Abstract: Process and apparatus for joining at least two elements, in particular an electronic component such as an LED with a substrate, such as a PCB. An imaging means divides a light beam into a plurality of partial light beams and images these partial light beams, forming a plurality of discrete light spots, which form a plurality of discrete material joining portions. The light beam is divided using a diffractive optical element (DOE) also enabling a beam shaping and beam processing. A plurality of material joining portions can be formed simultaneously enabling a high process rate. The method is suited for laser soldering of components, which are not exposed to high thermal loads, e.g. for forming electrical contacting portions of LEDs. These discrete light spots can also be used for material processing, in particular for simultaneously forming a plurality of preweakened material zones or perforations in a substrate.