminal. The low-side output transistor is configured to drive the switching output terminal. The high-side replica transistor is coupled to the high-side output transistor. The low-side replica transistor is coupled to the high-side replica transistor and the low-side output transistor. The comparator circuit is coupled to the high-side replica transistor and the low-side replica transistor, and is configured to compare a signal received from both the high-side replica transistor and the low-side replica transistor to a ramp signal.

Abstract: An electrical system includes: 1) a buck converter; 2) a battery coupled to an input of the buck converter; and 3) a load coupled to an output of the buck converter. The buck converter includes a high-side switch, a low-side switch, and regulation loop circuitry coupled to the high-side switch and the low-side switch. The regulation loop circuitry includes a comparator with preamplifier gain adjustment circuitry configured to adjust a preamplifier gain of the comparator based on an overdrive voltage.

Abstract: A semiconductor die includes a substrate and an integrated circuit provided on the substrate and having contacts. An electrically conductive layer is provided on the integrated circuit and defines electrically conductive elements electrically connected to the contacts. Electrically conductive interconnects coupled with respective electrically conductive elements. The electrically conductive interconnects have at least one of different sizes or shapes from one another.

Abstract: A semiconductor device with an isolation structure and a trench capacitor, each formed using a single resist mask for etching corresponding first and second trenches of different widths and different depths, with dielectric liners formed on the trench sidewalls and polysilicon filling the trenches and deep doped regions surrounding the trenches, including conductive features of a metallization structure that connect the polysilicon of the isolation structure trench to the deep doped region to form an isolation structure.

Abstract: A semiconductor die includes a substrate and an integrated circuit provided on the substrate and having contacts. An electrically conductive layer is provided on the integrated circuit and defines electrically conductive elements electrically connected to the contacts. Electrically conductive interconnects coupled with respective electrically conductive elements. The electrically conductive interconnects have at least one of different sizes or shapes from one another.

Abstract: A semiconductor device with an isolation structure and a trench capacitor, each formed using a single resist mask for etching corresponding first and second trenches of different widths and different depths, with dielectric liners formed on the trench sidewalls and polysilicon filling the trenches and deep doped regions surrounding the trenches, including conductive features of a metallization structure that connect the polysilicon of the isolation structure trench to the deep doped region to form an isolation structure.

Abstract: A semiconductor die includes a substrate and an integrated circuit provided on the substrate and having contacts. An electrically conductive layer is provided on the integrated circuit and defines electrically conductive elements electrically connected to the contacts. Electrically conductive interconnects coupled with respective electrically conductive elements. The electrically conductive interconnects have at least one of different sizes or shapes from one another.

Abstract: A semiconductor device with an isolation structure and a trench capacitor, each formed using a single resist mask for etching corresponding first and second trenches of different widths and different depths, with dielectric liners formed on the trench sidewalls and polysilicon filling the trenches and deep doped regions surrounding the trenches, including conductive features of a metallization structure that connect the polysilicon of the isolation structure trench to the deep doped region to form an isolation structure.

Abstract: An electrical system includes: 1) a buck converter; 2) a battery coupled to an input of the buck converter; and 3) a load coupled to an output of the buck converter. The buck converter includes a high-side switch, a low-side switch, and regulation loop circuitry coupled to the high-side switch and the low-side switch. The regulation loop circuitry includes a comparator with preamplifier gain adjustment circuitry configured to adjust a preamplifier gain of the comparator based on an overdrive voltage.

Abstract: A system comprises a DC-to-DC voltage converter, the DC-to-DC voltage converter comprising: a high-side FET comprising a gate, a source, and a drain; a node coupled to the source of the high-side FET; a low-side FET comprising a gate, a source, and a drain coupled to the node; and a controller coupled to the gate of the high-side FET to switch on and off the high-side FET, and coupled to the gate of the low-side FET to switch on and off the low-side FET, the controller configured to switch on the low-side FET for a time interval before switching on the high-side FET and to switch off the low-side FET before switching on the high-side FET.

Abstract: A system comprises a DC-to-DC voltage converter, the DC-to-DC voltage converter comprising: a high-side FET comprising a gate, a source, and a drain; a node coupled to the source of the high-side FET; a low-side FET comprising a gate, a source, and a drain coupled to the node; and a controller coupled to the gate of the high-side FET to switch on and off the high-side FET, and coupled to the gate of the low-side FET to switch on and off the low-side FET, the controller configured to switch on the low-side FET for a time interval before switching on the high-side FET and to switch off the low-side FET before switching on the high-side FET.